Patents by Inventor Ping Chou Lin

Ping Chou Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR MICROSTRUCTURE MODIFICATION OF CONDUCTING LINES
    Publication number: 20220293467
    Abstract: A method for microstructure modification of conducting lines is provided. An electroplating process is performed to deposit the metal thin film/conducting line(s) with a face-centered cubic (FCC) structure and a preferred crystallographic orientation over a surface of a substrate. The metal thin film/ conducting line(s) is subsequently subjected to a thermal annealing process to modify its microstructure with the grain sizes in a range of 5 ?m to 100 ?m. The thermal annealing process is conducted at the temperature of above 25 degrees Celsius and below 240 degrees Celsius.
    Type: Application
    Filed: March 10, 2021
    Publication date: September 15, 2022
    Inventors: Cheng EN HO, Cheng Yu LEE, Ping Chou LIN, Chih Pin PAN, Chih Hao CHANG
  • Method for microstructure modification of conducting lines
    Patent number: 11430693
    Abstract: A method for microstructure modification of conducting lines is provided. An electroplating process is performed to deposit the metal thin film/conducting line(s) with a face-centered cubic (FCC) structure and a preferred crystallographic orientation over a surface of a substrate. The metal thin film/conducting line(s) is subsequently subjected to a thermal annealing process to modify its microstructure with the grain sizes in a range of 5 ?m to 100 ?m. The thermal annealing process is conducted at the temperature of above 25 degrees Celsius and below 240 degrees Celsius.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: August 30, 2022
    Assignee: YUAN ZE UNIVERSITY
    Inventors: Cheng En Ho, Cheng Yu Lee, Ping Chou Lin, Chih Pin Pan, Chih Hao Chang