Patents by Inventor Ping Liang Tu

Ping Liang Tu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of bonding semiconductor devices utilizing solder balls
    Patent number: 8012866
    Abstract: A method for bonding a semiconductor device onto a substrate is provided which comprises the steps of picking up a solder ball with a pick head, placing the solder ball onto the substrate and melting the solder ball on the substrate and placing the semiconductor device on the molten solder ball. The molten solder ball is then allowed to cool to form a solder joint which bonds the semiconductor device to the substrate.
    Type: Grant
    Filed: May 30, 2008
    Date of Patent: September 6, 2011
    Assignee: ASM Assembly Automation Ltd
    Inventors: Ping Liang Tu, Chun Hung Samuel Ip
  • Direct die attach utilizing heated bond head
    Patent number: 7854365
    Abstract: A method is provided for bonding a die comprising a solder layer which has a melting point Tm. A bond head is heated to a bond head setting temperature T1, which is higher than Tm, and a substrate is heated to a substrate setting temperature T2, which is lower than Tm. The bond head then picks up the die and heats the die towards temperature T1 so as to melt the solder layer. The solder layer of the die is pressed onto the substrate so as to bond the die to the substrate, and thereafter the bond head is separated from the die so that the solder layer is cooled towards T2 and solidifies.
    Type: Grant
    Filed: October 27, 2008
    Date of Patent: December 21, 2010
    Assignee: ASM Assembly Automation Ltd
    Inventors: Ming Li, Ying Ding, Ping Liang Tu, King Ming Lo, Kwok Kee Chung
  • DIRECT DIE ATTACH UTILIZING HEATED BOND HEAD
    Publication number: 20100105172
    Abstract: A method is provided for bonding a die comprising a solder layer which has a melting point Tm. A bond head is heated to a bond head setting temperature T1, which is higher than Tm, and a substrate is heated to a substrate setting temperature T2, which is lower than Tm. The bond head then picks up the die and heats the die towards temperature T1 so as to melt the solder layer. The solder layer of the die is pressed onto the substrate so as to bond the die to the substrate, and thereafter the bond head is separated from the die so that the solder layer is cooled towards T2 and solidifies.
    Type: Application
    Filed: October 27, 2008
    Publication date: April 29, 2010
    Inventors: Ming LI, Ying DING, Ping Liang TU, King Ming LO, Kwok Kee Chung
  • Manufacturing process and apparatus therefor utilizing reducing gas
    Patent number: 7648901
    Abstract: A manufacturing process and apparatus therefore are provided for processing an electronic device comprising oxidizable material during processing. The electronic device is located inside a chamber and is heated a processing temperature with a heater. A reductive atmosphere is created in the chamber by supplying a gas comprising glycolic acid vapor while processing the electronic device at the processing temperature.
    Type: Grant
    Filed: September 28, 2006
    Date of Patent: January 19, 2010
    Assignee: ASM Assembly Automation Ltd.
    Inventors: Ping Liang Tu, Deming Liu, Kui Kam Lam, Man Chung Raymond Ng
  • METHOD OF BONDING SEMICONDUCTOR DEVICES UTILIZING SOLDER BALLS
    Publication number: 20090298278
    Abstract: A method for bonding a semiconductor device onto a substrate is provided which comprises the steps of picking up a solder ball with a pick head, placing the solder ball onto the substrate and melting the solder ball on the substrate and placing the semiconductor device on the molten solder ball. The molten solder ball is then allowed to cool to form a solder joint which bonds the semiconductor device to the substrate.
    Type: Application
    Filed: May 30, 2008
    Publication date: December 3, 2009
    Inventors: Ping Liang TU, Chun Hung Samuel IP
  • MANUFACTURING PROCESS AND APPARATUS THEREFOR UTILIZING REDUCING GAS
    Publication number: 20080078145
    Abstract: A manufacturing process and apparatus therefore are provided for processing an electronic device comprising oxidizable material during processing. The electronic device is located inside a chamber and is heated a processing temperature with a heater. A reductive atmosphere is created in the chamber by supplying a gas comprising glycolic acid vapor while processing the electronic device at the processing temperature.
    Type: Application
    Filed: September 28, 2006
    Publication date: April 3, 2008
    Inventors: Ping Liang TU, Deming LIU, Kui Kam LAM, Man Chung Raymond NG