Abstract: A method for forming a chip package structure is provided. The method includes removing a first portion of a substrate to form a first recess in the substrate. The method includes forming a buffer structure in the first recess. A first Young's modulus of the buffer structure is less than a second Young's modulus of the substrate. The method includes forming a first wiring structure over the buffer structure and the substrate. The method includes bonding a chip package to the first wiring structure. The chip package has an interposer substrate and a chip structure over the interposer substrate, and a first corner of the interposer substrate and a second corner of the chip structure overlap the buffer structure in a top view of the chip package and the buffer structure.

Abstract: A federated learning method includes: providing importance parameters and performance parameters by client devices respectively to a central device, performing a training procedure by the central device, wherein the training procedure includes: selecting target devices from the client devices according to a priority order associated with the importance parameters, dividing the target devices into training groups according to a similarity of the performance parameters, notifying the target devices to perform iterations according to the training groups respectively to generate trained models, transmitting the trained models to the central device, and updating a global model based on the trained models, performing the training procedure again or outputting the global model to the client devices based on a convergence value of the global model and the number of times of performing the training procedure.

Abstract: A testing apparatus including a testing platform, a loading device, a testing-signal generating device, a sound sensing device, a control unit, and an unloading device is disclosed. The loading device is configured to load a plurality of under-test devices to the testing platform. The testing-signal generating device is configured to generate at least one testing signal. The plurality of under-test devices receives the at least one testing signal and produces at least one testing sound-according to the at least one testing signal. The sound sensing device is configured to receive the at least one testing sound. The control unit controls the unloading device to unload the plurality of under-test devices from the testing platform and controls the unloading device to categorize the plurality of under-test devices into a plurality of groups according to the at least one testing sound received by the sound sensing device.