Abstract: A cutting device for preventing from sticking includes a base module and a cutter set. A portion of at least one of two opposite movable cutter surfaces of the movable cutter is recessed inward to form at least one movable cutter recess. The movable cutter is configured to move closer to or away from a fixed cutter along a first direction. When the movable cutter moves along the first direction, the movable cutter recess is configured to prevent papers from sticking to the movable cutter.

Abstract: The invention provides systems and methods for determining patterns of modification to a genome of a subject by representing the genome using a graph, such as a directed acyclic graph (DAG) with divergent paths for regions that are potentially subject to modification, profiling segments of the genome for evidence of epigenetic modification, and aligning the profiled segments to the DAG to determine locations and patterns of the epigenetic modification within the genome.

Abstract: A semiconductor structure including the following components is provided. A first device structure includes a first substrate, a first dielectric structure, a first landing pad, and a first capping layer. A second device structure is disposed on the first device structure. The second device structure includes a second substrate, a second dielectric structure, a stop layer, and a second landing pad. The thickness of the stop layer is greater than the thickness of the first capping layer. A first TSV structure is disposed in the second substrate, the second dielectric structure, and the first dielectric structure. The first TSV structure passes through the first capping layer and is electrically connected to the first landing pad. A second TSV structure is disposed in the second substrate and the second dielectric structure. The second TSV structure passes through the stop layer and is electrically connected to the second landing pad.

Abstract: A distinguishing device for dental plaque and dental calculus includes a light-emitting diode, an image sensing unit, and a processor. The light-emitting diode movies in a first direction and is separated from teeth in an oral cavity by a predetermined distance in a second direction. The second direction is perpendicular to the first direction. The light-emitting diode generates a blue light to illuminate the teeth, so that dental plaque on the teeth generates a first autofluorescence and dental calculus on the teeth generates a second autofluorescence. The image sensing unit is configured to sense the first autofluorescence and the second autofluorescence. The processor is coupled to the image sensing unit to distinguish a dental plaque area from a dental calculus area on the teeth according to the first autofluorescence and the second autofluorescence.

Abstract: A droplet delivery device includes an ejection channel and droplets outlet, a mesh positioned in the ejection channel and configured to produce an ejected stream of droplets through openings in the mesh, an airflow path in communication with the ejection channel and the mesh, and a heating element positioned in the airflow path.

Abstract: A droplet delivery device includes an ejector bracket including a mesh with a membrane operably coupled to a vibrating member tip that is coupled to an electronic transducer with the membrane between and contacting both the vibrating member tip and the mesh to produce droplets, such as for inhalation by a user of the droplet delivery device.

Abstract: A droplet delivery device includes an ejector mesh communicating with a fluid reservoir via a first pathway that includes wicking material and a second pathway that is free of wicking material with droplets produced by the mesh ejected out of a droplets outlet of the device.

Abstract: A physiological sensing and/or stimulation probe and method. The physiological sensing and/or stimulation probe includes a probe body, a first electrode, a second electrode and an adjusting unit. The first electrode is disposed on the probe body. The second electrode is spaced apart from the first electrode and has an outer surface facing away from the first electrode. The second electrode is movably disposed on the probe body via the adjusting unit so that an angle between a normal direction of the outer surface of the second electrode and a central line of the probe body is adjustable, thereby allowing an electrical field generated between the first electrode and the second electrode to be adjustable.

Abstract: A droplet delivery device includes a mesh with a plurality of opening supported by a mesh carrier in the airflow path of the droplet delivery device. The mesh is vibrated by an electronic transducer and produce droplets from a fluid supply with mesh carrier aiding the production of the droplets.

Abstract: A unit load device (ULD) for aircraft cargo loading, the ULD including a container having a cargo portion and a ledge extending from the cargo portion. The ledge is configured to interface with a floor latch. A first latch sensor is disposed on the ledge. The first latch sensor is configured to detect a closed latch contact. A controller is electrically connected to the first sensor, and is configured to automatically perform an action in response to the first latch sensor detecting the closed latch contact.

Abstract: A capacitor structure including a silicon material layer, a support frame layer, and a capacitor is provided. The support frame layer is disposed in the silicon material layer. The support frame layer has recesses. There is a cavity between two adjacent recesses. The support frame layer is located between the cavity and the recess. The support frame layer has a through hole directly above the cavity. The capacitor is disposed in the silicon material layer. The capacitor includes a first insulating layer and a first electrode layer. The first insulating layer is disposed on the support frame layer. The first electrode layer is disposed on the first insulating layer and fills the recess and the cavity.

Abstract: A droplet delivery device includes a droplets outlet coupled to a one-piece and removable container assembly, wherein the container assembly includes a mesh and a membrane, and wherein the mesh includes a plurality of openings formed through the mesh's thickness, a reservoir in fluid communication with the container assembly and configured to supply a volume of fluid, and a vibrating member coupled to a power source and positioned to cooperate with the membrane and mesh to generate an ejected stream of droplets through the mesh.

