Abstract: A semiconductor package including two different adhesives and a method of forming are provided. The semiconductor package may include a package component having a semiconductor die bonded to a substrate, a first adhesive over the substrate, a heat transfer layer on the package component, and a lid attached to the substrate by a second adhesive. The first adhesive may encircle the package component and the heat transfer layer. The lid may include a top portion on the heat transfer layer and the first adhesive, and a bottom portion attached to the substrate and encircling the first adhesive. A material of the second adhesive may be different from a material of the first adhesive.

Abstract: A ball screw structure with detection function includes a screw shaft having an external screw groove; a nut mounted to the screw shaft to be movable in an axial direction of the screw shaft and having an internal screw groove, which corresponds to the external screw groove of the screw shaft to define a loading channel between the internal screw groove of the nut and the external screw groove of the screw shaft; a ball assembly movable, through rolling, in the loading channel; and a recirculation member directly mounted to the nut and provided thereon with a microcontroller and a sensor to detect a rotation state of the screw shaft inside the nut and further formed with a recirculation passage in communication with the nut to allow the ball assembly to move and recirculate therethrough.

Abstract: A ball screw structure with detection function includes a screw shaft having an external screw groove; a nut mounted to the screw shaft to be movable in an axial direction of the screw shaft and having an internal screw groove, which corresponds to the external screw groove of the screw shaft to define a loading channel between the internal screw groove of the nut and the external screw groove of the screw shaft; a ball assembly movable, through rolling, in the loading channel; and a recirculation member directly mounted to the nut and provided thereon with a microcontroller and a sensor to detect a rotation state of the screw shaft inside the nut and further formed with a recirculation passage in communication with the nut to allow the ball assembly to move and recirculate therethrough.