Patents by Inventor Pin-Hung Chen
Pin-Hung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11931855Abstract: Embodiments of the present disclosure generally relate to planarization of surfaces on substrates and on layers formed on substrates. More specifically, embodiments of the present disclosure relate to planarization of surfaces on substrates for advanced packaging applications, such as surfaces of polymeric material layers. In one implementation, the method includes mechanically grinding a substrate surface against a polishing surface in the presence of a grinding slurry during a first polishing process to remove a portion of a material formed on the substrate; and then chemically mechanically polishing the substrate surface against the polishing surface in the presence of a polishing slurry during a second polishing process to reduce any roughness or unevenness caused by the first polishing process.Type: GrantFiled: May 28, 2020Date of Patent: March 19, 2024Assignee: Applied Materials, Inc.Inventors: Han-Wen Chen, Steven Verhaverbeke, Tapash Chakraborty, Prayudi Lianto, Prerna Sonthalia Goradia, Giback Park, Chintan Buch, Pin Gian Gan, Alex Hung
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Patent number: 11922101Abstract: Systems and methods are disclosed for automated generation of integrated circuit designs and associated data. These allow the design of processors and SoCs by a single, non-expert who understands high-level requirements; allow the en masse exploration of the design-space through the generation processors across the design-space via simulation, or emulation; allow the easy integration of IP cores from multiple third parties into an SoC; allow for delivery of a multi-tenant service for producing processors and SoCs that are customized while also being pre-verified and delivered with a complete set of developer tools, documentation and related outputs. Some embodiments, provide direct delivery, or delivery into a cloud hosting environment, of finished integrated circuits embodying the processors and SoCs.Type: GrantFiled: March 20, 2023Date of Patent: March 5, 2024Assignee: SiFive, Inc.Inventors: Yunsup Lee, Richard Xia, Derek Pappas, Mark Nugent, Henry Cook, Wesley Waylon Terpstra, Pin Hung Chen
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Publication number: 20230237217Abstract: Systems and methods are disclosed for automated generation of integrated circuit designs and associated data. These allow the design of processors and SoCs by a single, non-expert who understands high-level requirements; allow the en masse exploration of the design-space through the generation processors across the design-space via simulation, or emulation; allow the easy integration of IP cores from multiple third parties into an SoC; allow for delivery of a multi-tenant service for producing processors and SoCs that are customized while also being pre-verified and delivered with a complete set of developer tools, documentation and related outputs. Some embodiments, provide direct delivery, or delivery into a cloud hosting environment, of finished integrated circuits embodying the processors and SoCs.Type: ApplicationFiled: March 20, 2023Publication date: July 27, 2023Inventors: Yunsup Lee, Richard Xia, Derek Pappas, Mark Nugent, Henry Cook, Wesley Waylon Terpstra, Pin Hung Chen
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Patent number: 11610036Abstract: Systems and methods are disclosed for automated generation of integrated circuit designs and associated data. These allow the design of processors and SoCs by a single, non-expert who understands high-level requirements; allow the en masse exploration of the design-space through the generation processors across the design-space via simulation, or emulation; allow the easy integration of IP cores from multiple third parties into an SoC; allow for delivery of a multi-tenant service for producing processors and SoCs that are customized while also being pre-verified and delivered with a complete set of developer tools, documentation and related outputs. Some embodiments, provide direct delivery, or delivery into a cloud hosting environment, of finished integrated circuits embodying the processors and SoCs.Type: GrantFiled: June 28, 2021Date of Patent: March 21, 2023Assignee: SiFive, Inc.Inventors: Yunsup Lee, Richard Xia, Derek Pappas, Mark Nugent, Henry Cook, Wesley Waylon Terpstra, Pin Hung Chen
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Publication number: 20210365609Abstract: Systems and methods are disclosed for automated generation of integrated circuit designs and associated data. These allow the design of processors and SoCs by a single, non-expert who understands high-level requirements; allow the en masse exploration of the design-space through the generation processors across the design-space via simulation, or emulation; allow the easy integration of IP cores from multiple third parties into an SoC; allow for delivery of a multi-tenant service for producing processors and SoCs that are customized while also being pre-verified and delivered with a complete set of developer tools, documentation and related outputs. Some embodiments, provide direct delivery, or delivery into a cloud hosting environment, of finished integrated circuits embodying the processors and SoCs.Type: ApplicationFiled: June 28, 2021Publication date: November 25, 2021Inventors: Yunsup Lee, Richard Xia, Derek Pappas, Mark Nugent, Henry Cook, Wesley Waylon Terpstra, Pin Hung Chen
