Patents by Inventor Ping-Huey Tang

Ping-Huey Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6416300
    Abstract: A cooling fan structure installed in a system or a device necessitating radiation, cooling or convection, especially applied to the central processing unit of a computer for forced convection. The cooling fan structure includes a fixed base seat, a rotary vane assembly and a protective cover. The vane assembly and the fixed base seat contact with each other at one single point and an air bearing is formed to retain the vane assembly so that almost no contact abrasion will take place and the noise is minimized and the rotational speed can be increased. The cooling fan structure is manufactured at low cost and can be easily assembled.
    Type: Grant
    Filed: August 21, 2000
    Date of Patent: July 9, 2002
    Assignee: Hsin-Mao Hsieh
    Inventors: Ping-Huey Tang, Chi-Wei Tien, Hsin-Pu Chen
  • Patent number: 6332758
    Abstract: Air-bearing fan includes a dust-proof cover, a fan blade structure, a magnet, a stator, a sleeve, an electronic circuit board, a housing and a thrust disk. While the fan blade structure is rotating, air can be induced into a ring-shaped gap so that an air-bearing is formed. And, air is also induced into a thrust gap and forms a thrust bearing. Therefore, this invention significantly reduces the noise and increases the fan's rotating speed, fan capacity and life.
    Type: Grant
    Filed: February 24, 2000
    Date of Patent: December 25, 2001
    Assignee: Hsin-Mao Hsieh
    Inventors: Ping-Huey Tang, Chi-Wei Tien, Hsin-Pu Chen
  • Patent number: 6263956
    Abstract: The heat dissipating structure mainly includes a heat dissipating base, one or several heat dissipating fins, and a fixing frame. It can improve the ratio of fin's height to width, to increase the effective heat transfer area, and to promote the cooling capacity, especially for electronic elements. About the manufacturing method, it includes three steps: machining, inserting and injecting. So, the manufacturing method is simple and the required machines are general.
    Type: Grant
    Filed: April 17, 2000
    Date of Patent: July 24, 2001
    Inventors: Ping-Huey Tang, Chi-Wei Tien, Hsin-Pu Chen