Abstract: A signal sensing device includes a signal amplifying structure to amplify the strength of the measured signal. The signal sensing device includes a body, a signal sensing element, and a signal amplifying portion. The signal sensing element is disposed in the body and includes a signal transmission section and a signal sensing section in electrical connection with the signal transmission section. The signal amplifying portion includes a plurality of protruding structures protruding outward from the body. Each of the plurality of protruding structures is cylindrical and has a diameter of 250-400 ?m and a height of 40-75 ?m. When a portion of the body forms a surrounding portion surrounding a to-be-sensed target, a portion or an entirety of the signal sensing section is located on the surrounding portion, and the signal amplifying portion is partially or entirely in contact with the to-be-sensed target.

Abstract: A signal sensing device includes a body and two signal sensing elements disposed in the body. An insulating layer is sandwiched between the two signal sensing elements. Each of the two signal sensing elements incudes a signal transmission section and a signal sensing section in electrical connection with the signal transmission section. The signal transmission sections are planar antennae parallel to each other and each having an antenna shape of meander-line type. The antenna shape of each transmission section has a vertical projection on a plane parallel to each signal transmission section. The vertical projections of the antenna shapes do not overlap completely. When a portion of the body forms a surrounding portion which surrounds a to-be-sensed target, a portion or an entirety of each signal sensing section is located on the surrounding portion.

Abstract: A continuous laser processing system for internal modification of transparent materials includes a pulse laser device, a scanning device, a processing platform and a control device. The pulse laser device is configured to output a laser beam. The scanning device includes a mirror group controller and a mirror group and controlled to guide the laser beam to the transparent material, wherein the mirror group is disposed at an output path of the laser beam. The processing platform is configured to carry the transparent material and controlled to move. The control device is electrically connected to the scanning device and the processing platform, and is configured to control the scanning device to form a processing trajectory at the transparent material at a scanning speed, and to control the processing platform to move at a translation speed, wherein the scanning speed is at least 20 times the translation speed.

Abstract: Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.

Abstract: A laser machining device includes a pulsed laser generator, an accommodation chamber, a bandwidth broadening unit and a pulse compression unit. The pulsed laser generator is configured to emit a pulsed laser. The accommodation chamber has a gas inlet. The bandwidth broadening unit is disposed in the accommodation chamber, and is configured to broaden a frequency bandwidth of the pulsed laser to obtain a broad bandwidth pulsed laser. The pulse compression unit is disposed in the accommodation chamber. The bandwidth broadening unit and the pulse compression unit are arranged in order along a laser propagation path, and the pulse compression unit is configured to compress a pulse duration of the broad bandwidth pulsed laser.

Abstract: This disclosure provides a composite beam generator and a method of performing powder melting or sintering in additive manufacturing process using the same. The composite beam generator comprises: a beam splitter for splitting a beam into a first directed beam and a second directed beam; a beam shaper for shaping a transverse energy distribution profile of the second directed beam to non-circular; at least one beam delivery unit for guiding the first directed beam or the second directed beam; and a beam combiner for receiving the first directed beam and the second directed beam, and respectively generating a first output beam and a second output beam, and combining them into the composite beam.

Abstract: This disclosure provides a composite beam generator and a method of performing powder melting or sintering in additive manufacturing process using the same. The composite beam generator comprises: a beam splitter for splitting a beam into a first directed beam and a second directed beam; a beam shaper for shaping a transverse energy distribution profile of the second directed beam to non-circular; at least one beam delivery unit for guiding the first directed beam or the second directed beam; and a beam combiner for receiving the first directed beam and the second directed beam, and respectively generating a first output beam and a second output beam, and combining them into the composite beam.

Abstract: A method of annealing and real-time monitoring by applying laser beam includes steps of emitting a laser beam and splitting it into a first light beam and a second light beam; irradiating the first light beam along a first path at a to-be-annealed work-piece in order to process annealing for the work-piece; irradiating the second light beam along a second path at the to-be-annealed work-piece; having the to-be-annealed work-piece changed to an annealed work-piece after the process of annealing is completed for the to-be-annealed work-piece; retrieving a characteristic of a characteristic of changes of properties of matter generated from the second light beam irradiated at the to-be-annealed work-piece and the annealed work-piece.

Abstract: A dual pulsed light generation apparatus including a polarization beam splitter (PBS), a first polarization reflector, and a second polarization reflector is provided. The PBS has a first plane, a second plane, and a dividing interface located between the first plane and the second plane. The PBS is located in the transmission path of an incident pulsed light and used for dividing the incident pulsed light into a first polarization pulsed light reflected by the dividing interface and a second polarization pulsed light passing through the dividing interface. The first polarization reflector is disposed opposite to the first plane and transforms the first polarization pulsed light into a third polarization pulsed light passing through the dividing interface. The first polarization reflector is disposed opposite to the second plane.

Abstract: A dual pulsed light generation apparatus including a polarization beam splitter (PBS), a first polarization reflector, and a second polarization reflector is provided. The PBS has a first plane, a second plane, and a dividing interface located between the first plane and the second plane. The PBS is located in the transmission path of an incident pulsed light and used for dividing the incident pulsed light into a first polarization pulsed light reflected by the dividing interface and a second polarization pulsed light passing through the dividing interface. The first polarization reflector is disposed opposite to the first plane and transforms the first polarization pulsed light into a third polarization pulsed light passing through the dividing interface. The first polarization reflector is disposed opposite to the second plane.

Abstract: A method for streaming multi-LOD design feature of a 3D-CAD model comprises defining a LOD of a 3D-CAD model with each design feature of the 3D-CAD model, wherein the design feature is the smallest 3D-CAD model constructing unit; constructing the LOD of the 3D-CAD model into a decomposition data structure of LOD design feature recording each design feature of the 3D-CAD model in different LODs, wherein the LOD comprises all unit assembly faces of the design features; constructing a switch face display mechanism controlling whether each design feature of the 3D-CAD model is displayed; and encapsulating a designated design feature into a packet based on users' configuration and transmitting the packet.