Abstract: According to various aspects, exemplary embodiments are disclosed of shielding apparatus or assemblies including electrically-conductive foam. Also disclosed are exemplary embodiments of methods relating to making shielding apparatus or assemblies including electrically-conductive foam. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate.

Abstract: According to various aspects, exemplary embodiments are disclosed of shielding apparatus or assemblies including electrically-conductive foam frames and covers or lids attachable to the frames. Also disclosed are exemplary embodiments of electrically-conductive foam frames for shielding apparatus or assemblies. Further, exemplary embodiments are disclosed of methods relating to making shielding apparatus or assemblies including electrically-conductive foam frames. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate.

Abstract: According to various aspects, exemplary embodiments are disclosed of shielding apparatus or assemblies including electrically-conductive foam frames and covers or lids attachable to the frames. Also disclosed are exemplary embodiments of electrically-conductive foam frames for shielding apparatus or assemblies. Further, exemplary embodiments are disclosed of methods relating to making shielding apparatus or assemblies including electrically-conductive foam frames. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate.

Abstract: The present invention relates to a power inductor having a heat dissipating structure formed on the surface thereof, which comprises: at least a conducting wire; and a cladding, made of a magnetic material for wrapping the conductive wire, having the heat dissipating structure of embossed patterns formed on the surface thereof. Preferably, the embossed pattern can be a cone, a cuboid, a column, or the combination thereof. Moreover, the length of any edge or the diameter of any one of the embossed patterns is about 1%˜50% of that of the power inductor, and the height of any one of the embossed patterns is about 1%˜50% of the thickness of the power inductor.

Abstract: The present invention relates to a power inductor having a heat dissipating structure formed on the surface thereof, which comprises: at least a conducting wire; and a cladding, made of a magnetic material for wrapping the conductive wire, having the heat dissipating structure of embossed patterns formed on the surface thereof. Preferably, the embossed pattern can be a cone, a cuboid, a column, or the combination thereof. Moreover, the length of any edge or the diameter of any one of the embossed patterns is about 1%˜50% of that of the power inductor, and the height of any one of the embossed patterns is about 1%˜50% of the thickness of the power inductor.