Abstract: An LED packaging construction has a chip embedded on a recessed carrier on substrate; conduction circuits with different electrodes being disposed to the peripheral of the carrier; electrode layer of chip being connected to conduction circuits with golden plated wire; fluorescent powder being filled in the carrier before mounting the colloid on the powder layer; coverage of colloid extending to substrate to complete LED packaging; larger binding range between colloid and substrate yielding better strength and increased light-emitting angle of the chip through the colloid.

Abstract: An LED chip capping construction to enhance luminance of the LED containing a condenser capping over a chip of the LED; a condensing part of the condenser protruding through a carrier and surrounded by multiple condensing aspects; the source light from the chip passing the condenser and consistently reflected to each condensing aspect due to the medium characteristics of the condenser.

Abstract: The present invention describes a light emitting diode illumination apparatus made of a light bulb base, a heat dissipating device, a plastic lid, a drive substrate, a metal substrate, a circular insulated base and a casing, and the heat dissipating device is in contact with the metal substrate in normal conditions, such that the heat source produced by each light emitting diode is conducted to the heat dissipating device through the metal substrate and then conducted from the heat dissipating device to the light bulb base for effectively dispersing the heat source and maintaining the light emitting efficiency of each light emitting diode.

Abstract: An LED packaging construction has a chip embedded on a recessed carrier on substrate; conduction circuits with different electrodes being disposed to the peripheral of the carrier; electrode layer of chip being connected to conduction circuits with golden plated wire; fluorescent powder being filled in the carrier before mounting the colloid on the powder layer; coverage of colloid extending to substrate to complete LED packaging; larger binding range between colloid and substrate yielding better strength and increased light-emitting angle of the chip through the colloid.

Abstract: An LED manufacturing process involves having a light emitting chip set in a preset loading pit on a carrier with an encapsulating material; conductive circuits with different electrodes being disposed of a substrate on the perimeter of the carrier; golden plated wire connecting the chip and the circuits; ;the carrier being them encapsulated using jet printing technique with a mixture of encapsulating material comprised of fluorescent powder and glue to achieve precise control of the range of jet printing for the encapsulating material to be consistently cover up in the carrier.

Abstract: A light emitting chip carrier structure includes a basin with a predetermined height protruded from the surface of a substrate for containing a carrier of a light emitting chip, and a package material for packaging the light emitting chip and the basin, so as to greatly increase the light emitting angle of the light emitting chip, while increasing the contact area of the package material, enhancing the adhesion between the package material and the substrate, and improving the overall brightness performance and reliability of the light emitting diode.

Abstract: The present invention discloses a multiple-wavelength light emitting diode that includes a fluorescent layer with a predetermined wavelength disposed at the bottom of the light emitting diode, such that a light emitting chip can be fixed onto a carrier and connected in parallel with the circuit of the light emitting chip by a gold wire. The light emitting chip is packaged by a package material to constitute a light emitting diode capable of combining the light source of the light emitting chip with the wavelength of the fluorescent layer, so as to produces the desired light color.

Abstract: The present invention describes a light emitting diode illumination apparatus made of a light bulb base, a heat dissipating device, a plastic lid, a drive substrate, a metal substrate, a circular insulated base and a casing, and the heat dissipating device is in contact with the metal substrate in normal conditions, such that the heat source produced by each light emitting diode is conducted to the heat dissipating device through the metal substrate and then conducted from the heat dissipating device to the light bulb base for effectively dispersing the heat source and maintaining the light emitting efficiency of each light emitting diode.

Abstract: A construction to enhance luminance of a light emitting diode having a plate luminance-enhancing device provided on the surface of electric circuit of the LED; a recess to permit penetration by the LED, wall of the recess facing the reflective wall expanding at a certain inclination in the direction of the dome of the LED to reflect the light source at the position of the peripheral of the LED in the direction of towards the dome of the LED to significantly upgrade the luminance performance of the LED.

Abstract: An LED chip capping construction to enhance luminance of the LED containing a condenser capping over a chip of the LED; a condensing part of the condenser protruding through a carrier and surrounded by multiple condensing aspects; the source light from the chip passing the condenser and consistently reflected to each condensing aspect due to the medium characteristics of the condenser.

Abstract: A chip capping construction for a light emitting diode having capped a transparent transitional layer on the top of the chip; a convex functional layer mixed with fluorescent material being capped on the top of the transparent transitional layer; the thickness at where the functional layer in relation to the top layer of the chip being greater than that of the functional layer in relation to the peripheral of the chip; and the greater thickness balancing the wavelength incorporation of the fluorescent material respectively with the top layer and the peripheral layer of the chip to effectively inhibit the creation of diaphragm of strange color.

Abstract: A high illumination light emitting diode includes a transparent insulator containing conducting ends of different polarities and a carrier; a chip being fixed to the carrier, fluorescent material being applied to the peripheral of the chip; a gold plated wire connecting the electrode and those conducting ends; a reflector being fixed to the carrier on the side attached with the chip; and the light emitted from the chip being projected toward the exterior of the transparent insulator due to the reflection of the reflector to effectively increase the illumination of the light emitting diode.