Patents by Inventor Ping-Chih Liu

Ping-Chih Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12218106
    Abstract: In some embodiments, the present disclosure relates to a 3D integrated circuit (IC) stack that includes a first IC die bonded to a second IC die. The first IC die includes a first semiconductor substrate, a first interconnect structure arranged on a frontside of the first semiconductor substrate, and a first bonding structure arranged over the first interconnect structure. The second IC die includes a second semiconductor substrate, a second interconnect structure arranged on a frontside of the second semiconductor substrate, and a second bonding structure arranged on a backside of the second semiconductor substrate. The first bonding structure faces the second bonding structure. Further, the 3D IC stack includes a first backside contact that extends from the second bonding structure to the backside of the second semiconductor substrate and is thermally coupled to at least one of the first or second interconnect structures.
    Type: Grant
    Filed: July 25, 2023
    Date of Patent: February 4, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Yi-Shin Chu, Ping-Tzu Chen, Che-Wei Chen
  • Patent number: 12205868
    Abstract: The present disclosure, in some embodiments, relates to an integrated chip structure. The integrated chip structure includes a first via disposed within a dielectric structure on a substrate, and a second via disposed within the dielectric structure and laterally separated from the first via by the dielectric structure. The first via has a first width that is smaller than a second width of the second via. An interconnect wire vertically contacts the second via and extends laterally past an outermost sidewall of the second via. A through-substrate via (TSV) is arranged over the second via and extends through the substrate. The TSV has a minimum width that is smaller than the second width of the second via. The second via has opposing outermost sidewalls that are laterally outside of the TSV.
    Type: Grant
    Filed: July 20, 2023
    Date of Patent: January 21, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Yi-Shin Chu, Ping-Tzu Chen
  • Publication number: 20140239759
    Abstract: The purpose of the present invention is to provide a low-cost, easy-to-set-up and eco-friendly electric-generating apparatus with power-multiplying gear mechanisms. Its technical methods comprises of: an electric-generating apparatus and a base, with the electric-generating apparatus consisting of a drive gear, a driving motor, a transmission gear, a generator, and a control box. The biggest advantage the present invention has following this application has is that when generating electricity, aside from partial outside-energy, it can use a small part of its self-made energy to generate electricity, making its generating cost following its installment cheap with no other costs required aside from maintenance fees and salary payment for the management crew. The present invention, following its installment, can have a lifespan that would last decades, with little space required and completely unaffected by climate elements.
    Type: Application
    Filed: February 22, 2013
    Publication date: August 28, 2014
    Inventors: Ping-Chih Liu, Rong Chen
  • Publication number: 20130221673
    Abstract: A power generating unit based on self-generating energy sources, which is implemented by combination of the pool, water wheel, water guide channel, motor, waterproofing motor housing, water compression tube, water propeller and power generator as well as electrical control box; with this power generating unit, a small portion of self-generating energy could be applied to power generation, without need of additional fuel or energy sources; hence this is a weatherproof, most cost-effective and environmental-friendly power generating unit with longer service life and smaller space as well as minimum cost of protection, maintenance and management.
    Type: Application
    Filed: February 23, 2012
    Publication date: August 29, 2013
    Inventor: Ping-Chih Liu