Patents by Inventor Ping Shun Hsu

Ping Shun Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8500426
    Abstract: A counterpressure/temperature control apparatus, comprises: a mold, having a runner and an air passage, both coupled to a mold cavity inside the mold; a logic control valve, coupled to the air passage for controlling a high-temperature gas or/and a counterpressure gas to flow in and out the mold cavity; a counterpressure gas supplying device, for supplying the counterpressure gas to the mold cavity through the logic control valve; and a high-temperature gas supplying device, for supplying the high-temperature gas to the mold cavity through the logic control valve; wherein the mold cavity is heated by the high-temperature gas, while subjecting the same to a counterpressure provided from the counterpressure gas supplying device during an injection molding process, and thereby, not only the surface quality of a product resulting from the injection molding process can be improved, but also the size of foams and the distribution evenness thereof are enhanced.
    Type: Grant
    Filed: August 25, 2011
    Date of Patent: August 6, 2013
    Assignee: Chung Yuan Christian University
    Inventors: Shia-Chung Chen, Ping-Shun Hsu, Jen-An Chang, Shyh-Shin Hwang, Chia-Yen Tseng
  • Publication number: 20120052143
    Abstract: A counterpressure/temperature control apparatus, comprises: a mold, having a runner and an air passage, both coupled to a mold cavity inside the mold; a logic control valve, coupled to the air passage for controlling a high-temperature gas or/and a counterpressure gas to flow in and out the mold cavity; a counterpressure gas supplying device, for supplying the counterpressure gas to the mold cavity through the logic control valve; and a high-temperature gas supplying device, for supplying the high-temperature gas to the mold cavity through the logic control valve; wherein the mold cavity is heated by the high-temperature gas, while subjecting the same to a counterpressure provided from the counterpressure gas supplying device during an injection molding process, and thereby, not only the surface quality of a product resulting from the injection molding process can be improved, but also the size of foams and the distribution evenness thereof are enhanced.
    Type: Application
    Filed: August 25, 2011
    Publication date: March 1, 2012
    Applicant: CHUNG YUAN CHRISTIAN UNIVERSITY
    Inventors: SHIA-CHUNG CHEN, Ping-Shun Hsu, Jen-An Chang, Shyh-Shin Hwang, Chia-Yen Tseng
  • