Patents by Inventor Ping-Hao LIN

Ping-Hao LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12016169
    Abstract: A memory device includes a memory array having a plurality of memory cells. Each memory cell of the plurality of memory cells includes a substrate having a front side and a back side with a transistor of the memory cell being formed on the front side and the back side being opposite of the front side, a first interconnect layer on the front side to provide a bit line of the memory cell, a second interconnect layer on the front side to provide a word line of the memory cell, a third interconnect layer on the back side to provide a supply voltage to the memory cell and a fourth interconnect layer on the back side to provide a ground voltage to the memory cell, widths of the bit line and the word line being chosen to reduce current-resistance drop.
    Type: Grant
    Filed: June 16, 2022
    Date of Patent: June 18, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ping-Wei Wang, Lien Jung Hung, Kuo-Hsiu Hsu, Kian-Long Lim, Yu-Kuan Lin, Chia-Hao Pao, Chih-Chuan Yang, Shih-Hao Lin, Choh Fei Yeap
  • Publication number: 20240153949
    Abstract: Various embodiments of the present disclosure are directed towards a method for forming an integrated chip (IC). The method includes forming a first fin of semiconductor material and a second fin of semiconductor material within a semiconductor substrate. A gate structure is formed over the first fin and source/drain regions are formed on or within the first fin. The source/drain regions are formed on opposite sides of the gate structure. One or more pick-up regions are formed on or within the second fin. The source/drain regions respectively have a first width measured along a first direction parallel to a long axis of the first fin and the one or more pick-up regions respectively have a second width measured along the first direction. The second width is larger than the first width.
    Type: Application
    Filed: January 4, 2024
    Publication date: May 9, 2024
    Inventors: Hsin-Wen Su, Lien Jung Hung, Ping-Wei Wang, Wen-Chun Keng, Chih-Chuan Yang, Shih-Hao Lin
  • Patent number: 11978751
    Abstract: An electrode controls transmittance of a blocking layer over a photodiode of a pixel sensor (e.g., a photodiode of a small pixel detector) by changing oxidation of a metal material included in the blocking layer. By using the electrode to adjust transmittance of the blocking layer, pixel sensors for different uses and/or products may be produced using a single manufacturing process. As a result, power and processing resources are conserved that otherwise would have been expended in switching manufacturing processes. Additionally, production time is decreased (e.g., by eliminating downtime that would otherwise have been used to reconfigure fabrication machines.
    Type: Grant
    Filed: January 10, 2023
    Date of Patent: May 7, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Li-Wen Huang, Chung-Liang Cheng, Ping-Hao Lin, Kuo-Cheng Lee
  • Patent number: 11980016
    Abstract: A semiconductor device according to the present disclosure includes a gate extension structure, a first source/drain feature and a second source/drain feature, a vertical stack of channel members extending between the first source/drain feature and the second source/drain feature along a direction, and a gate structure wrapping around each of the vertical stack of channel members. The gate extension structure is in direct contact with the first source/drain feature.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: May 7, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Chuan Yang, Chia-Hao Pao, Yu-Kuan Lin, Lien-Jung Hung, Ping-Wei Wang, Shih-Hao Lin
  • Patent number: 11956948
    Abstract: A memory device includes a substrate, a first transistor and a second transistor, a first word line, a second word line, and a bit line. The first transistor and the second transistor are over the substrate and are electrically connected to each other, in which each of the first and second transistors includes first semiconductor layers and second semiconductor layers, a gate structure, and source/drain structures, in which the first semiconductor layers are in contact with the second semiconductor layers, and a width of the first semiconductor layers is narrower than a width of the second semiconductor layers. The first word line is electrically connected to the gate structure of the first transistor. The second word line is electrically connected to the gate structure of the second transistor. The bit line is electrically connected to a first one of the source/drain structures of the first transistor.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: April 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsin-Wen Su, Yu-Kuan Lin, Shih-Hao Lin, Lien-Jung Hung, Ping-Wei Wang
  • Patent number: 11948954
    Abstract: An electrode controls transmittance of a blocking layer over a photodiode of a pixel sensor (e.g., a photodiode of a small pixel detector) by changing oxidation of a metal material included in the blocking layer. By using the electrode to adjust transmittance of the blocking layer, pixel sensors for different uses and/or products may be produced using a single manufacturing process. As a result, power and processing resources are conserved that otherwise would have been expended in switching manufacturing processes. Additionally, production time is decreased (e.g., by eliminating downtime that would otherwise have been used to reconfigure fabrication machines.
    Type: Grant
    Filed: January 10, 2023
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Li-Wen Huang, Chung-Liang Cheng, Ping-Hao Lin, Kuo-Cheng Lee
  • Publication number: 20240096917
    Abstract: An image sensor structure includes a semiconductor substrate, a plurality of image sensing elements, a reflective element, and a high-k dielectric structure. The image sensing elements are in the semiconductor substrate. The reflective element is in the semiconductor substrate and between the image sensing elements. The high-k dielectric structure is between the reflective element and the image sensing elements.
