Patents by Inventor Ping-Hung Liao

Ping-Hung Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF IMAGE FUSION
    Publication number: 20240089611
    Abstract: The present invention relates to a method of image fusion, which uses the brightness difference of the current frame and the previous frame to determine whether the pixel in a frame image is static or dynamic. If the current pixel is static, the previous corresponding pixel is superimposed onto the current pixel; if the current pixel is dynamic, the previous corresponding pixel is replaced with the current pixel.
    Type: Application
    Filed: September 7, 2023
    Publication date: March 14, 2024
    Inventors: Ping-Hung Yin, Yung-Ming Chou, Bo-Jia Lin, Yu-Sheng Liao
  • ELECTRONIC PACKAGE
    Publication number: 20230082767
    Abstract: An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the fact that the bonding wires are not affected by temperature, humidity and other environmental factors.
    Type: Application
    Filed: November 17, 2022
    Publication date: March 16, 2023
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsien Chiu, Wen-Jung Tsai, Yu-Wei Yeh, Tsung-Hsien Tsai, Chi-Liang Shih, Sheng-Ming Yang, Ping-Hung Liao
  • Electronic package
    Patent number: 11532568
    Abstract: An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the fact that the bonding wires are not affected by temperature, humidity and other environmental factors.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: December 20, 2022
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsien Chiu, Wen-Jung Tsai, Yu-Wei Yeh, Tsung-Hsien Tsai, Chi-Liang Shih, Sheng-Ming Yang, Ping-Hung Liao
  • ELECTRONIC PACKAGE
    Publication number: 20210375783
    Abstract: An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the fact that the bonding wires are not affected by temperature, humidity and other environmental factors.
    Type: Application
    Filed: July 16, 2020
    Publication date: December 2, 2021
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsien Chiu, Wen-Jung Tsai, Yu-Wei Yeh, Tsung-Hsien Tsai, Chi-Liang Shih, Sheng-Ming Yang, Ping-Hung Liao