Abstract: A package carrier including a multi-layer circuit substrate and a silicon wafer is provided. The multi-layer circuit substrate has a first opening and a second opening communicating with each other. A first diameter and a first depth of the first opening are respectively greater than a second diameter and a second depth of the second opening. The silicon wafer is embedded in the first opening of the multi-layer circuit substrate. The silicon wafer has an active surface and includes a connecting circuit layer. The connecting circuit layer is disposed on the active surface and electrically connected to the multi-layer circuit substrate. The second opening of the multi-layer circuit substrate exposes part of the connecting circuit layer.