Patents by Inventor Pin Wu
Pin Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240170364Abstract: A semiconductor device package and a method of manufacturing a semiconductor device package are provided. The semiconductor device package includes at least one electronic component, a heat source, and a heat dissipation element. The heat source is adjacent to the electronic component. The heat dissipation element is disposed adjacent to the heat source and the electronic component. The heat dissipation element includes a heat transmitting structure configured to reduce heat, which is from the heat source, through the heat dissipation element, and transmitting in a direction toward the electronic component.Type: ApplicationFiled: November 23, 2022Publication date: May 23, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hung-Hsien HUANG, Wen Chun WU, Chih-Pin HUNG
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Patent number: 11990708Abstract: An electrical connector includes: an insulating body defining a mating space; and a terminal module assembled to the insulating body and having a circuit board and plural mating terminals mounted on the circuit board, wherein: each of the mating terminals has a contact portion extending obliquely backward, a bending portion bent backward from a front end of the contact portion, a connecting portion extending rearward from a rear end of the bending portion, and a mounting portion vertically extending from a rear end of the connecting portion for mounting on the circuit board; and a front end of the circuit board extends forward into the mating space.Type: GrantFiled: March 23, 2022Date of Patent: May 21, 2024Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITEDInventors: Sheng-Pin Gao, Yong-Chun Xu, Hung-Chi Yu, Chih-Ching Hsu, Jie Zhang, Chin-Jung Wu
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Patent number: 11989005Abstract: A system performs adaptive thermal ceiling control at runtime. The system includes computing circuits and a thermal management module. When detecting a runtime condition change that affects power consumption in the system, the thermal management module determines an adjustment to the thermal ceiling of a computing circuit, and increases the thermal ceiling of the computing circuit according to the adjustment.Type: GrantFiled: September 30, 2021Date of Patent: May 21, 2024Assignee: MediaTek Inc.Inventors: Bo-Jr Huang, Jia-Wei Fang, Jia-Ming Chen, Ya-Ting Chang, Chien-Yuan Lai, Cheng-Yuh Wu, Yi-Pin Lin, Wen-Wen Hsieh, Min-Shu Wang
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Publication number: 20240160844Abstract: The present disclosure provides a synonym searching method, which includes steps as follows. When receiving the vocabulary and the definition of the vocabulary from the user device, the natural language processing model is used to search the synonym of the vocabulary from the data governance dictionary according to the definition of the vocabulary; after providing the synonym to the user device, feedback information about the synonym is received from the user device, and the feedback information is used as the token of the vocabulary for the natural language processing model.Type: ApplicationFiled: February 8, 2023Publication date: May 16, 2024Inventors: Wei-Chao CHEN, Chen-I HUANG, Yu-Lun CHANG, Chuo-Jui WU, Chih-Pin WEI
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Publication number: 20240154972Abstract: A method for permission management includes: generating a plurality of job roles with different permissions according to organization permission table; generating first permission structure directed graph according to the job roles; selecting one of the job roles in first permission structure directed graph as target job role; generating minimum directed spanning graph in first permission structure directed graph according to target job role; determining whether permission of each of the job roles in first permission structure directed graph matches job of each of the job roles in first permission structure directed graph; and adjusting permission and job of each of the job roles to generate second permission structure directed graph if it is determined that permission of each of the job roles in first permission structure directed graph does not match job of each of the job roles in first permission structure directed graph.Type: ApplicationFiled: December 21, 2022Publication date: May 9, 2024Inventors: Wei-Chao CHEN, Ming-Chi CHANG, Chih-Pin WEI, Chuo-Jui WU
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Patent number: 11967546Abstract: A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.Type: GrantFiled: July 21, 2022Date of Patent: April 23, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang, Chih-Ta Shen, Szu-Wei Lu, Ying-Ching Shih, Wen-Chih Chiou, Chi-Hsi Wu, Chen-Hua Yu
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Publication number: 20240128218Abstract: A semiconductor package includes a first semiconductor substrate, an array of conductive bumps, a second semiconductor substrate, and a spacing pattern. The first semiconductor substrate includes a pad region and an array of first pads disposed within the pad region. The array of conductive bumps is disposed on the array of first pads respectively. The second semiconductor substrate is disposed over the first semiconductor substrate and includes an array of second pads bonded to the array of conductive bumps respectively. The spacing pattern is disposed between the first semiconductor substrate and the second semiconductor substrate, wherein the spacing pattern is located at a periphery of the pad region.Type: ApplicationFiled: January 19, 2023Publication date: April 18, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hung-Pin Chang, Wei-Cheng Wu, Ming-Shih Yeh, An-Jhih Su, Der-Chyang Yeh
