Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, a molding compound and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The at least one semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The molding compound is disposed over the interposer and laterally encapsulates the at least one semiconductor die. The molding compound laterally wraps around the interposer and the molding compound at least physically contacts a portion of the sidewalls of the interposer. The connectors are disposed on the second surface of the interposer, and are electrically connected with the at least one semiconductor die through the interposer.

Abstract: A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.

Abstract: A method of performing automatic tuning on a deep learning model includes: utilizing an instruction-based learned cost model to estimate a first type of operational performance metrics based on a tuned configuration of layer fusion and tensor tiling; utilizing statistical data gathered during a compilation process of the deep learning model to determine a second type of operational performance metrics based on the tuned configuration of layer fusion and tensor tiling; performing an auto-tuning process to obtain a plurality of optimal configurations based on the first type of operational performance metrics and the second type of operational performance metrics; and configure the deep learning model according to one of the plurality of optimal configurations.

Abstract: Various embodiments of the present application are directed towards a control gate layout to improve an etch process window for word lines. In some embodiments, an integrated chip comprises a memory array, an erase gate, a word line, and a control gate. The memory array comprises a plurality of cells in a plurality of rows and a plurality of columns. The erase gate and the word line are elongated in parallel along a row of the memory array. The control gate is elongated along the row and is between and borders the erase gate and the word line. Further, the control gate has a pad region protruding towards the erase gate and the word line. Because the pad region protrudes towards the erase gate and the word line, a width of the pad region is spread between word-line and erase-gate sides of the control gate.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, a molding compound and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The at least one semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The molding compound is disposed over the interposer and laterally encapsulates the at least one semiconductor die. The molding compound laterally wraps around the interposer and the molding compound at least physically contacts a portion of the sidewalls of the interposer. The connectors are disposed on the second surface of the interposer, and are electrically connected with the at least one semiconductor die through the interposer.

Abstract: A fan dynamic pressure structure having a plastic frame integrally formed around an oil-containing sintered metal powder bearing includes an oil-containing sintered metal powder bearing, a plastic frame having a middle tube integrally formed around a peripheral of a bushing body of the oil-containing sintered metal powder bearing, a blade assembly having an axial shaft penetrating through a shaft hole of the oil-containing sintered metal powder bearing, the axial shaft protruding downwardly and having an annular groove, and an annular dynamic pressure piece having an insertion hole and an annular body surrounding the insertion hole. The insertion hole is engaged with the annular groove of the fan assembly, the annular body has a plurality of curved radial dynamic pressure ditches on a surface adjacent to the oil-containing sintered metal powder bearing, of the annular body.

Abstract: A structure for supporting a wire includes a first portion including a body portion, and an alignment portion. The alignment portion defines a first alignment opening through which the alignment portion receives a first fastener. The first alignment opening extends along a first alignment axis between. A second portion defines a second alignment opening, extending along a second alignment axis, through which the second portion receives the first fastener. The second portion is spaced a distance from the body portion to define a wire opening into which the wire is received for support by the structure. The alignment portion is movable relative to the body portion between a first position, in which the first alignment axis and the second alignment axis are coaxial, and a second position, in which the first alignment axis and the second alignment axis are non-coaxial.

Abstract: A fan dynamic pressure structure having a plastic frame integrally formed around an oil-containing sintered metal powder bearing includes an oil-containing sintered metal powder bearing, a plastic frame having a middle tube integrally formed around a peripheral of a bushing body of the oil-containing sintered metal powder bearing, a blade assembly having an axial shaft penetrating through a shaft hole of the oil-containing sintered metal powder bearing, the axial shaft protruding downwardly and having an annular groove, and an annular dynamic pressure piece having an insertion hole and an annular body surrounding the insertion hole. The insertion hole is engaged with the annular groove of the fan assembly, the annular body has a plurality of curved radial dynamic pressure ditches on a surface adjacent to the oil-containing sintered metal powder bearing, of the annular body.

Abstract: A support device for supporting a wire includes a first support portion. A second support portion includes a first leg portion and a second leg portion that extends linearly and is attached to the first leg portion and to the first support portion. A third support portion includes a third leg portion having a third inwardly facing surface, which faces towards the third axial opening, and a third outwardly facing surface, which does not face towards the third axial opening. The third inwardly facing surface and the third outwardly facing surface have a different surface roughness. A fourth leg portion has a fourth inwardly facing surface, which faces towards the fourth axial opening, and a fourth outwardly facing surface, which does not face towards the fourth axial opening. The fourth inwardly facing surface and the fourth outwardly facing surface have a same surface roughness.

