Patents by Inventor Ping Duan
Ping Duan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20160294243Abstract: An electrical submersible pump assembly has a motor with a stator stack of limitations. The stack has slots through which magnet wires are wound. An encapsulate surrounds and bonds the magnet wires together within each slot. The encapsulate includes ceramic particles within a polymer adhesive matrix. The polymer matrix may be a fluoropolymer adhesive. Each of the magnet wires may have an electrical insulation layer surrounding a copper core. The ceramic particles are rounded and much smaller than a cross-sectional area of each of the magnet wires. At least some of the magnet wires may be in contact with a perimeter of the slot. The polymer matrix fills all voids within each of the slots. The ceramic particles may be porous.Type: ApplicationFiled: March 21, 2016Publication date: October 6, 2016Inventor: Ping Duan
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Publication number: 20160145485Abstract: In one aspect, degradable material is disclosed, including: a polyurethane component with a first degradation rate in a downhole environment; and a corrosive additive component with a second degradation rate that is higher than a first degradation rate in the downhole environment. In another aspect, a method of temporarily sealing a downhole zone is disclosed, including: providing a polyurethane component with a first degradation rate in a downhole environment; providing a corrosive additive component with a second degradation rate that is higher than a first degradation rate in the downhole environment; mixing the polyurethane component and the corrosive additive component to form a degradable material; sealing the downhole zone with the degradable material; exposing the degradable material to the downhole environment; and degrading the degradable material.Type: ApplicationFiled: November 24, 2014Publication date: May 26, 2016Applicant: BAKER HUGHES INCORPORATEDInventors: James Doane, Wayne Furlan, Ping Duan, Sayantan Roy, Anil Sadana
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Publication number: 20160145964Abstract: In one aspect, a degradable apparatus is disclosed, including: an inner core with a first degradation rate in a downhole environment; an outer sheath disposed around an outer extent of the inner core with a second degradation rate less than the first degradation rate in the downhole environment. In another aspect, a method of temporarily sealing a downhole zone is disclosed, including: providing an inner core with a first degradation rate in a downhole environment; providing an outer sheath disposed around an outer extent of the inner core with a second degradation rate less than the first degradation rate in the downhole environment; sealing the downhole zone with the outer sheath; exposing the outer sheath to the downhole environment; and exposing the inner core to the downhole environment.Type: ApplicationFiled: November 24, 2014Publication date: May 26, 2016Applicant: Baker Hughes IncorporatedInventors: James Doane, Wayne Furlan, Ping Duan, Sayantan Roy, Anil Sadana
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Patent number: 9260568Abstract: A method of preparing a cured thermoplastic material includes curing a thermoplastic polymer having a thermal decomposition temperature greater than or equal to about 200° C., at a temperature of about 200° C. to about 400° C., for a total time of less than or equal to 200 hours. A method of making a shape memory material also includes curing a thermoplastic polymer to prepare a cured thermoplastic material.Type: GrantFiled: August 15, 2013Date of Patent: February 16, 2016Assignee: Baker Hughes IncorporatedInventors: Jiaxiang Ren, David Gerrard, James Edward Goodson, Ping Duan, Lillian Guo
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Patent number: 9195266Abstract: A bonding structure includes a first connecting part, a second connecting part and an adhesive. The first connecting part includes a top surface and a first joining surface opposite to the top surface. The second connecting part includes a mounting surface and defines a bonding groove on the mounting surface, the second connecting part further includes positioning members in the bonding groove. The adhesive is received in the bonding groove of the second connecting part, then the first connecting part is received in the bonding groove. The first joining surface is supported by the positioning members to position the first connecting part, the adhesive is located between the first joining surface and a bottom of the bonding groove to join the first and the second connecting part together. The present disclosure further discloses an electronic device using the bonding structure.Type: GrantFiled: October 1, 2012Date of Patent: November 24, 2015Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Ju-Ping Duan, Ming-Fu Luo, Fa-Guang Shi
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Patent number: 9181781Abstract: A method of making a reconfigurable article is disclosed. The method includes providing a powder comprising a plurality of base material particles. The method also includes providing a powder comprising a plurality of removable material particles; and forming a base article from the base material comprising a plurality of removable material particles. A method of using a reconfigurable article is also disclosed. The method includes forming a base article, the base article comprising a base material and a removable material, wherein the base article comprises a downhole tool or component. The method also includes inserting the base article into a wellbore. The method further includes performing a first operation utilizing the base article; exposing the removable material of the base article to a wellbore condition that is configured to remove the removable material and form a modified article; and performing a second operation using the article.Type: GrantFiled: June 30, 2011Date of Patent: November 10, 2015Assignee: Baker Hughes IncorporatedInventors: Gaurav Agrawal, Zhiyue Xu, Ping Duan, James Goodson, James B. Crews