    Type: Application
    Filed: January 6, 2023
    Publication date: March 21, 2024
    Inventors: PO CHUN CHANG, PING-HAO LIN, WEI-LIN CHEN, KUN-HUI LIN, KUO-CHENG LEE
  • Publication number: 20240087945
    Abstract: Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Inventors: Tsai-Hao HUNG, Ping-Cheng KO, Tzu-Yang LIN, Fang-Yu LIU, Cheng-Han WU
  • Patent number: 11925440
    Abstract: A single smart health device able to monitor all physiological aspects of a human body includes a body fluid detection module, a temperature detection module, an electrocardiogram detection module, and a control module. The body fluid detection module tests and detects amounts of biological substances in body fluids. The temperature detection module detects a temperature of the human body. The electrocardiogram detection module detects a heart rate of the human body. The control module is electrically connected to the body fluid detection module, the temperature detection module, and the electrocardiogram detection module, and obtains the detected amounts of biological substances, the detected temperature, and the detected heart rate.
    Type: Grant
    Filed: June 19, 2020
    Date of Patent: March 12, 2024
    Assignee: Jiangyu Kangjian Innovation Medical Technology(Chengdu) Co., Ltd
    Inventors: Yu-Chao Li, Lien-Yu Lin, Ying-Wei Sheng, Chieh Kuo, Ping-Hao Liu
  • Publication number: 20240063234
    Abstract: The present disclosure relates to a CMOS image sensor, and an associated method of formation. In some embodiments, the CMOS image sensor comprises a substrate and a transfer gate disposed from a front-side surface of the substrate. The CMOS image sensor further comprises a photo detecting column disposed at one side of the transfer gate within the substrate. The photo detecting column comprises a doped sensing layer comprising one or more recessed portions along a circumference of the doped sensing layer in parallel to the front-side surface of the substrate. By forming the photo detecting column with recessed portions, a junction interface is enlarged compared to a previous p-n junction interface without recessed portions, and thus a full well capacity of the photodiode structure is improved.
    Type: Application
    Filed: November 2, 2023
    Publication date: February 22, 2024
    Inventors: Chia-Yu Wei, Hsin-Chi Chen, Kuo-Cheng Lee, Ping-Hao Lin, Hsun-Ying Huang, Yen-Liang Lin, Yu Ting Kao
  • Publication number: 20240030262
    Abstract: A semiconductor structure is disclosed. The semiconductor structure includes a number of pixels and neighboring pixels are isolated by deep trench isolation structures. In an embodiment, a method of forming the semiconductor structure includes epitaxially growing a p-type semiconductor layer on a substrate, epitaxially growing an n-type semiconductor layer over the p-type semiconductor layer, after the epitaxially growing of the n-type semiconductor layer, forming a p-type well in the n-type semiconductor layer, forming an n-type doped region in the n-type semiconductor layer and surrounded by the p-type well, forming a first trench extending through the n-type semiconductor layer and the p-type semiconductor layer and surrounding the p-type well, and forming a first isolation structure in the first trench.
    Type: Application
    Filed: March 14, 2023
    Publication date: January 25, 2024
    Inventors: Po Chun Chang, Ping-Hao Lin, Kun-Hui Lin, Kuo-Cheng Lee
  • Publication number: 20240021469
    Abstract: A method includes bonding a first wafer to a second wafer. The first wafer includes a plurality of dielectric layers, a metal pipe penetrating through the plurality of dielectric layers, and a dielectric region encircled by the metal pipe. The dielectric region has a plurality of steps formed of sidewalls and top surfaces of portions of the plurality of dielectric layers that are encircled by the metal pipe. The method further includes etching the first wafer to remove the dielectric region and to leave an opening encircled by the metal pipe, extending the opening into the second wafer to reveal a metal pad in the second wafer, and filling the opening with a conductive material to form a conductive plug in the opening.
    Type: Application
    Filed: July 21, 2023
    Publication date: January 18, 2024
    Inventors: Ssu-Chiang Weng, Ping-Hao Lin, Fu-Cheng Chang
  • Publication number: 20240014231
    Abstract: A photosensor includes a substrate, a photo-detecting column, a gate structure, a floating node structure and a channel structure. The substrate has a first doping type. The photo-detecting column has a second doping type and is disposed in the substrate. The gate structure is disposed on the substrate in a vertical direction, and is electrically insulated from the photo-detecting column. The floating node structure is disposed on the gate structure opposite to the photo-detecting column in the vertical direction, and is electrically insulated from the gate structure. The channel structure extends through the gate structure, is electrically insulated from the gate structure, and is electrically connected to the photo-detecting column and the floating node structure.
