Abstract: A product defect detection method which includes acquiring a detection image of a product to be detected is provided. The method further includes dividing the detection image into a first preset number of detection blocks. Once a detection result of each detection block is obtained by inputting each detection block into a preset defect recognition model, according to a position of each detection block in the detection image, a detection result of the product is determined according to the detection result of each detection block.

Abstract: A method for detecting a product for defects implemented in an electronic device includes detecting images of a product for defects by a first defect detection model in a preset period, and obtaining a detection result; when a ratio of the number of negative sample images is greater than a preset threshold, training an autoencoder model; obtaining historical positive sample images of the product, inputting the history positive sample images into the trained autoencoder model, and calculating a latent feature; inputting the latent feature of each history positive sample image into a decoding layer of the trained autoencoder model, and calculating newly added positive sample images; training the first defect detection model and obtain a second defect detection model; and inputting images of a product to be detected to the second defect detection model, and obtaining a detection result of the product.

Abstract: Provided are a method for manufacturing a PDLC membrane electrode, a negative pressure platform, and a PDLC membrane. The method for manufacturing a PDLC membrane electrode includes the following steps: placing a PDLC membrane on a negative pressure platform with a side to be processed facing upwards, and making a liquid crystal activation area of the side to be processed of the PDLC membrane coincide with a transparent area of the negative pressure platform, and other area coincides with a main body area of the negative pressure platform; activating a liquid crystal layer of the PDLC membrane; cutting and tearing off, according to a half-cut area, a PET layer and an electric conduction layer located on the liquid crystal layer, and sweeping or tearing off the activated liquid crystal layer together to expose the electric conduction layer below the liquid crystal layer to form a corresponding electrode.

Abstract: An electronic device includes: a substrate, a poly-silicon layer disposed on the substrate, a first metal layer disposed on the substrate, a first insulating layer disposed on the first metal layer, a second insulating layer disposed on the first insulating layer; and a second metal layer covering a part of the second insulating layer and electrically connected to the first metal layer. Wherein a thickness of the second insulating layer under the second metal layer is larger than a thickness of the second insulating layer uncovered with the second metal layer.

Abstract: In an image processing method, a detection image and a marked image are obtained. An image segmentation model is applied to segment a first segmented image from the detection image. The first segmented image is corrected according to the marked image to obtain a second segmented image. A size of the second segmented image is adjusted to obtain an adjusted segmented image. The adjusted segmented image is used as a standard segmented image of the detection image. The method improves accuracy of image segmentation and recognition.

Abstract: A test socket is provided and includes a base with a first surface, a second surface opposing the first surface and through holes, a conductive elastic sheet located on the first surface, and a plurality of elastic metal members with first contact ends facing toward the conductive elastic sheet. The first contact ends include bumps suitable for inserting into the conductive elastic sheet, and each elastic metal member may be prevented from being contaminated by covering the base with the conductive elastic sheet. When the elastic metal members are pressured to insert the bumps into the conductive elastic sheet, a low resistance better than the resistance of the elastic metal members without squeezing can be obtained. When the bumps are inserted into the conductive elastic sheet, the surface of the bumps can be cleaned and the elastic metal members are stably in contact with the conductive elastic sheet.

Abstract: An embodiment method of forming a hybrid bond between a first semiconductor device component and a second semiconductor device component may include forming the first semiconductor device component including a first electrical bonding structure formed within a first dielectric material; forming the second semiconductor device component including a second electrical bonding structure formed within a second dielectric material; placing the first semiconductor device component and the second semiconductor device component together such that the first electrical bonding structure is in contact with the second electrical bonding structure; performing a first annealing process that forms a direct metal-to-metal bond between the first electrical bonding structure and the second electrical bonding structure; and performing a second annealing process that forms a direct dielectric-to-dielectric bond between the first dielectric material and the second dielectric material.

Abstract: The present disclosure relates to implementing, updating, and managing operation of a client agent on a client device (e.g., computing device, virtual device) in a way that enables isolation of features and functionality while also allowing the client agent to self-heal and intelligently update discrete features thereon. The client agent includes a collection of plugins that are isolated and run in accordance with respective plugin policies. The client agent makes use of device-level, agent-level, and plugin-level health monitors that collectively monitor a health status of discrete components of the client agent in a way that enables the client agent to selectively discontinue scheduling certain plugins without interrupting functionality of other plugins or of the client agent as a whole. Indeed, features described herein enable the client agent to intelligently update and self-heal with respect to individual plugins based on information obtained by the respective health monitors.

Abstract: A testing method for testing wafer level chip scale packages formed on a wafer including a wafer substrate and spaced-apart contact electrodes disposed on the wafer substrate, includes: providing a test device including a probe card formed with a plurality of parallel probe holes having a uniform cross-sectional dimension, and a plurality of probes respectively received in the probe holes and extending respectively in the probe holes along axes of the probe holes; and electrically connecting the contact electrodes to the probes. A distance between the axes of two adjacent ones of the probe holes is equal to a smallest spacing between two adjacent ones of the contact electrodes and is not greater than 0.5 mm.