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Patent number: 11048838Abstract: Systems and methods are disclosed for automated generation of integrated circuit designs and associated data. These allow the design of processors and SoCs by a single, non-expert who understands high-level requirements; allow the en masse exploration of the design-space through the generation processors across the design-space via simulation, or emulation; allow the easy integration of IP cores from multiple third parties into an SoC; allow for delivery of a multi-tenant service for producing processors and SoCs that are customized while also being pre-verified and delivered with a complete set of developer tools, documentation and related outputs. Some embodiments, provide direct delivery, or delivery into a cloud hosting environment, of finished integrated circuits embodying the processors and SoCs.Type: GrantFiled: August 1, 2019Date of Patent: June 29, 2021Assignee: SiFive, Inc.Inventors: Yunsup Lee, Richard Xia, Derek Pappas, Mark Nugent, Henry Cook, Wesley Waylon Terpstra, Pin Hung Chen
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Publication number: 20200042664Abstract: Systems and methods are disclosed for automated generation of integrated circuit designs and associated data. These allow the design of processors and SoCs by a single, non-expert who understands high-level requirements; allow the en masse exploration of the design-space through the generation processors across the design-space via simulation, or emulation; allow the easy integration of IP cores from multiple third parties into an SoC; allow for delivery of a multi-tenant service for producing processors and SoCs that are customized while also being pre-verified and delivered with a complete set of developer tools, documentation and related outputs. Some embodiments, provide direct delivery, or delivery into a cloud hosting environment, of finished integrated circuits embodying the processors and SoCs.Type: ApplicationFiled: August 1, 2019Publication date: February 6, 2020Inventors: Yunsup Lee, Richard Xia, Derek Pappas, Mark Nugent, Henry Cook, Wesley Waylon Terpstra, Pin Hung Chen
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Publication number: 20190332560Abstract: An interface control device for controlling communication among a number of USB devices includes a number of USB interfaces, a detection unit, and a USB controller. Each USB interface is configured to couple to one corresponding USB device. The detection unit is electrically coupled to the number of USB interfaces and configured to detect a master-slave relationship of the USB devices. The USB controller is configured to obtain from the detection unit the master-slave relationship of the USB devices and define a type of the USB interfaces coupled to the corresponding USB devices according to the master-slave relationship of the USB devices.Type: ApplicationFiled: November 9, 2018Publication date: October 31, 2019Inventor: PIN-HUNG CHEN
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Patent number: 9478975Abstract: A protection circuit is connected between a power supply for providing a working voltage and a load. The protection circuit comprises an interface, a detecting module connected to the interface, a control module, and a switch module. The control module generates a plus width modulation (PWM) signal with a predetermined duty cycle when the interface interconnects with the load. The switch module periodically turns on and turns off based on the PWM signal with the predetermined duty cycle.Type: GrantFiled: September 18, 2014Date of Patent: October 25, 2016Assignee: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Ching-Chung Lin, Pin-Hung Chen
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Publication number: 20160152118Abstract: A window panel for a vehicular electric window includes an inner panel, an outer panel, and a connection panel connected between the inner and outer panels. A space is defined between the inner panel, the outer panel, and the connection panel. Each of the inner panel and the outer panel includes a plurality of vents spaced at regular intervals and intercommunicated with the space. The vents of the inner panel face a panel body of the outer panel surrounding the vents of the outer panel. The vents of the outer panel face a panel body of the inner panel surrounding the vents of the inner panel. By the above structure, when the window panel is mounted to a vehicular electric window, the window panel provides a ventilation effect and a heat dissipating effect to avoid high temperature in the vehicle.Type: ApplicationFiled: December 1, 2014Publication date: June 2, 2016Inventor: Pin-Hung CHEN
