Patents by Inventor Ping-Feng Hsu

Ping-Feng Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240127109
    Abstract: A federated learning method includes: providing importance parameters and performance parameters by client devices respectively to a central device, performing a training procedure by the central device, wherein the training procedure includes: selecting target devices from the client devices according to a priority order associated with the importance parameters, dividing the target devices into training groups according to a similarity of the performance parameters, notifying the target devices to perform iterations according to the training groups respectively to generate trained models, transmitting the trained models to the central device, and updating a global model based on the trained models, performing the training procedure again or outputting the global model to the client devices based on a convergence value of the global model and the number of times of performing the training procedure.
    Type: Application
    Filed: November 10, 2022
    Publication date: April 18, 2024
    Applicant: INSTITUTE FOR INFORMATION INDUSTRY
    Inventors: Ping Feng WANG, Chiun Sheng HSU, Chi-Yuan CHOU, Fu-Chiang CHANG
  • Publication number: 20160278250
    Abstract: According to various aspects, exemplary embodiments are disclosed of shielding apparatus or assemblies including electrically-conductive foam. Also disclosed are exemplary embodiments of methods relating to making shielding apparatus or assemblies including electrically-conductive foam. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate.
    Type: Application
    Filed: May 27, 2016
    Publication date: September 22, 2016
    Inventors: Ming Yueh Liu, Yi-Shen Lin, Jui-lung Tsao, Ping-Feng Hsu
  • Patent number: 9357683
    Abstract: According to various aspects, exemplary embodiments are disclosed of shielding apparatus or assemblies including electrically-conductive foam frames and covers or lids attachable to the frames. Also disclosed are exemplary embodiments of electrically-conductive foam frames for shielding apparatus or assemblies. Further, exemplary embodiments are disclosed of methods relating to making shielding apparatus or assemblies including electrically-conductive foam frames. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate.
    Type: Grant
    Filed: October 14, 2014
    Date of Patent: May 31, 2016
    Assignee: Laird Technologies, Inc.
    Inventors: Ming Yueh Liu, Yi-Shen Lin, Jui-Iung Tsao, Ping-Feng Hsu
  • Publication number: 20160095266
    Abstract: According to various aspects, exemplary embodiments are disclosed of shielding apparatus or assemblies including electrically-conductive foam frames and covers or lids attachable to the frames. Also disclosed are exemplary embodiments of electrically-conductive foam frames for shielding apparatus or assemblies. Further, exemplary embodiments are disclosed of methods relating to making shielding apparatus or assemblies including electrically-conductive foam frames. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate.
    Type: Application
    Filed: October 14, 2014
    Publication date: March 31, 2016
    Inventors: Ming Yueh Liu, Yi-Shen Lin, Jui-lung Tsao, Ping-Feng Hsu
  • Patent number: 7429907
    Abstract: The present invention relates to a power inductor having a heat dissipating structure formed on the surface thereof, which comprises: at least a conducting wire; and a cladding, made of a magnetic material for wrapping the conductive wire, having the heat dissipating structure of embossed patterns formed on the surface thereof. Preferably, the embossed pattern can be a cone, a cuboid, a column, or the combination thereof. Moreover, the length of any edge or the diameter of any one of the embossed patterns is about 1%˜50% of that of the power inductor, and the height of any one of the embossed patterns is about 1%˜50% of the thickness of the power inductor.
    Type: Grant
    Filed: October 27, 2006
    Date of Patent: September 30, 2008
    Assignee: Industrial Technology Research Institu
    Inventors: Mean-Jue Tung, Wen-Song Ko, Yu-Ting Huang, Ping-Feng Hsu, Yen-Ping Wang
  • Publication number: 20070152792
    Abstract: The present invention relates to a power inductor having a heat dissipating structure formed on the surface thereof, which comprises: at least a conducting wire; and a cladding, made of a magnetic material for wrapping the conductive wire, having the heat dissipating structure of embossed patterns formed on the surface thereof. Preferably, the embossed pattern can be a cone, a cuboid, a column, or the combination thereof. Moreover, the length of any edge or the diameter of any one of the embossed patterns is about 1%˜50% of that of the power inductor, and the height of any one of the embossed patterns is about 1%˜50% of the thickness of the power inductor.
    Type: Application
    Filed: October 27, 2006
    Publication date: July 5, 2007
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Mean-Jue Tung, Wen-Song Ko, Yu-Ting Huang, Ping-Feng Hsu, Yen-Ping Wang