Abstract: According to one aspect of the present disclosure, semiconductor device is provided. The semiconductor device may include a plurality of cutting lanes. The plurality of cutting lanes may include at least one first cutting lane. The plurality of cutting lanes may include a plurality of second cutting lanes disposed in parallel with the first cutting lane. The plurality of cutting lanes may include a third cutting lane disposed intersecting the first cutting lane and the second cutting lanes. The semiconductor device may include a plurality of dies defined by the intersection of the plurality of cutting lanes. The semiconductor device may include a die test structure only located in the first cutting lane. Any one of the at least one first cutting lane may be disposed adjacent to at least one of the plurality of second cutting lanes.

Abstract: Implementations of chip packaging structures, semiconductor structures and fabricating methods thereof are disclosed. A chip packaging structure comprises a substrate comprising: a signal transmitting wiring structure embedded in the substrate, and a thermal transmitting wiring structure embedded in the substrate. The chip packaging structure further comprises a first chip on the substrate and electrically connected with the signal transmitting wiring structure. The chip packaging structure further comprises at least one thermal conductive structure on the substrate, in thermal contact with the thermal transmitting wiring structure, and laterally surrounding the first chip.

Abstract: Examples of the present disclosure provide a wafer dicing device and a method of wafer dicing, the wafer dicing device including: a bearing platform, a first dicing sub device and a second dicing sub device, wherein the bearing platform is configured to bear the wafer to be diced, the first dicing sub device is configured to dice the wafer to be diced from a first side, and the second dicing sub device is configured to dice the wafer to be diced from a second side, the first side and the second side being opposite sides of the bearing platform in a first direction, the first direction being a direction of the thickness of the bearing platform.

Abstract: The present application discloses a semiconductor device and a fabrication method thereof, and a memory and a memory system. At least one cleavage plane guide structure extending along a second direction is disposed in a first cutting region adjacent to a first device region in a first direction in the semiconductor device, the second direction intersects the first direction, and the cleavage plane guide structure includes a first portion and a second portion that extend along the second direction, and the second portion has higher cleavage plane passability than the first portion. As such, a chip can cleave according to a preset direction and portion when stealth dicing is performed on the chip.

Abstract: The present disclosure provides a semiconductor device, a fabricating method thereof, a memory device and a memory system. The disclosed semiconductor device comprises a first device, a dicing street adjoining the first device laterally, a metal structure located in the dicing street, and a stealth cleavage lane extending in the dicing street.

Abstract: A high-capacity common-mode inductor processing circuit for network signal is disclosed. Each of high-capacity common-mode inductors is disposed between two adjacent circuit channels to perform signal coupling, and each high-capacity common-mode inductor has parasitic capacitance between primary and secondary sides thereof, each of autotransformers is disposed on a side of corresponding one of the high-capacity common-mode inductors, and center tap lines of the autotransformers are grounded. The high-capacity common-mode inductor includes an iron core post and an iron core cover, the iron core post includes a winding part to be wound by conductive wires, and the conductive wires are wound on the winding part by a preset number of turns, and upwardly stacked and wound on the winding part by a preset layer number. The high-capacity common-mode inductors and the parasitic capacitances can eliminate noise on the circuit channels and perform signal coupling.

Abstract: A high-capacity common-mode inductor processing circuit for network signal is disclosed. Each of high-capacity common-mode inductors is disposed between two adjacent circuit channels to perform signal coupling, and each high-capacity common-mode inductor has parasitic capacitance between primary and secondary sides thereof, each of autotransformers is disposed on a side of corresponding one of the high-capacity common-mode inductors, and center tap lines of the autotransformers are grounded. The high-capacity common-mode inductor includes an iron core post and an iron core cover, the iron core post includes a winding part to be wound by conductive wires, and the conductive wires are wound on the winding part by a preset number of turns, and upwardly stacked and wound on the winding part by a preset layer number. The high-capacity common-mode inductors and the parasitic capacitances can eliminate noise on the circuit channels and perform signal coupling.

Abstract: An electronic device wire conductor formation method includes the steps of using a plastic injection molding machine to create an insulative plastic block, operating a top mold of a transfer-printing equipment to reciprocate an adhesive-applying portion along a transfer-printing portion of a bottom mold for causing the adhesive-applying portion to coat a molten conductive adhesive evenly on the transfer-printing portion, inverting the insulative plastic block to attach molding units thereof onto the transfer-printing portion of the bottom mold for enabling the molten conductive adhesive to be transfer-printed onto U-shaped plates of the molding units, and finally removing the insulative plastic block from the bottom mold and then curing the coated conductive adhesive to form individual conductors on the respective U-shaped plate of molding units.

Abstract: A magnetic inductor coil printing method includes the step of printing at least one first coil winding on a core base, the step of printing a first insulating layer on the core base over the first coil winding, the step of printing at least one second coil winding on the core base over the first insulating layer, and the step of printing a second insulating layer on the core base over the second coil winding.

Abstract: An inductor includes an insulative plastic block having a block base with a recessed open chamber, a positioning unit including odd-numbered rows of U-shaped plates and even-numbered rows of U-shaped plates arranged in a staggered manner in the recessed open chamber of the block base of the insulative plastic block, and a plurality of conductors respectively formed on the U-shaped plates and spaced from one another, each conductor having two opposite ends thereof respectively terminating in a lead outside the block base.