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Patent number: 9144925Abstract: Disclosed is a process for making shape memory polyphenylene sulfide, comprising: curing polyphenylene sulfide to produce cured polyphenylene sulfide; comminuting the cured polyphenylene sulfide to form cured polyphenylene sulfide particles; disposing the cured polyphenylene sulfide particles in a mold; heating the mold for flowing the cured polyphenylene sulfide; compressing, by applying a compressive force, the cured polyphenylene sulfide; cooling the cured polyphenylene sulfide; relieving the compressive force; and de-molding the cured polyphenylene sulfide to produce the shape memory polyphenylene sulfide.Type: GrantFiled: January 4, 2012Date of Patent: September 29, 2015Assignee: Baker Hughes IncorporatedInventors: Jiaxiang Ren, David P. Gerrard, James E. Goodson, Ping Duan, Gaurav Agrawal
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Patent number: 9120898Abstract: A method of preparing a cured thermoplastic material includes curing a thermoplastic polymer having a thermal decomposition temperature greater than or equal to about 200° C., at a temperature of about 200° C. to about 400° C., for a total time of less than or equal to 200 hours. A method of making a shape memory material also includes curing a thermoplastic polymer to prepare a cured thermoplastic material.Type: GrantFiled: July 8, 2011Date of Patent: September 1, 2015Assignee: Baker Hughes IncorporatedInventors: Jiaxiang Ren, David Peter Gerrard, James Edward Goodson, Ping Duan, Lillian Guo
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Patent number: 9051819Abstract: A flow control device and a method of controlling a flow, the flow control device including a flow path for a fluid therethrough and a material at least partially defining the flow path, the material operatively arranged with a surface energy less than that of the fluid for passively impeding an undesirable component of the fluid more than a desirable component of the fluid.Type: GrantFiled: August 22, 2011Date of Patent: June 9, 2015Assignee: Baker Hughes IncorporatedInventors: Anil K. Sadana, Jiaxiang Ren, Ping Duan, David P. Gerrard
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Patent number: 9040818Abstract: An electronic device with an inbuilt mechanism sealing unused interface holes, or gaps, against dust is disclosed. The dust-proof mechanism includes two blocking members and two elastic members. The two blocking members are movably mounted on a bottom wall of a housing and close an interface hole in the manner of drawn curtains. The two blocking members are urged together by the elastic members. When an object is inserted into the interface hole, the guiding surfaces guide and ride over the inserted object, moving the two blocking members away from each other. When the object is pulled out of the interface hole, the two blocking members are moved back toward each other by the elastic members.Type: GrantFiled: August 30, 2013Date of Patent: May 26, 2015Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.Inventor: Ju-Ping Duan
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Patent number: 8980799Abstract: A method of deploying a borehole filtration device is provided utilizing the steps of: deploying a filtration device comprising a polymer foam having a first cell structure, a portion of the molecular structure of which polymer foam is degradable by exposure to a post-treatment fluid, into a borehole; and exposing the polymer foam to the post-treatment fluid, thereby modifying the cell structure of the polymer foam to a second cell structure.Type: GrantFiled: September 16, 2010Date of Patent: March 17, 2015Assignee: Baker Hughes IncorporatedInventors: Gaurav Agrawal, Ping Duan
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Patent number: 8939222Abstract: A downhole element to isolate or complete a wellbore includes a shape memory material including polyphenylene sulfide. The polyphenylene sulfide is the cure product of being cured at a temperature of about 200° C. to about 400° C., for a total time of less than or equal to 200 hours. The shape memory material is thermally activated between an actuated and unactuated shape, and the polyphenylene sulfide in the shape memory material is a closed cell foam, open cell foam, or solid.Type: GrantFiled: September 12, 2011Date of Patent: January 27, 2015Assignee: Baker Hughes IncorporatedInventors: Jiaxiang Ren, David P. Gerrard, James E. Goodson, Li Guo, Ping Duan
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Patent number: 8940841Abstract: A crosslinked product of a polyarylene is disclosed, having high-temperature elastomeric properties and excellent chemical resistance. The crosslinked materials are useful in oil and gas downhole applications in the form of either solids or foams. Methods for the manufacture of the crosslinked product and articles comprising the product are also disclosed.Type: GrantFiled: May 22, 2012Date of Patent: January 27, 2015Assignee: Baker Hughes IncorporatedInventors: Ping Duan, Gaurav Agrawal, David P. Gerrard
