Abstract: Embodiment methods for performing a high pressure anneal process during the formation of a semiconductor device, and embodiment devices therefor, are provided. The high pressure anneal process may be a dry high pressure anneal process in which a pressurized environment of the anneal includes one or more process gases. The high pressure anneal process may be a wet anneal process in which a pressurized environment of the anneal includes steam.

Abstract: Embodiment methods for performing a high pressure anneal process during the formation of a semiconductor device, and embodiment devices therefor, are provided. The high pressure anneal process may be a dry high pressure anneal process in which a pressurized environment of the anneal includes one or more process gases. The high pressure anneal process may be a wet anneal process in which a pressurized environment of the anneal includes steam.

Abstract: A phase shifter is provided, which includes a first substrate, a second substrate, a liquid crystal layer, a plurality of first ring-shaped electrodes and a plurality of second ring-shaped electrodes. The first substrate and the second substrate are disposed opposite to each other. The liquid crystal layer is disposed between the first substrate and the second substrate. The plurality of first ring-shaped electrodes are disposed sequentially and in interval on a side of the first substrate close to the liquid crystal layer. The plurality of second ring-shaped electrodes are disposed sequentially and in interval on a side of the second substrate close to the liquid crystal layer. A plurality of vertical projections, projected by the plurality of first ring-shaped electrodes to the second substrate, and at least partially overlapped with the plurality of second ring-shaped electrodes, respectively.

Abstract: A method and a system for identifying a glacial lake outburst debris flow (GLODF) are provided. The method is obtained based on considering induced influences of slopes of channels and particle sizes of source particles on the GLODF. The method not only compensates for deficiencies in identifying the GLODF, but also realizes determination of the GLODF, which provides data basis for disaster prevention and control layout such as monitoring and early warning on a glacial lake and assists preventing and managing disasters caused by the GLODF. Meanwhile, multiple parameters used in the method are easy and convenient to obtain, and the parameters can be directly used on site, which saves engineering cost, improves working efficiency, and has high practical and promotional value in environmental protection and disaster prevention and mitigation.

Abstract: A method of cleaning includes placing a semiconductor device manufacturing tool component made of quartz on a support. A cleaning fluid inlet line is attached to a first open-ended tubular quartz projection extending from an outer main surface of the semiconductor device manufacturing tool component. A cleaning fluid is applied to the semiconductor device manufacturing tool component by introducing the cleaning fluid through the cleaning fluid inlet line and the tubular quartz projection.

Abstract: A method that includes measuring vibration levels in a semiconductor manufacturing apparatus, determining one or more sections of the semiconductor manufacturing apparatus that vibrate at levels greater than a predetermined vibration level, and reducing the vibration levels in the one or more sections to be at or within the predetermined vibration level by coupling one or more weights to an external surface of the semiconductor manufacturing apparatus in the one or more sections.

Abstract: A method that includes measuring vibration levels in a semiconductor manufacturing apparatus, determining one or more sections of the semiconductor manufacturing apparatus that vibrate at levels greater than a predetermined vibration level, and reducing the vibration levels in the one or more sections to be at or within the predetermined vibration level by coupling one or more weights to an external surface of the semiconductor manufacturing apparatus in the one or more sections.

Abstract: A method of cleaning includes placing a semiconductor device manufacturing tool component made of quartz on a support. A cleaning fluid inlet line is attached to a first open-ended tubular quartz projection extending from an outer main surface of the semiconductor device manufacturing tool component. A cleaning fluid is applied to the semiconductor device manufacturing tool component by introducing the cleaning fluid through the cleaning fluid inlet line and the tubular quartz projection.

Abstract: The present invention provides a wireless charger with a flowing display effect, which comprises a shell, a wireless charging module and an effect display module, wherein the wireless charging module and the effect display module are respectively arranged in a first accommodating space and a second accommodating space formed by the shell, and users can directly use the wireless charger for charging operation; when the wireless charger is idle, the effect display module can provide better enjoyment and can interact with users, thus greatly improving the user's experience.

Abstract: Embodiment methods for performing a high pressure anneal process during the formation of a semiconductor device, and embodiment devices therefor, are provided. The high pressure anneal process may be a dry high pressure anneal process in which a pressurized environment of the anneal includes one or more process gases. The high pressure anneal process may be a wet anneal process in which a pressurized environment of the anneal includes steam.

Abstract: A method of cleaning includes placing a semiconductor device manufacturing tool component made of quartz on a support. A cleaning fluid inlet line is attached to a first open-ended tubular quartz projection extending from an outer main surface of the semiconductor device manufacturing tool component. A cleaning fluid is applied to the semiconductor device manufacturing tool component by introducing the cleaning fluid through the cleaning fluid inlet line and the tubular quartz projection.

