Patents by Inventor Ping Sheung Lau

Ping Sheung Lau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadless plastic chip carrier and method of fabricating same
    Patent number: 7410830
    Abstract: A process for fabricating a leadless plastic chip carrier includes providing a leadframe including a plurality of contacts circumscribing a void; fixing a heat sink to the contacts of the leadframe using an intermediate non-electrically conductive adhesive such that the heat sink spans the void; mounting a semiconductor die to the heat sink in the void; wire bonding ones of the contacts to the pads of the semiconductor die; encapsulating the semiconductor die and the wire bonds in a molding material and singulating the leadless plastic chip carrier.
    Type: Grant
    Filed: September 26, 2005
    Date of Patent: August 12, 2008
    Assignee: ASAT Ltd
    Inventors: Chun Ho Fan, Tsui Yee Lin, Ping Sheung Lau
  • Process for dressing molded array package saw blade
    Patent number: 6903304
    Abstract: A process for reworking or dressing a saw blade used in wafer dicing and singulation of molded array integrated circuit packages, includes rotating the saw blade on a spindle and ablating an edge portion of the saw blade using a laser and thereby dressing the saw blade.
    Type: Grant
    Filed: September 12, 2003
    Date of Patent: June 7, 2005
    Assignee: Asat Ltd.
    Inventors: Neil McLellan, Chun Ho Fan, Geraldine Tsui Yee Lin, John Ping Sheung Lau