Abstract: An inductor includes an insulative plastic block having a block base with a recessed open chamber, a positioning unit including rows of U-shaped plates in the recessed open chamber, and conductors respectively formed on the U-shaped plates by metallization and spaced from one another, each conductor having two opposite leads disposed outside the block base, a magnetic conductive component having a magnetic core with slots cut through opposing top and bottom sides mounted in the recessed open chamber that the U-shaped plates are inserted into the slots of the magnetic core, and a connection carrier including a substrate and a wire array located on the substrate and electrically bonded with the leads; there is a width between each two adjacent U-shaped plates, enabling the conductors to be spaced from one another, the direction and the conductors can be precisely controlled, achieving the effects of high production efficiency and cost effectiveness.

Abstract: A magnetic device fabrication method includes the step of using molds to respectively process a first substrate and a second substrate into respective predetermined shapes, the step of forming conductors in shaped protruding blocks of the first substrate and conducting contacts in the second substrate, the step of attaching one or more magnetic cores to the first plate member to couple one or more positioning slots to the protruding blocks of the first plate member respectively and the step of bonding one or multiple magnetic cores between the first and second substrate to provide a continuous winding type induction coil effect, saving much manufacturing labor and time.

Abstract: An inductor with coil conductor formed by conductive material includes an insulative plastic block including a block base, a positioning unit with U-shaped plates mounted in the block base and conductors respectively formed of an electroplated conductive adhesive on the U-shaped plates using laser direct structuring (LDS) and isolated from one another, magnetic conductive components each including a magnetic core mounted in the base and defining therein slots for the passing of the U-shaped plates, and a connection carrier including a substrate and a wire array located on the substrate and electrically bonded with leads of the conductors to create with the magnetic cores a magnetic coil loop capable of providing a magnetic induction effect. Thus, the inductor of the invention has the advantages of simple structure, high production efficiency and cost effectiveness.

Abstract: A magnetic device includes two substrates arranged in parallel with one substrate providing one or multiple protruding block and a plurality of conductors in each protruding block and the other substrate providing a plurality of conducting contacts respectively disposed in contact with the conductors, and one or multiple magnetic cores mounted between the two substrates and coupled to the one or multiple protruding blocks, each magnetic core having one or multiple positioning slots respectively configured for receiving one respective protruding block so that the conductors and the conducting contacts are electrically connected to create with the one or multiple magnetic cores multiple induction areas for providing a continuous winding type induction coil effect.

Abstract: A magnetic device fabrication method includes the step of using molds to respectively process a first substrate and a second substrate into respective predetermined shapes, the step of forming conductors in shaped protruding blocks of the first substrate and conducting contacts in the second substrate, the step of attaching one or more magnetic cores to the first plate member to couple one or more positioning slots to the protruding blocks of the first plate member respectively and the step of bonding one or multiple magnetic cores between the first and second substrate to provide a continuous winding type induction coil effect, saving much manufacturing labor and time.

Abstract: An inductor with conductive adhesive coil conductor includes an insulative plastic block including a block base, a positioning unit with U-shaped plates mounted in the block base and conductors respectively formed of a conductive adhesive on the U-shaped plates by transfer printing and isolated from one another, magnetic conductive components each including a magnetic core mounted in the base and defining therein slots for the passing of the U-shaped plates, and a connection carrier including a substrate and a wire array located on the substrate and electrically bonded with leads of the conductors to create with the magnetic cores a magnetic coil loop capable of providing a magnetic induction effect.

Abstract: An electronic device wire conductor formation method includes the steps of using a plastic injection molding machine to create an insulative plastic block, operating a top mold of a transfer-printing equipment to reciprocate an adhesive-applying portion along a transfer-printing portion of a bottom mold for causing the adhesive-applying portion to coat a molten conductive adhesive evenly on the transfer-printing portion, inverting the insulative plastic block to attach molding units thereof onto the transfer-printing portion of the bottom mold for enabling the molten conductive adhesive to be transfer-printed onto U-shaped plates of the molding units, and finally removing the insulative plastic block from the bottom mold and then curing the coated conductive adhesive to form individual conductors on the respective U-shaped plate of molding units.

Abstract: An inductor with conductive adhesive coil conductor includes an insulative plastic block including a block base, a positioning unit with U-shaped plates mounted in the block base and conductors respectively formed of a conductive adhesive on the U-shaped plates by transfer printing and isolated from one another, magnetic conductive components each including a magnetic core mounted in the base and defining therein slots for the passing of the U-shaped plates, and a connection carrier including a substrate and a wire array located on the substrate and electrically bonded with leads of the conductors to create with the magnetic cores a magnetic coil loop capable of providing a magnetic induction effect.

Abstract: A pixel cell has a photodiode, a transfer transistor, a reset transistor, an amplifier transistor and a readout circuit block. The photodiode, transfer transistor, reset transistor and amplifier transistor are disposed within a first substrate of a first semiconductor chip for accumulating an image charge in response to light incident upon the photodiode and converting the image charge to an image signal. The readout circuit block is disposed within a second substrate of a second semiconductor chip and the readout circuit block comprises optionally selectable rolling shutter and global shutter readout modes through the use of computer programmable digital register settings. The global shutter readout mode provides in-pixel correlated double sampling.

Abstract: A pixel cell has a photodiode, a transfer transistor, a reset transistor, an amplifier transistor and a readout circuit block. The photodiode, transfer transistor, reset transistor and amplifier transistor are disposed within a first substrate of a first semiconductor chip for accumulating an image charge in response to light incident upon the photodiode and converting the image charge to an image signal. The readout circuit block is disposed within a second substrate of a second semiconductor chip and the readout circuit block comprises optionally selectable rolling shutter and global shutter readout modes through the use of computer programmable digital register settings. The global shutter readout mode provides in-pixel correlated double sampling.