Abstract: A liquid leakage detecting module includes a liquid leakage detecting device, a monitoring device and a main wire. The liquid leakage detecting device includes a hub and a plurality of liquid leakage detection branches electrically connected to the hub in parallel. The hub is electrically connected to the monitoring device though the main wire.

Abstract: A liquid immersion cooling apparatus includes a box, a cover and a refrigeration device. The cover and the box form a closed space. The closed space includes a liquid storage space configured to accommodate a first coolant and at least one heat generating device and a gas storage space. The refrigeration device is located in the gas storage space. The refrigeration device includes a coiled tube, a liquid-cooled heat exchanger, and a cooling chip. The liquid-cooled heat exchanger is connected to the coiled tube to form a first circulation channel. The first circulation channel is configured to accommodate a second coolant. The cooling chip includes a hot end and a cold end, the cold end is thermally coupled to the liquid-cooled heat exchanger.

Abstract: A liquid cooling apparatus is configured to store a first cooling liquid and cool at least one server. The liquid cooling apparatus includes a shell, an immersion tank, a liquid-cooled heat exchanger and a plate heat exchanger. The shell has a device storage space. The immersion tank is located in the device storage space for accommodating the server. The liquid-cooled heat exchanger and the plate heat exchanger are located in the device storage space. The plate heat exchanger has a first channel and a second channel that are not connected. The first channel and the immersion tank together form a first circulation flow channel for accommodating the first cooling liquid, and the second channel and the liquid-cooled heat exchanger together form a second circulating flow channel for accommodating a second cooling liquid. The first cooling liquid and the second cooling liquid exchange heat in the plate heat exchanger.

Abstract: This disclosure relates to a liquid cooling assembly that includes a base, a cover, a first connector, and a second connector. The cover is disposed on the base. The cover and the base together form an accommodation space therebetween. The cover has an inlet and an outlet respectively located at two opposite sides of the cover in a direction parallel to a longitudinal direction of the cover. The first connector is disposed to the inlet of the cover. The second connector is disposed to the outlet of the cover.

Abstract: A server including a chassis, a motherboard, a heat source and a heat exchanger. The motherboard is disposed in the chassis. The heat source is disposed on and electrically connected to the motherboard. The heat exchanger includes a first chamber body, a plurality of heat dissipation plates and a plurality of heat dissipation fins. The first chamber body is in thermal contact with the heat source and has a first channel. The plurality of heat dissipation plates are in thermal contact with and inserted into the first chamber body. The plurality of heat dissipation plates each have a second channel. The first channel of the first chamber body is in fluid communication with the second channels of the plurality of heat dissipation plates. The plurality of heat dissipation fins are in thermal contact with the plurality of heat dissipation plates.

Abstract: The present disclosure provides a method for automatically optimizing power consumption. The method includes: (S1) a baseboard management controller determines whether system information is correct or not after powered on. If correct, further proceeding the method. If not correct, stopping further proceeding the method. (S2) the baseboard management controller periodically detects the surface temperature and the internal temperature of the essential element with a first loop cycle and determines whether the surface temperature or the internal temperature is higher than a preset temperature. (S3) If the surface temperature or the internal temperature is higher than the preset temperature, performing a PID adjustment to the fan rotation speed according to the surface temperature or the internal temperature of the essential element.

Abstract: The disclosure provides a heat dissipation device. The heat dissipation device is configured to dissipate heat generated by a central process unit. The heat dissipation device includes a first heat dissipation component, at least one second heat dissipation component and at least one heat pipe. The at least one heat pipe is connected to the first heat dissipation component and the at least one second heat dissipation component, the first heat dissipation component is configured to be correspondingly disposed at a side of the central processing unit.

Abstract: The present disclosure provides a method for automatically optimizing power consumption. The method includes: (S1) a baseboard management controller determines whether system information is correct or not after powered on. If correct, further proceeding the method. If not correct, stopping further proceeding the method. (S2) the baseboard management controller periodically detects the surface temperature and the internal temperature of the essential element with a first loop cycle and determines whether the surface temperature or the internal temperature is higher than a preset temperature. (S3) If the surface temperature or the internal temperature is higher than the preset temperature, performing a PID adjustment to the fan rotation speed according to the surface temperature or the internal temperature of the essential element.

Abstract: The present application discloses a liquid cooling system for a cabinet server, which includes a primary side liquid circulation pipe, a distribution control device, and a secondary side liquid circulation pipe, and the primary side liquid circulation pipe is connected to the water filling device. The distribution control device is connected to the primary side liquid circulation pipe, and the secondary side liquid circulation pipe is connected to the distribution control device and at least one cabinet server. The liquid cooling system of the present application cools the cabinet server by liquid cooling, and the energy efficiency ratio of the liquid cooling system is below 1.3, there is almost no noise, no low filling water temperature is needed, natural cooling source is fully utilized, and the cooling tower can be used to meet the heat dissipation requirement.