Abstract: A nozzle assembly having a nozzle body with nozzle bore extending between a proximal portion and a distal portion of the nozzle body; and a tube having a lumen extending between a proximal end and a distal end of the tube, wherein the tube is joined to the nozzle body through the nozzle bore, such that the proximal end of the tube extends beyond the proximal portion of the nozzle body and the distal end of the tube extends beyond the distal portion of the nozzle body.

Abstract: An active vibration absorber is attachable to a structure incorporating a positioning system which serves to vibrate the structure during its operation. The active vibration absorber comprises a mounting portion for attachment to the structure, an inertial mass that is resiliently coupled to the mounting portion and a force actuator which is operative to controllably move the inertial mass relative to the mounting portion. The force actuator is configured to move the inertial mass relative to the mounting body according to a motion profile during a motion cycle of the positioning system in order to attenuate vibrations in the structure. The motion profile is determined from a motion command which is operative to drive the positioning system during the motion cycle.

Abstract: An active vibration absorber is attachable to a structure incorporating a positioning system which serves to vibrate the structure during its operation. The active vibration absorber comprises a mounting portion for attachment to the structure, an inertial mass that is resiliently coupled to the mounting portion and a force actuator which is operative to controllably move the inertial mass relative to the mounting portion. The force actuator is configured to move the inertial mass relative to the mounting body according to a motion profile during a motion cycle of the positioning system in order to attenuate vibrations in the structure. The motion profile is determined from a motion command which is operative to drive the positioning system during the motion cycle.

Abstract: A vibration feeding apparatus comprises an alignment track that is operative to receive electronic components and to arrange the electronic components in a desired orientation by vibrating and accelerating the electronic components located on the alignment track. An inspection station rejects electronic components that are not in the desired orientation onto a reject track for reintroduction to the alignment track. A spreading unit adjacent to the alignment track then transfers rejected electronic components from the reject track to the alignment track for arranging the electronic components in the desired orientation.

Abstract: A vibration feeding apparatus comprises a receptacle for holding and conveying components, and first and second linear motors coupled to the receptacle. The first and second linear motors are spaced from each other and have respective coils that are aligned parallel to each other. The first and second linear motors are operative to be driven at a first operation mode whereby to impart rotary vibration to the receptacle, and at a second operation mode whereby to impart linear vibration to the receptacle.

Abstract: A vibration feeding apparatus comprises an alignment track that is operative to receive electronic components and to arrange the electronic components in a desired orientation by vibrating and accelerating the electronic components located on the alignment track. An inspection station rejects electronic components that are not in the desired orientation onto a reject track for reintroduction to the alignment track. A spreading unit adjacent to the alignment track then transfers rejected electronic components from the reject track to the alignment track for arranging the electronic components in the desired orientation.

Abstract: A vibration feeding apparatus comprises a receptacle for holding and conveying components, and first and second linear motors coupled to the receptacle. The first and second linear motors are spaced from each other and have respective coils that are aligned parallel to each other. The first and second linear motors are operative to be driven at a first operation mode whereby to impart rotary vibration to the receptacle, and at a second operation mode whereby to impart linear vibration to the receptacle.

Abstract: A die detachment apparatus for detaching a die from an adhesive tape on which the die is mounted includes a pick-and-place tool movable along a pick-up axis for picking up the die from the adhesive tape and a die ejector comprising an ejector shaft including an ejector pin. The ejector pin is movable parallel to the pick-up axis to raise the die from the adhesive tape to facilitate pick-up of the die by the pick-and-place tool. At least one movable table to which the ejector shaft is operatively coupled is actuable by at least one piezoelectric actuator which is connected to the movable table via a flexure. Actuation by the piezoelectric actuator forces the movable table and ejector shaft to move in directions which are perpendicular to the pick-up axis for alignment of the ejector pin with the die pick-up tool along the pick-up axis.

Abstract: A liquid dispensing apparatus is provided which has a syringe for storing and dispensing a liquid, and a connector passage connected to the syringe. A positive pressure passage is connected to an air source for supplying positive pressure to the syringe, and there is a pressure valve located along the positive pressure passage that is operative to control the flow of air along the positive pressure passage. A vacuum passage is connected to a vacuum generator for supplying vacuum pressure to the syringe, and there is a vacuum valve located along the vacuum passage that is operative to control the flow of air along the vacuum passage. The positive pressure passage and vacuum passage are connected to the connector passage. A pressure sensor is also provided to measure the pressure in the connector passage.

Abstract: A die detachment apparatus for detaching a die from an adhesive tape on which the die is mounted includes a pick-and-place tool movable along a pick-up axis for picking up the die from the adhesive tape and a die ejector comprising an ejector shaft including an ejector pin. The ejector pin is movable parallel to the pick-up axis to raise the die from the adhesive tape to facilitate pick-up of the die by the pick-and-place tool. At least one movable table to which the ejector shaft is operatively coupled is actuable by at least one piezoelectric actuator which is connected to the movable table via a flexure. Actuation by the piezoelectric actuator forces the movable table and ejector shaft to move in directions which are perpendicular to the pick-up axis for alignment of the ejector pin with the die pick-up tool along the pick-up axis.

Abstract: An apparatus for bonding dice onto one or more substrates placed on a base comprises a first bond head and a second bond head. Each bond head incorporates a bonding tool which is configured for holding a die and both bond heads are driven by at least one linear motion actuator towards the substrate. The first and second bond heads are mounted on a stand and each comprises a locking mechanism which is operative to lock the bond head to the stand, and a compliant mechanism that is actuable to exert a bonding force on the bonding tool to bond each die to the substrate after the bond head has been locked to the stand.

Abstract: A liquid dispensing apparatus is provided which has a syringe for storing and dispensing a liquid, and a connector passage connected to the syringe. A positive pressure passage is connected to an air source for supplying positive pressure to the syringe, and there is a pressure valve located along the positive pressure passage that is operative to control the flow of air along the positive pressure passage. A vacuum passage is connected to a vacuum generator for supplying vacuum pressure to the syringe, and there is a vacuum valve located along the said vacuum passage that is operative to control the flow of air along the vacuum passage. The positive pressure passage and vacuum passage are connected to the connector passage. A pressure sensor is also provided to measure the pressure in the connector passage.

Abstract: A pick and place apparatus comprises a bond arm adapted for rotation about an axis between a pick location and a place location. The bond arm is formed with a cavity at an end of the arm remote from the axis, within which cavity are located a plurality of damping particles for damping unwanted vibrations of the bond arm. The particles may be irregular tungsten granules with a diameter between 0.3 and 1.2 mm and a filling ratio of about 75%.

Abstract: A pick and place apparatus comprises a bond arm adapted for rotation about an axis between a pick location and a place location. The bond arm is formed with a cavity at an end of the arm remote from the axis, within which cavity are located a plurality of damping particles for damping unwanted vibrations of the bond arm. The particles may be irregular tungsten granules with a diameter between 0.3 and 1.2 mm and a filling ratio of about 75%.

Abstract: There is disclosed a method and apparatus for ensuring release of objects such as solder balls from a pick head in a transfer and placement apparatus, comprising causing said pick head to vibrate by applying a vibration signal to said pick head over a range of frequencies. The range of frequencies is chosen such that it bounds the resonant frequencies of the pick head which may be calculated by computer simulation.