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Publication number: 20140374086Abstract: A reconfigurable downhole article is disclosed. The article comprises a base material. The article also comprises a removable material disposed on or within the base material that is configured for removal from the base material in response to a wellbore condition, wherein the base material and the removable material define a base article that is configured to perform a first function, and wherein upon removal of the removable material, the base material defines a modified article that is configured to perform a second function that is different than the first function.Type: ApplicationFiled: September 5, 2014Publication date: December 25, 2014Applicant: BAKER HUGHES INCORPORATEDInventors: Gaurav Agrawal, Zhiyue Xu, Ping Duan, James Goodson, Andre Porter, James B. Crews
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Patent number: 8902609Abstract: A portable electronic device includes a housing defining a mounting slot; and a chip card holding mechanism assembled within the housing for holding a chip card. The chip card holding mechanism includes a receiving tray slidably mounted on the housing, and an unlocking assembly for unlocking and ejecting the receiving tray. The receiving tray includes a tray body and a draw-off portion formed at one end of the tray body. The draw-off portion has an inclined resisting surface towards the tray body. The unlocking assembly is mounted in the housing and capable of resisting the inclined resisting surface to drive the receiving tray to move relative to the housing, and thereby eject the receiving tray.Type: GrantFiled: March 23, 2012Date of Patent: December 2, 2014Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Ju-Ping Duan, Ming-Fu Luo
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Patent number: 8902586Abstract: An electronic device includes a housing, a circuit board and a volume button. The housing defining a slot, and includes a fixing block. The fixing block is formed on an inner wall of the housing and positioned adjacent to one end of the slot. A through hole is formed in the fixing block. The circuit board received in the housing includes a volume control module and a mute control module positioned adjacent to the slot. The volume button is movably positioned in the slot and exposed out of the housing. The volume button includes a volume increasing portion and the volume decreasing portion. The volume increasing portion and the volume decreasing portion can be pushed on the volume control module. One end of the volume button passes through the through hole and is capable of triggering the mute control module.Type: GrantFiled: September 28, 2012Date of Patent: December 2, 2014Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Ju-Ping Duan, Ming-Fu Luo
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Patent number: 8897026Abstract: A locking assembly includes a guiding post and a hollow locking member. The guiding post includes a locking portion. A clamp hook is formed on a flange of the locking portion. The locking member includes an opening end. The locking member sleeves on the locking portion of the locking member, in which at least one clamping depression is formed on an inner wall of the locking member corresponding to the clamp hook, and the clamp hook is clamped in one clamping depression.Type: GrantFiled: May 18, 2012Date of Patent: November 25, 2014Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventor: Ju-Ping Duan
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Patent number: 8861223Abstract: An electronic device includes a housing and at least one connector assembly. The housing includes a bottom wall and a sidewall. The sidewall includes an outer side surface, a top surface and an inner side surface. At least one insertion interface is defined through the outer side surface. One resisting groove is defined on each end wall of the insertion interface. The top surface forms at least one receiving groove communicating with the corresponding insertion interface. Each connector assembly includes a connecting member and a connector. The connecting member includes a main body and two positioning ends protruding from the main body. The main body is received in the receiving groove. Each positioning end passes through the receiving groove and extends into the insertion interface to resist a side wall of one resisting groove. The connector is received in the insertion interface and resists between the two positioning ends.Type: GrantFiled: October 1, 2012Date of Patent: October 14, 2014Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Ju-Ping Duan, Ming-Fu Luo
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Patent number: 8829119Abstract: A crosslinked product of a polyarylene is disclosed, having high-temperature elastomeric properties and excellent chemical resistance. The crosslinked materials are useful in oil and gas downhole applications in the form of either solids or foams. Methods for the manufacture of the crosslinked product and articles comprising the product are also disclosed.Type: GrantFiled: September 27, 2011Date of Patent: September 9, 2014Assignee: Baker Hughes IncorporatedInventors: Ping Duan, Gaurav Agrawal, David P. Gerrard
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Publication number: 20140167312Abstract: A method of preparing a cured thermoplastic material includes curing a thermoplastic polymer having a thermal decomposition temperature greater than or equal to about 200° C., at a temperature of about 200° C. to about 400° C., for a total time of less than or equal to 200 hours. A method of making a shape memory material also includes curing a thermoplastic polymer to prepare a cured thermoplastic material.Type: ApplicationFiled: August 15, 2013Publication date: June 19, 2014Applicant: BAKER HUGHES INCORPORATEDInventors: Jiaxiang Ren, David Gerrard, James Edward Goodson, Ping Duan, Lillian Guo