Abstract: Encrypted export controlled items within a corporate asset infrastructure may be searched for vendor access. Different versions of an export policy may change the ways in which the search is performed based on calculation of a numerical representation of a classification to identify the best forwarding location for a vendor access that is not subject to a Restricted Destination List. An indexing value may be determined, transparently with respect to a vendor, based on a desired plaintext item of data and a redacted technical data list. The indexing value may be used to access an entry in an indexing structure to obtain a corresponding document-oriented record which includes an encrypted ciphertext item. Positions of items of the indexing structure may be based on corresponding plaintext items.

Abstract: A manufacturing method of a semiconductor structure including the following steps is provided. A first substrate is provided. A first dielectric structure is formed on the first substrate. At least one first cavity is formed in the first dielectric structure. A first stress adjustment layer is formed in the first cavity. The first stress adjustment layer covers the first dielectric structure. A second substrate is provided. A second dielectric structure is formed on the second substrate. At least one second cavity is formed in the second dielectric structure. A second stress adjustment layer is formed in the second cavity. The second stress adjustment layer covers the second dielectric structure. The first stress adjustment layer and the second stress adjustment layer are bonded.

Abstract: The present disclosure provides a method for anti-tampering apparatus servicing data implemented by a calculation device connected to a target device, the method comprising: identifying a contract identification code and obtaining a contract package file and a contract authentication code from at least one remote device; obtaining a microservice file corresponding to the target device from the remote device when a device embedded code of the calculation device is matching the contract authentication code; performing the microservice file to enable the target device according to the contract package file and generate an execution report; publishing the execution report to the remote device to obtain an acceptance certification code; and combining and hashing the device embedded code, the contract authentication code and the acceptance certification code to generate a hash value, and sending the hash value to a blockchain.

Abstract: A building chiller/heat pump system includes a chiller/heat pump system for supplying a conditioned fluid to change a temperature of air being delivered into a building. The chiller/heat pump system is provided with a control to achieve a desired setpoint of the air delivered into the building. The control is programmed to receive a prediction of expected remission levels in energy that will be delivered to power the chiller/heat pump system. The control is programmed to change the setpoint such that an energy level required to operate the chiller/heat pump system to achieve the setpoint will drop when the expected emissions level increases, and adjusts the setpoint in an opposed direction when the expected emissions drops. A method is also disclosed.

Abstract: A wafer stacking process is provided in the present invention, including steps of forming a silicon oxide layer on a sacrificial carrier, bonding the silicon oxide layer with a dielectric layer on a front side of a silicon substrate, performing a thinning process on the back side of the silicon substrate to expose TSVs therewithin, bonding the back side of the silicon substrate with another silicon substrate, repeating the thinning process and the process of bonding another silicon substrate above so as to form a wafer stacking structure, and performing a removing process to completely remove the sacrificial carrier.

Abstract: A manufacturing process for electrode of neuromodulation probe includes the steps of: preparing a plurality of the manufacturing fixtures for electrode of neuromodulation probe; preparing a plurality of the manufacturing fixtures for electrode in a surrounding manner by having the first-layer frames to be externally disposed side by side with the bevels of the two neighboring first-layer frames close to each other, so that the second-layer frames, the plurality of electrodes and the plurality of wires are enclosed thereinside; placing a cylinder amid the plurality of manufacturing fixtures for electrode to have the plurality of wires to surround the cylinder; having a fluid plastic to surround the cylinder by filling all the spaces between the plurality of wires and the plurality of electrodes, and waiting the fluid plastic to cure; removing the plurality of first-layer frames and the plurality of second-layer frames; and, pulling off the cylinder.

Abstract: A semiconductor structure, the semiconductor structure includes a substrate with a first conductivity type and a laterally diffused metal-oxide-semiconductor (LDMOS) device on the substrate, the LDMOS device includes a first well region on the substrate, and the first well region has a first conductivity type. A second well region with a second conductivity type, the second conductivity type is complementary to the first conductivity type, a source doped region in the second well region with the first conductivity type, and a deep drain doped region in the first well region, the deep drain doped region has the first conductivity type.

Abstract: An image sensor includes a substrate, a global shutter component, a ground doped region, and a light-shielding layer. The substrate at least has a pixel array region and a border region adjacent to each other. The global shutter component is located on the pixel array region, and the global shutter component includes a storage node. The ground doped region is located on the border region. The light-shielding layer is located on the pixel array region and the border region and is electrically connected to the ground doped region. The light-shielding layer includes a first light-shielding layer and a second light-shielding layer. The first light-shielding layer is located on the pixel array region and covers the storage node, and the second light-shielding layer is located on the border region and surrounds the global shutter component. A manufacturing method of an image sensor is also provided.