    Type: Application
    Filed: September 25, 2023
    Publication date: January 11, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: P.C. CHANG, Ping-Hao LIN, Kuo-Cheng LEE
  • Publication number: 20230402480
    Abstract: A method of manufacturing a semiconductor device includes disposing a plurality of a first type of light sensing units on a substrate; and disposing a plurality of a second type of light sensing units arranged on the substrate. Each of the first type of light sensing units is operable to receive less radiation than each of the second type of light sensing units. At least one of the second type of light sensing units is adjacent to a portion of at least one of the first type of light sensing units. The method includes disposing a first isolation structure between one of the first type of light sensing units and one of the second type of light sensing units; and disposing a second isolation structure between the adjacent first type of light sensing units. The method includes disposing a reflective layer above the first type of light sensing units.
    Type: Application
    Filed: August 10, 2023
    Publication date: December 14, 2023
    Inventors: Li-Wen HUANG, Chung-Lin FANG, Kuan-Ling PAN, Ping-Hao LIN, Kuo-Cheng LEE, Cheng-Ming WU
  • Patent number: 11843007
    Abstract: The present disclosure relates to a CMOS image sensor, and an associated method of formation. In some embodiments, the CMOS image sensor comprises a substrate and a transfer gate disposed from a front-side surface of the substrate. The CMOS image sensor further comprises a photo detecting column disposed at one side of the transfer gate within the substrate. The photo detecting column comprises a doped sensing layer comprising one or more recessed portions along a circumference of the doped sensing layer in parallel to the front-side surface of the substrate. By forming the photo detecting column with recessed portions, a junction interface is enlarged compared to a previous p-n junction interface without recessed portions, and thus a full well capacity of the photodiode structure is improved.
    Type: Grant
    Filed: November 17, 2021
    Date of Patent: December 12, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Yu Wei, Hsin-Chi Chen, Kuo-Cheng Lee, Ping-Hao Lin, Hsun-Ying Huang, Yen-Liang Lin, Yu Ting Kao
  • Publication number: 20230387158
    Abstract: In some embodiments, an image sensor is provided. The image sensor comprises a first photodetector disposed within a front-side surface of a semiconductor substrate. A trench isolation structure is disposed over a back-side surface of the semiconductor substrate. The trench isolation structure includes a buffer layer and a dielectric liner. The buffer layer covers the back-side surface of the semiconductor substrate and fills trenches that extend downward into the back-side surface of the semiconductor substrate. The dielectric liner is disposed between the buffer layer and the semiconductor substrate. A composite grid structure has composite grid segments that are aligned over the trenches, respectively. The buffer layer separates the dielectric liner from the composite grid structure. A light shield structure is disposed within the buffer layer and directly overlies the first photodetector.
    Type: Application
    Filed: August 3, 2023
    Publication date: November 30, 2023
    Inventors: Shih-Hsun Hsu, Ping-Hao Lin
  • Patent number: 11791205
    Abstract: A method includes bonding a first wafer to a second wafer. The first wafer includes a plurality of dielectric layers, a metal pipe penetrating through the plurality of dielectric layers, and a dielectric region encircled by the metal pipe. The dielectric region has a plurality of steps formed of sidewalls and top surfaces of portions of the plurality of dielectric layers that are encircled by the metal pipe. The method further includes etching the first wafer to remove the dielectric region and to leave an opening encircled by the metal pipe, extending the opening into the second wafer to reveal a metal pad in the second wafer, and filling the opening with a conductive material to form a conductive plug in the opening.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: October 17, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ssu-Chiang Weng, Ping-Hao Lin, Fu-Cheng Chang
  • Patent number: 11764062
    Abstract: A method of forming a semiconductor structure is disclosed. A multi-layer structure is formed over a substrate. A photoresist stack with a stepped sidewall is formed on the multi-layer structure. A pattern of the photoresist stack is transferred to the multi-layer structure.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: September 19, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ping-Hao Lin, Fu-Cheng Chang
  • Publication number: 20220271076
    Abstract: A photosensor includes a substrate, a photo-detecting column, a gate structure, a floating node structure and a channel structure. The substrate has a first doping type. The photo-detecting column has a second doping type and is disposed in the substrate. The gate structure is disposed on the substrate in a vertical direction, and is electrically insulated from the photo-detecting column. The floating node structure is disposed on the gate structure opposite to the photo-detecting column in the vertical direction, and is electrically insulated from the gate structure. The channel structure extends through the gate structure, is electrically insulated from the gate structure, and is electrically connected to the photo-detecting column and the floating node structure.
    Type: Application
    Filed: February 25, 2021
    Publication date: August 25, 2022
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: P.C. CHANG, Ping-Hao LIN, Kuo-Cheng LEE
  • Publication number: 20220165771
    Abstract: A pixel array may include a plurality of pixel regions including a first pixel region and a second pixel region. The pixel array may include a metal grid structure over the plurality of pixel regions. The pixel array may include a light blocking layer. A first portion of the light blocking layer may be over the first pixel region and under the metal grid structure. The first portion may have a first thickness. A second portion of the light blocking layer may be over the second pixel region and under the metal grid structure. The second portion may have a second thickness that is different from the first thickness.
    Type: Application
    Filed: November 20, 2020
    Publication date: May 26, 2022
    Inventors: Chun-Lin FANG, Ping-Hao LIN, Kuo-Cheng LEE