Abstract: A support device for supporting a wire includes a first support portion. A second support portion includes a first leg portion and a second leg portion that extends linearly and is attached to the first leg portion and to the first support portion. A third support portion includes a third leg portion having a third inwardly facing surface, which faces towards the third axial opening, and a third outwardly facing surface, which does not face towards the third axial opening. The third inwardly facing surface and the third outwardly facing surface have a different surface roughness. A fourth leg portion has a fourth inwardly facing surface, which faces towards the fourth axial opening, and a fourth outwardly facing surface, which does not face towards the fourth axial opening. The fourth inwardly facing surface and the fourth outwardly facing surface have a same surface roughness.

Abstract: A structure for supporting a wire includes a first portion including a body portion, and an alignment portion. The alignment portion defines a first alignment opening through which the alignment portion receives a first fastener. The first alignment opening extends along a first alignment axis between. A second portion defines a second alignment opening, extending along a second alignment axis, through which the second portion receives the first fastener. The second portion is spaced a distance from the body portion to define a wire opening into which the wire is received for support by the structure. The alignment portion is movable relative to the body portion between a first position, in which the first alignment axis and the second alignment axis are coaxial, and a second position, in which the first alignment axis and the second alignment axis are non-coaxial.

Abstract: Embodiments of mechanisms of an etching apparatus are provided. The etching apparatus includes a processing chamber. The etching apparatus also includes a gas distribution plate disposed in the processing chamber and comprising a number of exhaust openings. The etching apparatus further includes a number of end-point detectors disposed on the gas distribution plate. The gas distribution plate is configured to spurt gas into the processing chamber via the exhaust openings during a semiconductor process.

Abstract: An insert for a conductor clamp has a body portion for applying a clamping force to a conductor. The insert includes an insert body receivable by the body portion of the conductor clamp. The insert body has a first surface adapted to face a portion of the conductor. The insert body is made from a non-metallic and electrically non-conductive material. An adhesive is applied to at least a portion of the first surface of the insert body. A friction enhancing material applied to at least a portion of the adhesive.

Abstract: Electroless copper plating compositions including (a) copper ions, (b) a complexing agent for copper ions, (c) a reducing agent, (d) a pH adjustor and (e) a stabilizer is disclosed. The stabilizer has a specific chemical structure, and contributes to stable an electroless copper plating composition from decomposition.

Abstract: Electroless copper plating compositions including (a) copper ions, (b) a complexing agent for copper ions, (c) a reducing agent, (d) a pH adjustor and (e) a stabilizer is disclosed. The stabilizer has a specific chemical structure, and contributes to stable an electroless copper plating composition from decomposition.

Abstract: A structure for supporting a wire includes a first portion extending along a first axis. The first portion includes a body portion and an alignment portion. The alignment portion is removably coupled to the body portion. The first alignment opening extends between a first side and a second side of the alignment portion. The first side has a first surface portion and a second surface portion. The first surface portion is separated a first distance from the first axis. The second surface portion is separated a second distance from the first axis. The first distance is different than the second distance. The structure includes a second portion defining a second alignment opening through which the second portion receives the fastener. The second portion is spaced a distance from the body portion to define a wire opening into which the wire is received for support by the structure.

Abstract: A structure for supporting a wire includes a first portion extending along a first axis. The first portion includes a body portion and an alignment portion. The alignment portion is removably coupled to the body portion. The first alignment opening extends between a first side and a second side of the alignment portion. The first side has a first surface portion and a second surface portion. The first surface portion is separated a first distance from the first axis. The second surface portion is separated a second distance from the first axis. The first distance is different than the second distance. The structure includes a second portion defining a second alignment opening through which the second portion receives the fastener. The second portion is spaced a distance from the body portion to define a wire opening into which the wire is received for support by the structure.

Abstract: An insert for a conductor clamp has a body portion for applying a clamping force to a conductor. The insert comprises an insert body receivable by the body portion of the conductor clamp. The insert body has a first surface adapted to face a portion of the conductor. The insert body is made from a non-metallic and electrically non-conductive material. An adhesive is applied to at least a portion of the first surface of the insert body. A friction enhancing material applied to at least a portion of the adhesive.

Abstract: A structure for supporting a wire includes a first portion extending along a first axis. The first portion includes a body portion and an alignment portion. The alignment portion defines a first alignment opening through which the alignment portion receives a fastener. The first alignment opening extends between a first side and a second side. The first side has a first surface portion and a second surface portion. The first surface portion is separated a first distance from the first axis. The second surface portion is separated a second distance from the first axis. The first distance is different than the second distance. The structure includes a second portion defining a second alignment opening through which the second portion receives the fastener. The second portion is spaced a distance from the body portion to define a wire opening into which the wire is received for support by the structure.

Abstract: An integral structure of a slim fan frame includes a metal baseplate, a bearing, a central plastic tube and a plastic flow passage sidewall which are connected to each other by integral forming. The method of manufacturing the integral structure is to simultaneously integrate the central plastic tube, the plastic flow passage sidewall, the metal baseplate and the bearing while injection molding the central plastic tube and the plastic flow passage sidewall.