Abstract: A new and improved method for exposing alignment marks on a substrate by locally cutting through a metal or non-metal layer or layers sequentially deposited on the substrate above the alignment marks, using focused ion beam (FIB) technology. In a preferred embodiment, a method for exposing alignment marks on a substrate can be carried out by first providing a substrate that has multiple alignment marks provided thereon and at least one overlying opaque layer, typically but not necessarily metal, deposited on the substrate above the alignment marks. A focused ion beam is then directed against the overlying opaque layer or layers to cut through the layer or layers and expose the alignment marks on the substrate. A noble gas, preferably argon, is typically used as the ion source for the focused ion beam.

Abstract: A housing for a backlight module is disclosed. The housing has a bottom casing and a side frame for holding a lighting unit, a light guide plate having a protrusion, and optionally a plurality of optical sheets. In particular, an indentation part is formed on the side frame for holding the protrusion, and a slit with unequal width is formed adjacent to the indentation part. A backlight module using the above-mentioned housing is also disclosed therewith.

Abstract: A method of integrating a post-etching cleaning process with deposition for a semiconductor device. A substrate having a damascene structure formed by etching a dielectric layer formed thereon using an overlying photoresist mask as an etching mask is provided. A cleaning process is performed by a supercritical fluid to remove the photoresist mask and post-etching by-products. An interconnect layer is formed in-situ in the damascene structure using the supercritical fluid as a reaction medium, wherein the cleaning process and the subsequent interconnect layer formation are performed in one process chamber or in different process chambers of a processing tool.

Abstract: The present invention provides a two-beam interference exposure system that can be simply adjusted by rotating only one mirror. By placing a half-wave plate in one of the interference arms and precisely scanning the relative fiber position, the present invention can expose true apodized fiber Bragg gratings in a single scan by simultaneously rotating the angle of the half-wave plate. By rotationally switching the fast and slow axes of the half-wave plate, the present invention can also expose n-phase-shifted fiber grating by the same system.

Abstract: The present invention provides a fabrication method of complex fiber grating structures that can be combined with prior fabrication methods including a phasemask or a two-beam interferometer. By using a rotatable half-wave plate with a polarization beam splitter in the optical path and precisely scanning the relative fiber position, we can expose true complex fiber gratings in a single scan by simultaneously rotating the angle of the half-wave plate.

Abstract: A method of forming an oxide layer. A fluid, such as water, is heated and pressurized to supercritical or near-supercritical conditions and mixed with at least one oxidizing agent. The supercritical state mixture of the fluid and at least one oxidizing agent is then applied on the workpiece, forming an oxide layer on the workpiece. The at least one oxidizing agent may comprise nitrogen, and the oxide layer formed on the workpiece may comprise a nitrogen doped oxide.

Abstract: When the memory device receives address information and byte information M, the memory device continuously provides M bytes corresponding to M addresses following an address assigned in the address information. The memory device includes: an address calculation module, an address buffer, a decoding module, a plurality of memory units and output buffers. Each output buffer is capable of receiving data of two units and sequentially outputting the data. When the address calculation module stores an address in the address buffer, the decoding module makes cells corresponding to the address simultaneously output data to the output buffers, such that the output buffers sequentially output data of respective unit. The address calculation module starts to count the next address, such that when the output buffer finishes outputting, the next address is already stored in the address buffer, and the decoding module has already made units corresponding to the next address output data.

Abstract: The present invention relates to a release agent for non-substrate liquid crystal display, comprising (a) 2-20 wt % of compounds selected from the group consisting of silicone, fluorine compounds and mixtures thereof, and (b) 0.5-30 wt % (based on the weight of (a)) of release modifier. The release agent is applied to the assisting substrates in the process of non-substrate liquid crystal display, so the assembled liquid crystal display element can be separated from the assisting substrates and a non-substrate liquid crystal display element is acquired.

Abstract: The present disclosure provides for a method and system for fabricating an insulating layer on a substrate. The method and system provide a fluid to a substrate, wherein the fluid is provided in an aerosol form. The method and system also provides for generating a supercritical process environment proximate to the substrate. The method and system further provides a proximate supercritical process environment having a supercritical process temperature and a supercritical process pressure for altering the fluid, and placing the substrate in contact with the altered fluid, wherein the insulating layer is formed on the substrate by a reaction between the substrate and the fluid.

Abstract: The present invention provides a photosensitive material for non-substrate liquid crystal display. This photosensitive material includes photo-initiator selected from the free-radical type or cation type photo-initiator or mixture thereof, photosensitive polymerizable monomers or oligomers selected from the group consisting of double-bond compounds, compounds having epoxy functional group and mixtures thereof, and modifier selected from the group consisting of long-alkyl-chain functional group, silicone-alkyl compounds, double-bond compounds and mixtures thereof. The photosensitive material can surround liquid crystal display cell and separate from assisting substrates that a non-substrate liquid crystal cell surrounded by photosensitive material is acquired.

