Patents by Inventor Ping-Lung Liao
Ping-Lung Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7932739Abstract: An apparatus for supporting BGA packages for one or more testing processes is disclosed. The apparatus includes a substrate member. The substrate member has a plurality of contact pads, with each of the contact pads being spatially disposed around a peripheral region of the substrate. The apparatus further includes a plurality of contact regions spatially configured on a portion of the substrate member. Each of the plurality of contact regions is numbered from 1 through N being electrically connected to respective contact pads numbered from 1 through N. The plurality of contact regions is configured to provide electrical contact to respective plurality of balls provided on a BGA package. The apparatus additionally includes a holder device coupled to the substrate member. The holder device is adapted to mechanically hold the BGA package in place to provide mechanical contact between the plurality of balls and respective plurality of contact regions.Type: GrantFiled: May 7, 2009Date of Patent: April 26, 2011Assignee: Semiconductor Manufacturing International (Shanghai) CorporationInventors: Shan An Liang, Chun Kui Ji, Ping Lung Liao, Tian Qin
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Publication number: 20090212783Abstract: An apparatus for supporting BGA packages for one or more testing processes is disclosed. The apparatus includes a substrate member. The substrate member has a plurality of contact pads, with each of the contact pads being spatially disposed around a peripheral region of the substrate. The apparatus further includes a plurality of contact regions spatially configured on a portion of the substrate member. Each of the plurality of contact regions is numbered from 1 through N being electrically connected to respective contact pads numbered from 1 through N. The plurality of contact regions is configured to provide electrical contact to respective plurality of balls provided on a BGA package. The apparatus additionally includes a holder device coupled to the substrate member. The holder device is adapted to mechanically hold the BGA package in place to provide mechanical contact between the plurality of balls and respective plurality of contact regions.Type: ApplicationFiled: May 7, 2009Publication date: August 27, 2009Applicant: Semiconductor Manufacturing International (Shanghai) CorporationInventors: Shan An Liang, Chun Kui Ji, Ping Lung Liao, Tian Qin
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Patent number: 7541827Abstract: An apparatus for supporting BGA packages for one or more testing processes is disclosed. The apparatus includes a substrate member. The substrate member has a plurality of contact pads, with each of the contact pads being spatially disposed around a peripheral region of the substrate. The apparatus further includes a plurality of contact regions spatially configured on a portion of the substrate member. Each of the plurality of contact regions is numbered from 1 through N being electrically connected to respective contact pads numbered from 1 through N. The plurality of contact regions is configured to provide electrical contact to respective plurality of balls provided on a BGA package. The apparatus additionally includes a holder device coupled to the substrate member. The holder device is adapted to mechanically hold the BGA package in place to provide mechanical contact between the plurality of balls and respective plurality of contact regions.Type: GrantFiled: June 9, 2006Date of Patent: June 2, 2009Assignee: Semiconductor Manufacturing International (Shanghai) CorporationInventors: Shan An Liang, Chun Kui Ji, Ping Lung Liao, Tian Qin
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Publication number: 20070252609Abstract: An apparatus for supporting BGA packages for one or more testing processes is disclosed. The apparatus includes a substrate member. The substrate member has a plurality of contact pads, with each of the contact pads being spatially disposed around a peripheral region of the substrate. The apparatus further includes a plurality of contact regions spatially configured on a portion of the substrate member. Each of the plurality of contact regions is numbered from 1 through N being electrically connected to respective contact pads numbered from 1 through N. The plurality of contact regions is configured to provide electrical contact to respective plurality of balls provided on a BGA package. The apparatus additionally includes a holder device coupled to the substrate member. The holder device is adapted to mechanically hold the BGA package in place to provide mechanical contact between the plurality of balls and respective plurality of contact regions.Type: ApplicationFiled: June 9, 2006Publication date: November 1, 2007Applicant: Semiconductor Manufacturing International (Shanghai) CorporationInventors: Shan An Liang, Chung Kui Ji, Ping Lung Liao, Tian Qin
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Patent number: 6614078Abstract: CMOS I/O structures are described which are latchup-immune by inserting p+ and n+ diffusion guard-rings into the NMOS and PMOS source side of a semiconductor substrate, respectively. P+ diffusion guard-rings surround individual n-channel transistors and n+ diffusion guard-rings surround individual p-channel transistors. These guard-rings, connected to voltage supplies, reduce the shunt resistances of the parasitic SCRs, commonly associated with CMOS structures, from either the p-substrate to p+ guard-ring or the n-well to n+ guard-ring. In a second preferred embodiment a deep p+ implant is implanted into the p+ guard-ring or p-well pickup to decrease the shunt resistances of the parasitic SCRs. The n+ and p+ guard-rings, like the guard-rings of the first preferred embodiment, are connected to positive and negative voltage supplies, respectively.Type: GrantFiled: May 16, 2002Date of Patent: September 2, 2003Assignee: Taiwan Semiconductor Manufacturing CompanyInventors: Jian-Hsing Lee, Jiaw-Ren Shih, Shui-Hung Chen, Ping-Lung Liao
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Publication number: 20020164848Abstract: CMOS I/O structures are described which are latchup-immune by inserting p+ and n+ diffusion guard-rings into the NMOS and PMOS source side of a semiconductor substrate, respectively. P+ diffusion guard-rings surround individual n-channel transistors and n+ diffusion guard-rings surround individual p-channel transistors. These guard-rings, connected to voltage supplies, reduce the shunt resistances of the parasitic SCRs, commonly associated with CMOS structures, from either the p-substrate to p+ guard-ring or the n-well to n+ guard-ring. In a second preferred embodiment a deep p+ implant is implanted into the p+ guard-ring or p-well pickup to decrease the shunt resistances of the parasitic SCRs. The n+ and p+ guard-rings, like the guard-rings of the first preferred embodiment, are connected to positive and negative voltage supplies, respectively.Type: ApplicationFiled: May 16, 2002Publication date: November 7, 2002Inventors: Jian-Hsing Lee, Jiaw-Ren Shih, Shui-Hung Chen, Ping-Lung Liao
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Patent number: 6420221Abstract: CMOS I/O structures are described which are latchup-immune by inserting p+ and n+ diffusion guard-rings into the NMOS and PMOS source side of a semiconductor substrate, respectively. P+ diffusion guard-rings surround individual n-channel transistors and n+ diffusion guard-rings surround individual p-channel transistors. These guard-rings, connected to voltage supplies, reduce the shunt resistances of the parasitic SCRs, commonly associated with CMOS structures, from either the p-substrate to p+ guard-ring or the n-well to n+ guard-ring. In a second preferred embodiment a deep p+ implant is implanted into the p+ guard-ring or p-well pickup to decrease the shunt resistances of the parasitic SCRs. The n+ and p+ guard-rings, like the guard-rings of the first preferred embodiment, are connected to positive and negative voltage supplies, respectively.Type: GrantFiled: February 22, 2000Date of Patent: July 16, 2002Assignee: Taiwan Semiconductor Manufacturing CompanyInventors: Jian-Hsing Lee, Jiaw-Ren Shih, Shui-hung Chen, Ping-Lung Liao