Abstract: An apparatus, in accordance with particular embodiments, includes an interface configured to establish connections within a copper network. The apparatus also includes a receptacle configured to receive a conventional small form-factor pluggable (SFP) module or a compact SFP module and to direct the SFP modules to a first connector. The first connector connects either of the SFP modules to the node. A pin of the first connector is configured to receive a module detection signal and to transmit data to the compact SFP module. The apparatus also includes a low pass filter coupled to the pin of the first connector that passes the module detection signal to the node. The apparatus is further configured to establish two duplex connections with an optical fiber network if the compact SFP module is connected and to establish one duplex connection with the optical fiber network if the conventional SFP module is connected.

Abstract: A semiconductor assembly includes a first subassembly comprising a heat sink and a first patterned polymer layer disposed on a surface of the heat sink to define an exposed portion of the first surface. The exposed portion of the first surface extends radially inward along the heat sink surface from the first layer. The subassembly also includes a second patterned polymer layer disposed on a radially outer portion of the first patterned polymer layer. The first and second layers define a cell for accommodating a power semiconductor die. Solder material is disposed on the exposed portion of the heat sink surface and in the cell. A power semiconductor die is located within the cell on a radially inward portion of the first layer and thermally coupled to the heat sink by the solder material.

Abstract: A magnetic head includes a slider substrate having a trailing edge and multiple bonding pads arranged on the trailing edge in a row. Each of the bonding pads includes a seed layer adhered to the trailing edge and electrically connected with the slider substrate, a soldering layer formed on the seed layer and adapted for connecting with a suspension, and at least one solder nonwettable layer adhered to the trailing edge and connected with at least one side of the seed layer. The structure of the magnetic head is simple and stable, which can prevent the bonding pads bridging and shorting-circuit. An HGA and a disk drive unit with the same, a manufacturing method for the magnetic head are also disclosed.

Abstract: An enhanced small form-factor pluggable (SFP+) transceiver module and an SFP+ host port are provided. The enhanced SFP+ transceiver module receives a reception data signal at a data rate of 40 gigabits per second (40G). The reception data signal is sent to a transceiver bidirectional transmission unit. The transceiver bidirectional transmission unit comprises a first SFP+ connector unit configured to interface with a second SFP+ connector unit of an SFP+ host port. The reception data signal is sent from the transceiver bidirectional transmission unit to the second SFP+ connector unit of the SFP+ host port via the first SFP+ connector unit.

Abstract: A method is provided, including (a) upon a standard small form-factor pluggable (SFP) module being inserted into an SFP jack on a network host device, determining if the SFP module is a legacy device or a smart device, (b) upon determining that the SFP module is a legacy device, receiving a magic code from the SFP module and determining if the magic code is a valid magic code, and (c) upon determining that the SFP module is a smart device, performing a smart authentication process with the SFP module. Associated apparatuses and additional methods are also provided.

Abstract: Techniques are provided for an adapter device configured to enable communications between a quad small form-factor pluggable (QSFP) transceiver unit and a CXP host port. The adapter device comprises a first connector unit, a second connector unit, a microcontroller unit and a plurality of reception equalizer units. Data signals are sent by the transceiver unit to a first equalizer unit via the first connector unit. The first equalizer unit adjusts the data signals and sends the data signals to the host port via the second connector unit. Likewise, data signals are sent by the host port to a second equalizer unit via the second connector unit. The second equalizer unit adjusts the data signals and sends the data signals to the transceiver unit via the first connector unit.

Abstract: Adaptive power setting techniques for optical transceivers are provided. Optical signals are received at a first optical transceiver device that are transmitted from a second optical transceiver device. A receive power of the optical signals received at the first optical transceiver device from the second optical transceiver device is determined. A characteristic of optical signals transmitted by the first optical transceiver device to the second optical transceiver device is modulated to indicate to the second optical transceiver device a disparity of the receive power with respect to a target receive power level at the first optical transceiver device. Conversely, the first optical transceiver device adjusts a power level of optical signals transmitted by the first optical transceiver device to the second optical transceiver device based on a characteristic of the optical signals received at the first optical transceiver device.

Abstract: An axially-mountable device includes a semiconductor chip comprising lower and upper electrical contacts. A lower die pad is electrically and mechanically connected to the lower electrical contact of the chip. An upper die pad is electrically and mechanically connected to the upper electrical contact of the chip. A first axially extending electrical lead is electrically and mechanically connected to the upper die pad and extends in a first axial direction. A second axially extending electrical lead is electrically and mechanically connected to the lower die pad and extends in a second axial direction that is opposite to the first axial direction. Packaging material encapsulates the semiconductor chip, the upper and lower die pads and a portion of the first and second axially extending leads. The first and second leads extend from the packaging material and are adapted to allow the device to be axially-mounted with another electrical component.

Abstract: An apparatus, in accordance with particular embodiments, includes an interface configured to establish connections within a copper network. The apparatus also includes a receptacle configured to receive a conventional small form-factor pluggable (SFP) module or a compact SFP module and to direct the SFP modules to a first connector. The first connector connects either of the SFP modules to the node. A pin of the first connector is configured to receive a module detection signal and to transmit data to the compact SFP module. The apparatus also includes a low pass filter coupled to the pin of the first connector that passes the module detection signal to the node. The apparatus is further configured to establish two duplex connections with an optical fiber network if the compact SFP module is connected and to establish one duplex connection with the optical fiber network if the conventional SFP module is connected.