Abstract: An electronic test apparatus is adapted for testing an electronic component which includes a circuit substrate and a plurality of contact electrodes disposed on the circuit substrate. The electronic test apparatus includes a test seat and a plurality of spring probes. The test seat includes a metallic main body that has a first side adapted to be in contact with the circuit substrate and a second side opposite to the first side, and that is formed with a plurality of spaced-apart probe holes extending through the first and second sides, and a temperature sensor disposed in the metallic main body. The spring probes are adapted to be electrically connected to the contact electrodes and each is positioned in a respective one of the probe holes.

Abstract: An electronic test apparatus is adapted for testing an electronic component which includes a circuit substrate and a plurality of contact electrodes disposed on the circuit substrate. The electronic test apparatus includes a test seat and a plurality of spring probes. The test seat includes a metallic main body that has a first side adapted to be in contact with the circuit substrate and a second side opposite to the first side, and that is formed with a plurality of spaced-apart probe holes extending through the first and second sides, and a temperature sensor disposed in the metallic main body. The spring probes are adapted to be electrically connected to the contact electrodes and each is positioned in a respective one of the probe holes.

Abstract: A testing method for testing wafer level chip scale packages formed on a wafer including a wafer substrate and spaced-apart contact electrodes disposed on the wafer substrate, includes: providing a test device including a probe card formed with a plurality of parallel probe holes having a uniform cross-sectional dimension, and a plurality of probes respectively received in the probe holes and extending respectively in the probe holes along axes of the probe holes; and electrically connecting the contact electrodes to the probes. A distance between the axes of two adjacent ones of the probe holes is equal to a smallest spacing between two adjacent ones of the contact electrodes and is not greater than 0.5 mm.

Abstract: A two-piece spring probe in electrical contact with a piece of testing equipment is used for probing an object to be tested. The two-piece spring probe includes a coiled compression spring and a conductive element. The coiled compression spring has a non-uniform outer diameter and is used to electrically contact the object. The conductive element is directly connected to the coiled compression spring and in electrical contact with the testing equipment.

Abstract: A cascade refrigeration system includes first and second cooling devices. The first cooling device includes a first compressor, a condenser, an expansion device, an evaporator having first and second passages independent from and not communicating with each other, and a first conduit interconnecting the first compressor, the condenser, the expansion device and the first passage. The second cooling device includes a second compressor, a heat exchanger, and a second conduit interconnecting the second compressor, the second passage and the heat exchanger. A circulation switching device includes a switching mechanism connected to the first conduit downstream of the condenser and upstream of the expansion device.

Abstract: An evaporator includes a casing and a plurality of circulation units disposed on the casing. Each of the circulation units includes a flow path formed in the casing, an inlet formed in the casing for entry of one of refrigerants into the casing and fluidly communicating with the flow path, and an outlet formed in the casing spaced apart from the inlet for exit of the one of the refrigerants out the casing and fluidly communicating with the flow path. The circulation units are independent from each other and do not fluidly communicate with each other.

Abstract: A two-piece spring probe in electrical contact with a piece of testing equipment is used for probing an object to be tested. The two-piece spring probe includes a coiled compression spring and a conductive element. The coiled compression spring has a non-uniform outer diameter and is used to electrically contact the object. The conductive element is directly connected to the coiled compression spring and in electrical contact with the testing equipment.

Abstract: A cascade refrigeration system includes first and second cooling devices. The first cooling device includes a first compressor, a condenser, an expansion device, an evaporator having first and second passages independent from and not communicating with each other, and a first conduit interconnecting the first compressor, the condenser, the expansion device and the first passage. The second cooling device includes a second compressor, a heat exchanger, and a second conduit interconnecting the second compressor, the second passage and the heat exchanger. A circulation switching device includes a switching mechanism connected to the first conduit downstream of the condenser and upstream of the expansion device.

Abstract: An evaporator includes a casing and a plurality of circulation units disposed on the casing. Each of the circulation units includes a flow path formed in the casing, an inlet formed in the casing for entry of one of refrigerants into the casing and fluidly communicating with the flow path, and an outlet formed in the casing spaced apart from the inlet for exit of the one of the refrigerants out the casing and fluidly communicating with the flow path. The circulation units are independent from each other and do not fluidly communicate with each other.

Abstract: An electronic test equipment is adapted to test an electronic component. The electronic component has a circuit body and a plurality of connectors that are electrically connected to the circuit body. The electronic test equipment includes a metallic test seat and a plurality of spring probes. The metallic test seat is adapted to support the circuit body thereon, and is formed with a plurality of spaced-apart probe holes extending therethrough and possessing diameters that are substantially the same. Each of the probe holes is adapted to receive a corresponding one of the connectors. The spring probes are respectively and entirely positioned within the probe holes, and are adapted to electrically contact the connectors.

Abstract: A signal swing trimming apparatus calibrates a swing level of an output signal generated from a transmitting device to a receiving device including: a comparing device coupled to the output signal for comparing the swing level of the output signal with a target swing level and generating a comparison output signal, and an adjusting device coupled to the comparing device and the transmitting device for controlling the transmitting device to adjust the swing level of the output signal according to the comparison output signal, wherein the signal swing trimming apparatus is configured to calibrate the swing level of the output signal during a hand-shake process between the transmitting device and the receiving device.