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Patent number: 11958813Abstract: A uracil compound containing a carboxylate fragment, a preparation method therefor, and a herbicidal composition and use thereof are provided. The preparation method includes a contact reaction between a carboxylic acid compound and different substituted alcohol, halogenated, or sulfonate compound in a presence of a solvent. The uracil compound containing a carboxylate fragment provided by the present invention has better herbicidal activity compared with the prior art.Type: GrantFiled: February 5, 2022Date of Patent: April 16, 2024Assignee: JIANGSU FLAG CHEMICAL INDUSTRY CO., LTD.Inventors: Pu Zhang, Kaicheng Yao, Yaojun Wu, Dan Xu, Pin Qian, Long Bu, Congqiang Bai
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Patent number: 11937751Abstract: The present disclosure provides a movable electric device. The movable electric device includes a movable device body and a contact detection electrode. The movable device body has an electric drive means. The contact detection electrode is mounted on the movable device body. When the contact detection electrode _contacts diffusible dirt, a resistance, capacitance or impedance of the contact detection electrode varies.Type: GrantFiled: November 9, 2018Date of Patent: March 26, 2024Assignees: GUANGDONG MIDEA WHITE HOME APPLIANCE TECHNOLOGY INNOVATION CENTER CO., LTD., MIDEA GROUP CO., LTD.Inventors: Pin Yang, Jiefeng Cheng, Xinjian Huang, Shuyun Wu, Junge Zhang
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Publication number: 20240089607Abstract: An image sensing device and a control device of an illumination device thereof are provided. The control device includes a control circuit, an operation circuit, and multiple driving signal generators. The control circuit generates multiple control signals. The operation circuit performs a logical operation on the control signals and an image capturing signal to generate multiple operation results. The driving signal generator respectively provides multiple driving signals to the illumination device according to the operation results, and the driving signals respectively have multiple different output powers.Type: ApplicationFiled: May 29, 2023Publication date: March 14, 2024Applicant: HTC CorporationInventors: Chao Shuan Huang, Sheng-Long Wu, Yu-Jui Hsu, Shih-Yao Tsai, Tun-Hao Chao, Sen-Lin Chung, Chih Pin Chung, Chih-Yuan Chien, Shih Hong Sun
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Publication number: 20240087980Abstract: A semiconductor device includes a substrate, a dielectric layer disposed over the substrate, and an interconnect structure extending through the dielectric layer. The dielectric layer includes a low-k dielectric material which includes silicon carbonitride having a carbon content ranging from about 30 atomic % to about 45 atomic %. The semiconductor device further includes a thermal dissipation feature extending through the dielectric layer and disposed to be spaced apart from the interconnect structure.Type: ApplicationFiled: February 17, 2023Publication date: March 14, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Kai-Fang CHENG, Cherng-Shiaw TSAI, Cheng-Chin LEE, Yen-Ju WU, Yen-Pin HSU, Li-Ling SU, Ming-Hsien LIN, Hsiao-Kang CHANG
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Publication number: 20240087057Abstract: A power consumption monitoring device includes a sensor, a storage, and a processor. The sensor is configured to detect a power-consuming device quantity and a power consumption amount. The storage is configured to store the power-consuming device quantity and the power consumption amount. The processor is communicatively connected to the sensor and the storage. The processor is configured to calculate a power-consuming device idling indicator based on the power-consuming device quantity and the power consumption amount in a monitoring time interval, wherein the power-consuming device idling indicator is used for indicating a deviation status of the power-consuming device quantity and the power consumption amount. The processor is further configured to determine whether the power-consuming device idling indicator exceeds a warning threshold. In response to the power-consuming device idling indicator exceeding the warning threshold, the processor is further configured to generate a warning message.Type: ApplicationFiled: December 20, 2022Publication date: March 14, 2024Inventors: Wei-Chao CHEN, Ming-Chi CHANG, Chih-Pin WEI, Ke-Li WU, Hua-Hsiu CHIANG, Yu-Lun CHANG
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Patent number: 11929547Abstract: A mobile device includes a system circuit board, a metal frame, one or more other antenna elements, a display device, a first feeding element, and an RF (Radio Frequency) module. The system circuit board includes a system ground plane. The metal frame at least includes a first portion and a second portion. The metal frame at least has a first cut point positioned between the first portion and the second portion. The metal frame further has a second cut point for separating the other antenna elements from the first portion. The first cut point is arranged to be close to a middle region of the display device. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion.Type: GrantFiled: April 7, 2023Date of Patent: March 12, 2024Assignee: HTC CorporationInventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Li-Yuan Fang, Shen-Fu Tzeng, Yi-Hsiang Kung
