Patents by Inventor Ping-Ho Chu

Ping-Ho Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Transistor heat dissipation module and assembly method thereof
    Patent number: 11482469
    Abstract: A transistor heat dissipation module is adapted for at least one transistor. The transistor heat dissipation module includes a heat dissipation member and an elastic member. The heat dissipation member includes a first wall and a second wall opposite to each other and a first connecting member connected to the first wall and the second wall. An accommodating space is formed between the first wall and the second wall. The transistor is disposed in the accommodating space. The elastic member is disposed in the accommodating space and is located between the at least one transistor and the first wall to press the at least one transistor against the second wall. An assembly method of a transistor heat dissipation module is further provided.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: October 25, 2022
    Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Lite-On Technology Corporation
    Inventors: Cheng-Chung Chiang, Yu-Po Chen, Ping-Ho Chu, Chih-Chun Yu
  • TRANSISTOR HEAT DISSIPATION MODULE AND ASSEMBLY METHOD THEREOF
    Publication number: 20210272876
    Abstract: A transistor heat dissipation module is adapted for at least one transistor. The transistor heat dissipation module includes a heat dissipation member and an elastic member. The heat dissipation member includes a first wall and a second wall opposite to each other and a first connecting member connected to the first wall and the second wall. An accommodating space is formed between the first wall and the second wall. The transistor is disposed in the accommodating space. The elastic member is disposed in the accommodating space and is located between the at least one transistor and the first wall to press the at least one transistor against the second wall. An assembly method of a transistor heat dissipation module is further provided.
    Type: Application
    Filed: April 20, 2020
    Publication date: September 2, 2021
    Applicants: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Lite-On Technology Corporation
    Inventors: Cheng-Chung Chiang, Yu-Po Chen, Ping-Ho Chu, Chih-Chun Yu