Abstract: Embodiment methods for performing a high pressure anneal process during the formation of a semiconductor device, and embodiment devices therefor, are provided. The high pressure anneal process may be a dry high pressure anneal process in which a pressurized environment of the anneal includes one or more process gases. The high pressure anneal process may be a wet anneal process in which a pressurized environment of the anneal includes steam.

Abstract: The present disclosure provides a method for recommending a commodity and a related electronic device. The present disclosure provides an electronic device for processing a commodity recommendation list. The electronic device includes a communication module, a memory module and a processing module. The electronic device is capable to recommend a commodity based on a current state of a user, at least one previous order from the user, at least one browse record of the user, and a set of commodity attributes.

Abstract: Some implementations described herein provide techniques and apparatuses for overcoming forces that may deflect an injector nozzle into an interior wall of a thin-film furnace. The implementations include a fixture that is coupled to the injector nozzle. The fixture is configurable to lock to a selected property of the injector nozzle to maintain, between a portion of the injector nozzle and the interior wall, a gap. In this way, the portion of the injector nozzle is prevented from colliding with the interior wall and dislodging particulates that may contaminate semiconductor product fabricated using the thin-film furnace.

Abstract: A pivot assembly includes a fixing base, a pivot portion, a center shaft, a compression spring and two hollow abrasion proof pieces. The fixing base is equipped with an isolating board defining a fixing hole. The pivot portion defines a pivoting hole in alignment with the fixing hole. The center shaft is inserted into the fixing hole and the pivoting hole. The compression spring is mounted around the center shaft. The two hollow abrasion proof pieces are sleeved around the center shaft. The two abrasion proof pieces are located between the isolating board and the pivot portion. The compression spring is located between the two abrasion proof pieces. An electronic device includes the pivot assembly.

Abstract: A method that includes measuring vibration levels in a semiconductor manufacturing apparatus, determining one or more sections of the semiconductor manufacturing apparatus that vibrate at levels greater than a predetermined vibration level, and reducing the vibration levels in the one or more sections to be at or within the predetermined vibration level by coupling one or more weights to an external surface of the semiconductor manufacturing apparatus in the one or more sections.

Abstract: In accordance with an embodiment, described herein is a system and method for providing a browser extension for exploration in an analytics environment. A data analytics environment can operate at a computer system providing access to a database or data warehouse instance. At a client device, a browser extension can be made available whereby a user can explore a table of interest at an online data content resource, such as at a web site or web page, and instruct the browser extension to import, sanitize, and begin analysis of the table within the analytics environment. The approach can be used, for example, to identify tables or other arrangements of data provided by a web site, and present options to the user to retrieve the data into the analytics environment, for further review or to create visualizations associated with the data.

Abstract: An antenna structure includes a patch antenna including two opposite edges, a microstrip line connected to the patch antenna, two first radiation assemblies respectively disposed on two sides of the patch antenna, two second radiation assemblies disposed under the two first radiation assemblies, a liquid crystal layer disposed between a first plane and a second plane, and a ground plane disposed under the two second radiation assemblies. The patch antenna, the microstrip line, and the two first radiation assemblies are located on the first plane, and each of the first radiation assemblies includes multiple separated first conductors. The two second radiation assemblies are located on the second plane, and each of the second radiation assemblies includes multiple separated second conductors. A projection of the two second radiation assemblies on the first plane, the two first radiation assemblies, and the two edges of the patch antenna collectively form two loops.

Abstract: In accordance with an embodiment, described herein is a system and method for providing a browser extension for exploration in an analytics environment. A data analytics environment can operate at a computer system providing access to a database or data warehouse instance. At a client device, a browser extension can be made available whereby a user can explore a table of interest at an online data content resource, such as at a web site or web page, and instruct the browser extension to import, sanitize, and begin analysis of the table within the analytics environment. The approach can be used, for example, to identify tables or other arrangements of data provided by a web site, and present options to the user to retrieve the data into the analytics environment, for further review or to create visualizations associated with the data.

Abstract: A waterproof button assembly includes a body, an elastic element, a first sealing element, a second sealing element, a lower cover, a circuit board and an upper cover. The body is recessed downward to form an upper accommodating groove. The body is recessed inward to form a lower accommodating groove. A bottom wall of the upper accommodating groove is recessed downward to form a holding groove. The bottom wall of the upper accommodating groove defines a first through hole. The body has an opening. The elastic element is mounted in the holding groove. The first sealing element is mounted around the first through hole. The second sealing element is assembled to the opening. The lower cover covers the lower accommodating groove to form an assembling space. The circuit board is assembled in the assembling space. The upper cover is assembled in the upper accommodating groove.