Patents by Inventor Ping Li Wu

Ping Li Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for preparing semiconductor devices applied in flip chip technology
    Patent number: 9196534
    Abstract: A method for preparing semiconductor devices in a flip chip process comprises forming deep grooves surrounding each of the semiconductor chips; depositing a first plastic package material to form a first plastic package layer covering front surface of the semiconductor wafer and filling the deep grooves; depositing a metal layer at back surface of the semiconductor wafer after grinding; grinding an outermost portion of the metal layer thus forming a ring area located at back surface around edge of the semiconductor wafer not covered by the metal layer; cutting the first plastic package layer, the semiconductor wafer, the metal layer and the first plastic package material filled in the deep grooves along a straight line formed by two ends of each of the deep grooves filled with the first plastic package material; and picking up the semiconductor devices and mounting on a substrate without flipping the semiconductor devices.
    Type: Grant
    Filed: February 24, 2013
    Date of Patent: November 24, 2015
    Assignee: Alpha and Omega Semiconductor Incorporated
    Inventors: Yan Xun Xue, Ping Huang, Hamza Yilmaz, Yueh-Se Ho, Lei Shi, Liang Zhao, Ping Li Wu, Lei Duan, Yuping Gong
  • METHOD FOR PREPARING SEMICONDUCTOR DEVICES APPLIED IN FLIP CHIP TECHNOLOGY
    Publication number: 20140242756
    Abstract: A method for preparing semiconductor devices in a flip chip process comprises forming deep grooves surrounding each of the semiconductor chips; depositing a first plastic package material to form a first plastic package layer covering front surface of the semiconductor wafer and filling the deep grooves; depositing a metal layer at back surface of the semiconductor wafer after grinding; grinding an outermost portion of the metal layer thus forming a ring area located at back surface around edge of the semiconductor wafer not covered by the metal layer; cutting the first plastic package layer, the semiconductor wafer, the metal layer and the first plastic package material filled in the deep grooves along a straight line formed by two ends of each of the deep grooves filled with the first plastic package material; and picking up the semiconductor devices and mounting on a substrate without flipping the semiconductor devices.
    Type: Application
    Filed: February 24, 2013
    Publication date: August 28, 2014
    Applicant: Alpha and Omega Semiconductor Incorporated
    Inventors: Yan Xun Xue, Ping Huang, Hamza Yilmaz, Yueh-Se Ho, Lei Shi, Liang Zhao, Ping Li Wu, Lei Duan, Yuping Gong