Patents by Inventor PIN-HSIEN SUNG

PIN-HSIEN SUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180036861
    Abstract: The present invention relates to a polishing pad with improved slurry retention capacity, which includes a polishing layer. The polishing layer includes an elastomer main body and a plurality of titanium dioxide nanowires. Each of the titanium dioxide nanowires is independent and is distributed evenly and randomly in the elastomer main body. The present invention further provides a polishing apparatus and a method for manufacturing the polishing pad.
    Type: Application
    Filed: August 1, 2017
    Publication date: February 8, 2018
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, YUNG-CHANG HUNG, PIN-HSIEN SUNG, CHIN-WEI CHEN, WEN-CHIEH WU