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Publication number: 20150221434Abstract: A method of manufacturing an inductive module includes: (a) injection molding a plastic material to form a substrate that has opposite first and second surfaces and at least one receiving space indented from the first surface to the second surface; (b) disposing a ferromagnetic core unit in the receiving space; (c) forming conductive traces on the first and second surfaces of the substrate and forming conductive vias through the substrate, each of the conductive traces being electrically connected to a corresponding pair of the conductive vias; and (d) covering the conductive traces with a solder mask such that a part of the conductive traces are exposed to serve as contacts, followed by subjecting to a contact finishing process.Type: ApplicationFiled: February 4, 2014Publication date: August 6, 2015Applicant: TAIMAG CORPORATIONInventor: Pin-Hung Chen
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Publication number: 20150128859Abstract: A deposition system includes a chamber, an electrical power module, a first detection module and a second detection module. The chamber includes a target, a substrate, and a plasma. The substrate is spaced apart with the target and corresponded to the target. The plasma is generated between the target and the substrate. The target, the substrate and the plasma are in an interior of the chamber. The electrical power module is electrically connected with the target so as to generate a potential difference between the target and the substrate. The first detection module is connected with the interior of the chamber for detecting a composition of the plasma so as to generate a first detection result. The second detection module is connected with the first detection module, and includes an avalanche photodiode detector for analyzing the first detection result so as to generate a second detection result.Type: ApplicationFiled: April 24, 2014Publication date: May 14, 2015Applicant: MINGDAO UNIVERSITYInventors: Chi-Lung CHANG, Wan-Yu WU, Pin-Hung CHEN, Wei-Chih CHEN, Da-Yung WANG
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Publication number: 20150129421Abstract: A hybrid deposition system includes a chamber, a pump, a gas source, a cathodic arc source, a high power impulse magnetron sputtering source and a substrate. The pump is connected with an interior of the chamber for changing a pressure of the interior of the chamber. The gas source is connected with the interior of the chamber for providing a gas into the interior of the chamber. The cathodic arc source is connected with the chamber and includes a first target disposed in the interior of the chamber. The high power impulse magnetron sputtering source is connected with the chamber and includes a second target disposed in the interior of the chamber. The substrate is disposed in the interior of the chamber and corresponded to the first target and the second target.Type: ApplicationFiled: May 18, 2014Publication date: May 14, 2015Applicant: MINGDAO UNIVERSITYInventors: Chi-Lung CHANG, Wan-Yu WU, Pin-Hung CHEN, Wei-Chih CHEN, Da-Yung WANG
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Publication number: 20150077892Abstract: A protection circuit is connected between a power supply for providing a working voltage and a load. The protection circuit comprises an interface, a detecting module connected to the interface, a control module, and a switch module. The control module generates a plus width modulation (PWM) signal with a predetermined duty cycle when the interface interconnects with the load. The switch module periodically turns on and turns off based on the PWM signal with the predetermined duty cycle.Type: ApplicationFiled: September 18, 2014Publication date: March 19, 2015Inventors: CHING-CHUNG LIN, PIN-HUNG CHEN
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Publication number: 20120299299Abstract: A self generating power source includes a housing unit including a housing body, and an energy conversion unit, a rectifying unit and an energy storage unit all disposed inside the housing body. The energy conversion unit includes two first induction members and a second induction member. The first induction members are movable relative to the second induction member for generating an alternating current in the second induction member by virtue of electromagnetic induction. Each first induction member has two magnetic poles opposite to each other in polarity. The first induction members are disposed such that two of the magnetic poles of the first induction members having the same polarity are disposed to confront each other. The rectifying unit is coupled electrically to the second induction member for converting the alternating current into a direct current. The energy storage unit is coupled electrically to the rectifying unit for storing the direct current.Type: ApplicationFiled: May 27, 2011Publication date: November 29, 2012Applicant: TAIMAG CORPORATIONInventors: Fu-Ho Chan, Pin-Hung Chen, Wen-Long Lu, Kuo-Tung Cheng
