Abstract: The present disclosure provides an electronic package. The electronic package includes a substrate, an electronic component, a plurality of conductive elements, a metal sheet and a molding layer. The electronic component is disposed on the substrate and electrically connected to the substrate. The conductive elements are disposed on the substrate and electrically connected with the grounding circuit on the substrate. The metal sheet is disposed above the electronic component and is in electrical contact with the conductive elements. The molding layer is formed between the substrate and the metal sheet to enclose the electronic component and the conductive elements. The present disclosure further provides a method of manufacturing the above electronic package.

Abstract: The present disclosure provides an electronic package. The electronic package includes a substrate, an electronic component, a plurality of conductive elements, a metal sheet and a molding layer. The electronic component is disposed on the substrate and electrically connected to the substrate. The conductive elements are disposed on the substrate and electrically connected with the grounding circuit on the substrate. The metal sheet is disposed above the electronic component and is in electrical contact with the conductive elements. The molding layer is formed between the substrate and the metal sheet to enclose the electronic component and the conductive elements. The present disclosure further provides a method of manufacturing the above electronic package.

Abstract: A wireless digital data storage device mounted in a pen shaped housing has a barrel, a reservoir tube assembly and a memory device. The memory device is held in the barrel and the memory device having a controller, a memory unit, a wireless communicating unit and a display. The controller is electronically connected to the memory unit, the wireless communicating unit and the display. The wireless communicating unit is used to link to computer device to transmit data stored in the memory or receive data from the computer device. Therefore, the wireless digital data storage device can be used to access, store and exchange digital data in wireless way and to perform writing function.

Abstract: A chip package with COB configuration is disclosed. A thin film substrate as a carrier of a wire-bonded chip has a slot, wherein the electrical connection between the chip and the thin film substrate are a plurality of bonding wires through the slot. The thin film substrate includes a patterned metal core with resin and at least a solder resist layer on the patterned metal core, wherein the patterned metal core has a plurality of finger pads and a plurality of ball pads. The finger pads are disposed around the slot. When the active surface of the chip is attached to the thin film substrate, the patterned metal core provides a good thermal dissipation for the chip. Moreover, the chip package using thin film substrates can reduce the cost of the substrate and the overall thickness of the package and enhance the cushion effect against thermal stress.