Abstract: A semiconductor package structure with a heat sink is disclosed herein. The semiconductor package structure includes a substrate having a chip mounting area and a plurality of through holes surrounding the chip mounting area; a chip set on the chip mounting area and electrically connected to the substrate; a heat sink covering the chip, wherein the heat sink has a plurality of support portions extending from the upper surface to the lower surface of the substrate via those through holes; and a molding compound covering the chip, a portion of the substrate and the heat sink. Those support portions of the heat sink are utilized to improve the heat dissipation efficiency and the warpage issue of the package.