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Publication number: 20110184741Abstract: A positioning-based virtual business operation system includes a seller equipment having a positioning device for acquiring positioning information of the seller equipment and a data transmitting/receiving device for transmitting the positioning information; an operation platform having a business information interface for receiving the positioning information of the seller equipment and updating location information of the seller equipment in the business information interface; and an operator equipment for transmitting operation service information to the operation platform via a network and adjusting service information of the seller equipment or operator information in the business information interface, thereby allowing consumers, mobile sellers, operators of virtual business, and operators of portal sites to benefit from the system and thus creating an all-beneficial business running pattern.Type: ApplicationFiled: July 20, 2010Publication date: July 28, 2011Applicant: NATIONAL TAIWAN UNIVERSITYInventors: Yeong Sung Lin, Jen-Wel Chen, Pei Yu Chen, Yu Shun Wang, Yao-Yuan Chang, Shih-Chang Lin, Yi-Wei Li, Pin Hung Chen, Yung-Pin Tsai
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Publication number: 20050287872Abstract: A connector module suitable for ultra-high speed network transmission is described. The connector module utilizes a network controlling interface device with substantially the same width as a socket of a jack. Electrical components with smaller size and better network transmission efficiency are disposed on the network controlling interface device. Therefore, the connector module has more compact package size, so as to reduce a package size of an electrical apparatus using the connector module and increase process yield and network transmission efficiency. In addition, at least one displaying device is disposed in the connector module and electrically connected to the network controlling interface device, so as to show a connection status of the network.Type: ApplicationFiled: June 29, 2004Publication date: December 29, 2005Inventor: Pin-Hung Chen
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Publication number: 20040040692Abstract: A cushion comprises a metal plate and a container. The metal plate includes a plurality of positioning members projecting from a periphery thereof. The container includes an upper piece and a lower piece that together define an interior space therebetween. An inlet is defined in the lower piece, allowing filling of liquid into the interior space. The positioning members extend into the interior space of the container and are integrally formed with the container such that the positioning members are fixed to the container.Type: ApplicationFiled: August 29, 2002Publication date: March 4, 2004Inventor: Pin-Hung Chen
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Patent number: 6547598Abstract: An RJ45 type network socket connector consists of a dielectric housing and a unit body inserted into the housing so as to increase the manufacturing efficiency of the connector. The unit body has a base with a bracket extending horizontally from a front side thereof, a PCB secured on a top of the base, a transformer positioned on the PCB, an inner contact portion arranged on the bracket and an outer contact portion extended through the base. The unit body is easily inserted from a step-shaped entry into a rear space of the housing and the bracket is extended into a receiving groove defined in a socket cavity formed in a front space of the housing and then securely positioned in the housing.Type: GrantFiled: January 22, 2002Date of Patent: April 15, 2003Assignee: Taimag CorporationInventor: Pin-Hung Chen
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Patent number: 6488529Abstract: A connector assembly consisting of a dielectric housing having at least one socket cavity defined in a front end thereof and a fixing recess defined at one outer side surface of the housing, a PCB securely fixed in the fixing recess by a sealing resin, and at least one indicator fixedly embedded in the sealing resin and secured between an inner side of the PCB and a bottom of the fixing recess, wherein the fixing recess is defined with a front opening at a front end thereof, therefore the at least one indicator emit light from the front opening of the fixing recess.Type: GrantFiled: January 22, 2002Date of Patent: December 3, 2002Assignee: Taimag CorporationInventor: Pin-Hung Chen