Patents by Inventor Pin-Hsiang Chiu

Pin-Hsiang Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240042486
    Abstract: An ultrasonic transducer device includes a first electrode, an insulating layer, an oscillating membrane, a second electrode, and a third electrode. The insulating layer is disposed on the first electrode. The oscillating membrane is disposed over the insulating layer. A cavity is between the oscillating membrane and the insulating layer. The second electrode is disposed on the oscillating membrane. The third electrode is disposed in the cavity and has a plurality of first electrode openings overlapping the second electrode. The second electrode and the third electrode are each located at different sides of the oscillating membrane.
    Type: Application
    Filed: December 6, 2022
    Publication date: February 8, 2024
    Applicant: AUO Corporation
    Inventors: Zhen Wah Chew, Zheng-Han Chen, Pin-Hsiang Chiu, Tai-Hsiang Huang
  • Patent number: 11329108
    Abstract: A display device and a manufacturing method thereof are provided. The display device includes a first substrate, a second substrate, first signal lines, second signal lines, a first insulation layer, active components, a display medium, and ultrasonic transducers. The first insulation layer is located between the first signal lines and the second signal lines. Cavities are located in the first insulation layer having thin films located on the cavities. Each of the ultrasonic transducers includes first and second electrodes. A first electrode and a corresponding first signal line belong to a same layer and are electrically connected with each other. A second electrode and a corresponding second signal line belong to a same layer and are electrically connected with each other. A corresponding cavity and a corresponding thin film are sandwiched between the first and second electrodes.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: May 10, 2022
    Assignee: Au Optronics Corporation
    Inventors: Wen-Yuan Li, Tai-Hsiang Huang, Pin-Hsiang Chiu, Zheng-Han Chen
  • Publication number: 20210151525
    Abstract: A display device and a manufacturing method thereof are provided. The display device includes a firs substrate, a second substrate, first signal lines, second signal lines, a first insulation layer, active components, a display medium, and ultrasonic transducers. The first insulation layer is located between the first signal lines and the second signal lines. Cavities are located in the first insulation layer having thin films located on the cavities. Each of the ultrasonic transducers includes first and second electrodes. A first electrode and a corresponding first signal line belong to a same layer and are electrically connected with each other. A second electrode and a corresponding second signal line belong to a same layer and are electrically connected with each other. A corresponding cavity and a corresponding thin film are sandwiched between the first and second electrodes.
    Type: Application
    Filed: April 9, 2020
    Publication date: May 20, 2021
    Applicant: Au Optronics Corporation
    Inventors: Wen-Yuan Li, Tai-Hsiang Huang, Pin-Hsiang Chiu, Zheng-Han Chen
  • Patent number: 8773625
    Abstract: A method of manufacturing a flexible substrate structure includes the following steps. A first loading substrate having a center area and a peripheral area is provided. A first adhesive layer is formed on the center area of the first loading substrate, and a second adhesive layer is formed on the peripheral area of the first loading substrate. The first flexible substrate is adhered to the first loading substrate by the first adhesive layer and the second adhesive layer to form a flexible substrate structure, wherein the adhesive force between the first flexible substrate and the second adhesive layer is stronger than that between the first flexible substrate and the first adhesive layer. The flexible substrate structure is cut, and the first flexible substrate is separated from the flexible substrate structure.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: July 8, 2014
    Assignee: AU Optronics Corp.
    Inventors: Wen-Yuan Li, Pin-Hsiang Chiu, Yu-Chieh Hsueh, Li-Yin Chen, Min-Chih Wei, Shiuan-Iou Lin
  • Publication number: 20140043578
    Abstract: A display device includes a first flexible substrate, a second flexible substrate and a patterned sealant. The patterned sealant is disposed between the first flexible substrate and the second flexible substrate. The patterned sealant includes a hollow rectangular pattern, which is disposed in a peripheral region of the first flexible substrate, and has a rectangular opening corresponding to an active region of the first flexible substrate. The rectangular opening has a long side parallel to a first direction and a short side parallel to a second direction, and the long side has a long side length x1 and the short side has a short side length y1. The hollow rectangular pattern has a first width x2 in the first direction, and a second width y2 in the second direction, wherein y2?x2, y1?x1 and 10?y1/y2?90.
    Type: Application
    Filed: June 18, 2013
    Publication date: February 13, 2014
    Inventors: Shiuan-Iou Lin, Pin-Hsiang Chiu, Wen-Yuan Li, Tai-Hsiang Huang
  • Publication number: 20130077033
    Abstract: A method of manufacturing a flexible substrate structure includes the following steps. A first loading substrate having a center area and a peripheral area is provided. A first adhesive layer is formed on the center area of the first loading substrate, and a second adhesive layer is formed on the peripheral area of the first loading substrate. The first flexible substrate is adhered to the first loading substrate by the first adhesive layer and the second adhesive layer to form a flexible substrate structure, wherein the adhesive force between the first flexible substrate and the second adhesive layer is stronger than that between the first flexible substrate and the first adhesive layer. The flexible substrate structure is cut, and the first flexible substrate is separated from the flexible substrate structure.
    Type: Application
    Filed: May 23, 2012
    Publication date: March 28, 2013
    Inventors: Wen-Yuan Li, Pin-Hsiang Chiu, Yu-Chieh Hsueh, Li-Yin Chen, Min-Chih Wei, Shiuan-Iou Lin