Abstract: An interlocking device for locking a case includes first and second interlocking members. The first interlocking member is formed with a notch. The second interlocking member is formed with a button that is operable to rotate the second interlocking member from a first position, in which the first and second interlocking members engage each other and in which the button is received in the notch, to a second position, in which the first and second interlocking members disengage from each other and in which the button moves out of the notch.

Abstract: A planarizing method for forming a patterned planarized aperture fill layer within an aperture employs a planarizing stop layer formed of a reductant based material, such as but not limited to a hydrogenated silicon nitride material. The reductant based material provides the planarizing stop layer with enhanced planarizing stop properties. The method is particularly useful within the context of CMP planarizing methods.

Abstract: A method and system for monitoring the quality of a slurry utilized in a chemical mechanical polishing operation. A slurry is generally delivered through a tubular path during a chemical mechanical polishing operation. A laser light is generally transmitted from a laser light source, such that the laser light comes into contact with the slurry during the chemical mechanical polishing operation. The laser light can then be detected, after the laser light comes into contact with the slurry to thereby monitor the quality of the slurry utilized during the chemical mechanical polishing operation. The laser light that comes into contact with the slurry can be also be utilized to monitor a mixing ratio associated with the slurry.

Abstract: System and method for reducing damage to a semiconductor substrate when using cleaning fluids at elevated pressures to clean the semiconductor substrates. A preferred embodiment comprises applying the cleaning fluid at a first pressure for a first time period, wherein the first pressure is relatively low, and then increasing the pressure of the cleaning fluid to a pressure level that can effectively clean the semiconductor substrate and maintaining the pressure level for a second time period. The application of the cleaning fluid at the relatively low initial pressure acts as a temporary filler and creates a buffer of the cleaning fluid on the semiconductor substrate and helps to dampen the impact of the subsequent high pressure application of the cleaning fluid on the semiconductor substrate.

Abstract: The invention relates to disks for conditioning pads used in the chemical mechanical polishing of semiconductor wafers, and a method of fabricating the pads. In one embodiment, the conditioning pad includes multiple, pyramid-shaped, truncated protrusions which are cut or shaped in the surface of a typically stainless steel substrate. Each of the truncated protrusions includes a plateau in the top thereof. A seed layer, typically titanium nitride (TiN), is provided on the surface of the protrusions, and a contact layer such as diamond-like carbon (DLC) or other suitable film is provided over the seed layer. In another embodiment, each of the protrusions is pyramid-shaped and includes a pointed apex at the top thereof.

Abstract: An optical disc drive including a triggering switch and a control unit is disclosed. The triggering unit outputs a triggering signal while it is forced. The control unit, which is electrically coupled with a disc-ejection motor and the triggering switch, receives the triggering signal, and outputs a disc-ejection motor control signal when an optical disc rotates in the optical disc drive. The disc-ejection motor outputs a force opposite to the applied force while receiving the disc-ejection motor control signal so that the tray is restrained in the optical disc drive.

Abstract: System and method for reducing damage to a semiconductor substrate when using cleaning fluids at elevated pressures to clean the semiconductor substrates. A preferred embodiment comprises applying the cleaning fluid at a first pressure for a first time period, wherein the first pressure is relatively low, and then increasing the pressure of the cleaning fluid to a pressure level that can effectively clean the semiconductor substrate and maintaining the pressure level for a second time period. The application of the cleaning fluid at the relatively low initial pressure acts as a temporary filler and creates a buffer of the cleaning fluid on the semiconductor substrate and helps to dampen the impact of the subsequent high pressure application of the cleaning fluid on the semiconductor substrate.

Abstract: A method and system for monitoring the quality of a slurry utilized in a chemical mechanical polishing operation. A slurry is generally delivered through a tubular path during a chemical mechanical polishing operation. A laser light is generally transmitted from a laser light source, such that the laser light comes into contact with the slurry during the chemical mechanical polishing operation. The laser light can then be detected, after the laser light comes into contact with the slurry to thereby monitor the quality of the slurry utilized during the chemical mechanical polishing operation. The laser light that comes into contact with the slurry can be also be utilized to monitor a mixing ratio associated with the slurry.

Abstract: A method and system for monitoring the quality of a slurry utilized in a chemical mechanical polishing operation. A slurry is generally delivered through a tubular path during a chemical mechanical polishing operation. A laser light is generally transmitted from a laser light source, such that the laser light comes into contact with the slurry during the chemical mechanical polishing operation. The laser light can then be detected, after the laser light comes into contact with the slurry to thereby monitor the quality of the slurry utilized during the chemical mechanical polishing operation. The laser light that comes into contact with the slurry can be also be utilized to monitor a mixing ratio associated with the slurry.

Abstract: A method for wet etching a metal nitride containing layer overlying a silicon oxide containing layer in a semiconductor device or micro-electro-mechanical device manufacturing process including providing a substrate including a silicon oxide containing layer and an overlying exposed metal nitride containing layer; providing a wet etching solution including phosphoric acid and water; adding a silicon containing compound which undergoes a hydrolysis reaction in the wet etching solution; and, contacting the exposed metal nitride containing layer with the wet etching solution for a period of time to remove the metal nitride containing layer.