Abstract: An open end wrench includes first and second jaws formed on a jaw portion. The first jaw includes an arcuate sliding groove having an arcuate sliding wall. A slide is received in the sliding groove and includes an arcuate sliding face slideable along the sliding wall. An arcuate guiding slot is formed in the slide. The sliding face, sliding wall and guiding slot are free of holes, grooves, and recesses. A guide is fixed in the sliding groove and received in the guiding slot. The guiding slot includes an abutting end and a pressing end. The abutting end is in contact with the guide when the slide is in an initial position not engaged with a workpiece. An elastic device has two ends respectively abutting the guide and the pressing end of the guiding slot for biasing the slide to the initial position.

Abstract: A modularly expandable lamp holder comprises first and second assembling surfaces. The first assembling surface has an elongated protrusion formed thereon, which includes a first portion adjacent to the first assembling surface and a second portion remote from the first assembling surface and having a size larger than that of the first portion. The second assembling surface defines an elongated groove therein, which has a configuration matching that of the protrusion. The lamp holder can be mechanically assembled with another lamp holder of this kind by the engagement of the protrusion of the lamp holder and the groove of another lamp holder.

Abstract: The present disclosure provides a semiconductor manufacturing method. The method includes providing product data of a product, the product data including a sensitive product parameter; searching existing products according to the sensitive product parameter to identify a relevant product from the existing products; determining an initial value of a processing model parameter to the product using corresponding data of the relevant product; assigning the initial value of the processing model parameter to a processing model associated with a manufacturing process; thereafter, tuning a processing recipe using the processing model; and performing the manufacturing process to a semiconductor wafer using the processing recipe.

Abstract: A display device including an e-paper device and a power converter is provided. The e-paper device displays information. The power converter generates a plurality of output voltages respectively at a plurality of output terminals and provides the plurality of output voltages to the e-paper device. The power converter includes a transformer and a plurality of diodes. The transformer has a primary winding and a plurality of secondary windings. The diodes are electrically connected between the secondary windings and the output terminals for generating the output voltages, respectively.

Abstract: An LED lamp includes a heat sink including a base having a heat-dissipating face, an LED module including a printed circuit board mounted on the base and a plurality of LEDs disposed on the printed circuit board, and a connecter electrically connecting the LED module to a power supply. The heat sink further includes a plurality of spiral fins protruding outwardly from the heat-dissipating face of the base.

Abstract: An LED illumination device comprises a base, at least one LED light source and a heat dissipation module. The base has a first surface and a second surface opposite to the first surface. The LED light source is located on the second surface of the base. The heat dissipation module is thermally connected to the first surface of the base. The heat dissipation module has a staff and a spiral heat sink, which is attached to the staff. The staff is mounted on the base and the spiral heat sink is mounted on the staff. The spiral heat sink generates airflow through the LED light source when the spiral heat sink and the staff are rotated relative to the base, whereby heat dissipation efficiency of the LED light source is optimized accordingly.

Abstract: An airflow guider includes a plate-like member having a stop portion extending transversely, a rear inclined guiding portion extending downward rearward toward a first side from a top edge of the stop portion, a front inclined guiding portion extending slantwise forward toward the first side from the stop portion, and at least one fixture for installing the airflow guider to a heat sink. In light of the structure, the airflow guider can be coordinately installed to various kinds of heat sinks and provide additional thermal dissipation.

Abstract: A lamp includes a main body and a removable cover, and the main body includes a lamp housing, a printed circuit board (PCB), at least one light emitting element, and a threaded base. The lamp housing defines a socket configured for receiving the PCB and the at least one light emitting element, and the PCB is electrically connected to the at least one light emitting element and fixed in the socket. The removable cover includes a light-transmission portion and a connection portion, the connection portion connects to the end of the lamp housing with the socket, and the light-transmission portion is opposite to the socket. Light from the at least one light emitting element is emitted from the light-transmission portion.

Abstract: An illumination device includes a light source and a heat dissipation device. The light source includes a base and at least a light emitting diode on the base. The heat dissipation device is located on the base opposite to the light emitting diode, and includes an air pump and a hollow shell. The hollow shell is detachably fixed on the base, and has a first opening and a second opening. The air pump is detachably fixed in the hollow shell. In operation, motion of the air pump generates airflow from the first opening toward the second opening to evacuate heat from the light source.

Abstract: An LED light fixture includes an inner shell containing a cooling fluid therein, an outer shell enclosing the inner shell, a heat conductor extending through the inner and outer shells, a light module mounted on one end of the heat conductor, and a lamp base connected to an opposite end of the heat conductor.

Abstract: An illumination device includes a light source and a heat dissipation device. The light source includes a base and at least a light emitting diode on the base. The heat dissipation device includes a fan for dissipating heat from the light source, and a hollow shell. The hollow shell has an inlet and an outlet defined thereon. The fan is located on the hollow shell, and the airflow from the fan is parallel to a rotation plane of the fan. In operation, air is impelled from the hollow shell by the fan, and heat from the light source is evacuated by airflow from the inlet to the outlet, and air pressure in the shell is reduced. Cool air flows into the hollow shell through the inlet.

Abstract: An LED illuminating apparatus includes a lampshade, a cover engaged with the lampshade, a heat dissipation module received in a hollow tube cooperatively formed by the engaged lampshade and cover, a light source engaged on the heat dissipation module, and two connectors secured at opposite ends of the lampshade and the cover. The lampshade defines a plurality of vents therein. The light source faces the cover and light emitted from the light source radiates out of the LED illuminating apparatus through the cover.

Abstract: An illumination device includes a light source and a heat-dissipation device. The heat-dissipation device has an air impeller configured for dissipating heat from the light source, and a hollow shell. The hollow shell has an inlet and an outlet with a height difference therebetween. The air impeller is removably installed on the shell between the inlet and outlet. The air impeller is adjacent to the outlet and accelerates airflow therefrom. Air pressure around the outlet is reduced and a pressure difference between the inside and outside of the hollow shell is generated. Air in hollow shell is heated by the light source and leaves the hollow shell via the outlet. Cold air enters the hollow shell via the inlet.

Abstract: An exemplary heat dissipation device includes an elongated main body, a number of heat sinks, and a number of airflow channels. The main body has a central axis, and includes a first portion and a second portion. The second portion has an end distant from the first portion which is configured for supporting at least one item selected from the group consisting of a solid-state light source and a circuit board having a solid-state light source mounted thereon. The heat sinks are arranged around the first portion in sequence along the central axis of the main body, and spaced from one another. Each heat sink includes a number of fins extending out from the first portion radially. The airflow channel is defined between each two neighboring heat sinks.