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Publication number: 20240076422Abstract: A supported metallocene catalyst includes a carrier and a metallocene component. The carrier includes an inorganic oxide particle and an alkyl aluminoxane material. The inorganic oxide particle includes at least one inorganic oxide compound selected from the group consisting of an oxide of Group 3A and an oxide of Group 4A. The alkyl aluminoxane material includes an alkyl aluminoxane compound and an alkyl aluminum compound that is present in amount ranging from greater than 0.01 wt % to less than 14 wt % base on 100 wt % of the alkyl aluminoxane material. The metallocene component is supported on the carrier, and includes one of a metallocene compound containing a metal from Group 3B, a metallocene compound containing a metal from Group 4B, and a combination thereof. A method for preparing the supported metallocene catalyst and a method for preparing polyolefin using the supported metallocene catalyst are also disclosed.Type: ApplicationFiled: September 1, 2023Publication date: March 7, 2024Inventors: Jing-Cherng TSAI, Jen-Long WU, Wen-Hao KANG, Kuei-Pin LIN, Jing-Yu LEE, Jun-Ye HONG, Zih-Yu SHIH, Cheng-Hung CHIANG, Gang-Wei SHEN, Yu-Chuan SUNG, Chung-Hua WENG, Hsing-Ya CHEN
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Patent number: 11923841Abstract: A proximity sensor includes a light source, an optical sensing element, and an integration circuit. The light source is turned on and off several times during a measurement time interval. When the light source is turned on and off, the optical sensing element senses the surrounding light to generate a first current and a second current, respectively. The integration circuit integrates the first current and the second current to generate a first integration signal and a second integration signal respectively for determining whether an object is approaching. When the light source is turned on, the present second integration signal is stored, and a stored first integration signal is used as a starting value to integrate the first current. When the light source is turned off, the present first integration signal is stored, and the stored second integration signal is used as a starting value to integrate the second current.Type: GrantFiled: March 24, 2023Date of Patent: March 5, 2024Assignee: EMINENT ELECTRONIC TECHNOLOGY CORP. LTD.Inventors: Kao-Pin Wu, Yuh-Yuan Wang
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Patent number: 11921072Abstract: A contact-type detection electrode for detecting dispersible dirt and a movable electric device are provided. The contact-type detection electrode includes a support, and electrical conductors arranged on the support and being flexible.Type: GrantFiled: December 21, 2018Date of Patent: March 5, 2024Assignees: GUANGDONG MIDEA WHITE HOME APPLIANCE TECHNOLOGY INNOVATION CENTER CO., LTD., MIDEA GROUP CO., LTD.Inventors: Pin Yang, Guilin Xiong, Xinjian Huang, Shuyun Wu, Jiefeng Cheng
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Publication number: 20240065765Abstract: A method of orthopedic treatment includes steps of: by using a computer aided design (CAD) tool based on profile data that is related to a to-be-treated part of a bone of a patient, obtaining a model of a preliminary instrument that substantially fits the to-be-treated part; by using the CAD tool, obtaining a model of a patient specific instrument (PSI) based on the model of the preliminary instrument; producing the PSI based on the model of the PSI, the PSI being adjustable; performing medical operation on the to-be-treated part, and then attaching the PSI to the to-be-treated part; after attaching the PSI to the to-be-treated part, adjusting the PSI such that the PSI is adapted to real conditions of the to-be-treated part.Type: ApplicationFiled: August 22, 2023Publication date: February 29, 2024Inventors: Alvin Chao-Yu CHEN, Yi-Sheng CHAN, Chi-Pin HSU, Shang-Chih LIN, Chin-Ju WU, Jeng-Ywan JENG
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Patent number: 11916105Abstract: Semiconductor device and the manufacturing method thereof are disclosed. An exemplary semiconductor device comprises a semiconductor stack including semiconductor layers over a substrate, wherein the semiconductor layers are separated from each other and are stacked up along a direction substantially perpendicular to a top surface of the substrate; an isolation structure around a bottom portion of the semiconductor stack and separating active regions; a metal gate structure over a channel region of the semiconductor stack and wrapping each of the semiconductor layers; a gate spacer over a source/drain (S/D) region of the semiconductor stack and along sidewalls of a top portion of the metal gate structure; and an inner spacer over the S/D region of the semiconductor stack and along sidewalls of lower portions of the metal gate structure and wrapping edge portions of each of the semiconductor layers.Type: GrantFiled: March 26, 2021Date of Patent: February 27, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Bwo-Ning Chen, Xusheng Wu, Pin-Ju Liang, Chang-Miao Liu, Shih-Hao Lin
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Patent number: 11913981Abstract: An electrostatic sensing system configured to sense an electrostatic information of a fluid inside a fluid distribution component and including an electrostatic sensing assembly, a signal amplifier and an analog-to-digital converter. The electrostatic sensing assembly includes a sensing component, and a shield. The sensing component is configured to be disposed at the fluid distribution component. The sensing component is disposed through the fluid distribution component so as to be partially located in the fluid distribution component. The shield surrounds a part of the sensing component that is located in the fluid distribution component. At least part of the shield is located on an upstream side of the sensing component. The signal amplifier is electrically connected to the sensing component. The analog-to-digital converter is electrically connected to the signal amplifier. The shield has an opening spaced apart from the sensing component.Type: GrantFiled: December 21, 2020Date of Patent: February 27, 2024Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Mean-Jue Tung, Ming-Da Yang, Shi-Yuan Tong, Yu-Ting Huang, Chun-Pin Wu
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Patent number: D1027970Type: GrantFiled: March 13, 2021Date of Patent: May 21, 2024Assignee: SMART Q INC.Inventor: Hui Pin Wu