Patents by Inventor Ping-Kun Lai

Ping-Kun Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020158261
    Abstract: An LED layout structure has a substrate, at least one light emitting chip mounted on a front surface of the substrate. A first conductive wire is formed on the front surface of the substrate to connect with a first pole of the light emitting chip, and then the first conductive wire extends to a back surface of the substrate to form two terminals on the back surface. At least one second conductive wire having a first terminal formed on the front surface of the substrate to connect with a second pole of the light emitting chip, and then the second conductive extends to the back surface of the substrate and back to the front surface to form a second terminal. By applying the LED layout structure to form an LED array arrangement, the wire jumping problem is effectively avoided.
    Type: Application
    Filed: April 25, 2001
    Publication date: October 31, 2002
    Inventors: Ming-Tang Lee, Cheng-I Lin, Cheng-Wei Chan, Ping-Kun Lai
  • Patent number: D700836
    Type: Grant
    Filed: December 18, 2012
    Date of Patent: March 11, 2014
    Inventors: Chien-Chi Lai, Ping-Kun Lai