Abstract: An OTP memory cell includes an antifuse transistor, a first transistor and a second transistor. The antifuse transistor includes a first fin, a second fin, a first gate structure, a first drain/source contact layer and a second drain/source contact layer. A central region of the first fin and a central region of the second fin are covered by a first gate structure. The first drain/source contact layer is electrically connected with a first terminal of the first fin and a first terminal of the second fin. The second drain/source contact layer is electrically connected with a second terminal of the second fin but not electrically connected with a second terminal of the first fin. The first transistor is connected with the first drain/source contact layer. The second transistor is connected with the second drain/source contact layer.

Abstract: An antifuse-type OTP memory cell at least includes a first nanowire, a second nanowire, a first gate structure, a first drain/source structure and a second drain/source structure. The first gate structure includes a first gate dielectric layer, a second gate dielectric layer and a first gate layer. The first nanowire is surrounded by the first gate dielectric layer. The second nanowire is surrounded by the second gate dielectric layer. The first gate dielectric layer and the second gate dielectric layer are surrounded by the first gate layer. The first drain/source structure is electrically contacted with a first terminal of the first nanowire and a first terminal of the second nanowire. The second drain/source structure is electrically contacted with a second terminal of the first nanowire. The second drain/source structure is not electrically contacted with a second terminal of the second nanowire.

Abstract: An antifuse-type one time programming memory cell at least includes an antifuse transistor. The antifuse transistor includes a first nanowire, a first gate structure, a first drain/source structure and a second drain/source structure. The first nanowire is surrounded by the first gate structure. The first gate structure comprises a first spacer, a second spacer, a first gate dielectric layer and a first gate layer. The first drain/source structure is electrically contacted with a first terminal of the first nanowire. The second drain/source structure is electrically contacted with a second terminal of the first nanowire.

Abstract: An antifuse-type one time programming memory cell includes a select device, a following device and an antifuse transistor. A first terminal of the select device is connected with a bit line. A second terminal of the select device is connected with a first node. A select terminal of the select device is connected with a word line. A first terminal of the following device is connected with the first node. A second terminal of the following device is connected with a second node. A control terminal of the following device is connected with a following control line. A first drain/source terminal of the antifuse transistor is connected with the second node. A gate terminal of the antifuse transistor is connected with an antifuse control line. A second drain/source terminal of the antifuse transistor is in a floating state.

Abstract: An antifuse-type one time programming memory cell includes a select device, a following device and an antifuse transistor. A first terminal of the select device is connected with a bit line. A second terminal of the select device is connected with a first node. A select terminal of the select device is connected with a word line. A first terminal of the following device is connected with the first node. A second terminal of the following device is connected with a second node. A control terminal of the following device is connected with a following control line. A first drain/source terminal of the antifuse transistor is connected with the second node. A gate terminal of the antifuse transistor is connected with an antifuse control line. A second drain/source terminal of the antifuse transistor is in a floating state.

Abstract: An antifuse-type one time programming memory cell, comprising: a first select transistor, wherein a first drain/source terminal of the first select transistor is connected with a bit line, and a gate terminal of the first select transistor is connected with a word line; an antifuse transistor, wherein a first drain/source terminal of the antifuse transistor is connected with a second drain/source terminal of the first select transistor, and a gate terminal of the antifuse transistor is connected with an antifuse control line; and a second select transistor, wherein a first drain/source terminal of the second select transistor is connected with a second drain/source terminal of the antifuse transistor, a gate terminal of the second select transistor is connected with the word line, and a second drain/source terminal of the second select transistor is connected with the bit line.

Abstract: An antifuse-type one time programming memory cell has following structures. A first doped region, a second doped region, a third doped region and a fourth doped region are formed in a well region. A gate oxide layer covers a surface of the well region. A first gate is formed on the gate oxide layer and spanned over the first doped region and the second doped region. The first gate is connected with a word line. A second gate is formed on the gate oxide layer and spanned over the third doped region and the fourth doped region. The second gate is connected with the word line. A third gate is formed on the gate oxide layer and spanned over the second doped region and the third doped region. The third gate is connected with an antifuse control line.

Abstract: An antifuse-type one time programming memory cell has following structures. A first doped region, a second doped region, a third doped region and a fourth doped region are formed in a well region. A gate oxide layer covers a surface of the well region. A first gate is formed on the gate oxide layer and spanned over the first doped region and the second doped region. The first gate is connected with a word line. A second gate is formed on the gate oxide layer and spanned over the third doped region and the fourth doped region. The second gate is connected with the word line. A third gate is formed on the gate oxide layer and spanned over the second doped region and the third doped region. The third gate is connected with an antifuse control line.