Abstract: An apparatus includes a transceiver device mounted on a printed circuit board and configured to selectively transmit and receive signals at a first data rate or signals at a second data rate. An X2 form factor pluggable connector disposed at one end of the printed circuit board includes first and second pins that respectively convey signals at the first and second data rates between the transceiver device and a system device. A port device disposed at an opposite end of the printed circuit board conveys signals between the transceiver device and a network device. A management circuit determines which of the first and second data rates is selected based on transmissions between the system device and the network device and controls the transceiver device to transmit and receive signal at the first data rate via the first pins and at the second data rate via the second pins.

Abstract: Embodiments of the present disclosure provide techniques and configurations to determine, by a digital image capture device, that lens calibration data is to be downloaded for a lens assembly of the digital image capture device and to download the lens calibration data. Other embodiments may be described and/or claimed.

Abstract: A method for detecting a semiconductor device property is provided. First, a semiconductor device is provided. Thereafter, a detecting current is applied and the semiconductor device is heated, and temperatures and voltages of the semiconductor device are measured, so as to establish a relationship between the temperatures and the voltages of the semiconductor device. Accordingly, a temperature sensitive parameter (TSP) is calculated. An apparatus for detecting a semiconductor device property is also provided.

Abstract: A system, method and apparatus is provided for optimizing network data communications. At an extender device, a data signal is received at a host link port across a data cable that is interfaced with the host link port. The host link port is configured to receive the data signal. The data cable is configured to carry management communications and data communications between a switch host device and the extender unit device. The data signal is split into data signal components. Each of the data signal components comprises a ten gigabit per second portion of the data signal. The data signal components are sent to one or more network devices via one or more corresponding data transmission ports.

Abstract: Apparatus having corresponding methods and non-transitory computer-readable media comprise: a wireless local-area network (WLAN) module comprising a receiver configured to receive a WLAN signal into the WLAN module; a transmitter; and a loopback controller configured to selectively loop back the WLAN signal to the transmitter, wherein the transmitter is configured to transmit the looped-back WLAN signal from the WLAN module.

Abstract: Systems and methods for reducing condensation along an air bearing surface of a slider in an energy assisted magnetic recording system are provided. In one embodiment, the invention relates to a slider configured to reduce condensation along an air bearing surface in an energy assisted magnetic recording system, the slider including an air bearing surface (ABS), a write transducer including a portion disposed at the ABS, a hot spot region disposed along the ABS, where the hot spot region includes the portion of the write transducer at the ABS, and a trench surrounding the hot spot region.

Abstract: A signal denoising method for a frequency-scan ion trap mass spectrometer includes reading a signal raw data array observed in the spectrometer. The signal raw data array is processed by Boxcar averaging method to obtain a first signal array. Then the first signal array is processed by a harmonic interference cancellation method to obtain a second data array. Next the second signal array is processed by a radio frequency interference reduction method and a third signal array without the background induced from driving voltage of ion trap is reconstructed according to the second signal array.

Abstract: A pluggable module for releasable engagement with a computing device includes a first end portion, a second end portion and a release tab structure. The release tab structure connects with the first end portion to facilitate removal of the module from the port of the computing device and has a generally U-shaped profile including two elongated arms spatially distanced from each other and extending transversely from the first end portion and terminating at a crossbar that connects between the elongated arms. Portions of the elongated arms and the crossbar extend within a plane that is separated a sufficient distance from the cable connector so as to facilitate 360° of access around the cable connector during connection and removal of the cable connector with the cable connection port.

Abstract: Techniques are provided for sending and receiving data communications across management data channels. The techniques comprise a quad small form-factor pluggable (QSFP) transceiver module configured to send and receive a plurality of data signals, a plurality of enhanced small form-factor pluggable (SFP+) transceiver cage devices, and a plurality of management cables. Each of the SFP+ transceiver cage devices is configured to interface with an SFP+ transceiver module. Each of the management cables is configured to interface with the QSFP transceiver module and corresponding ones of the SFP+ transceiver cage devices. Furthermore, each of the management cables operates as a data channel to manage data flow between the QSFP transceiver module and the corresponding ones of the SFP+ transceiver cage devices.

Abstract: Techniques are provided for an adapter device configured to enable communications between a quad small form-factor pluggable (QSFP) transceiver unit and a CXP host port. The adapter device comprises a first connector unit, a second connector unit, a microcontroller unit and a plurality of reception equalizer units. Data signals are sent by the transceiver unit to a first equalizer unit via the first connector unit. The first equalizer unit adjusts the data signals and sends the data signals to the host port via the second connector unit. Likewise, data signals are sent by the host port to a second equalizer unit via the second connector unit. The second equalizer unit adjusts the data signals and sends the data signals to the transceiver unit via the first connector unit.

Abstract: An enhanced small form-factor pluggable (SFP+) transceiver module and an SFP+ host port are provided. The enhanced SFP+ transceiver module receives a reception data signal at a data rate of 40 gigabits per second (40 G). The reception data signal is sent to a transceiver bidirectional transmission unit. The transceiver bidirectional transmission unit comprises a first SFP+ connector unit configured to interface with a second SFP+ connector unit of an SFP+ host port. The reception data signal is sent from the transceiver bidirectional transmission unit to the second SFP+ connector unit of the SFP+ host port via the first SFP+ connector unit.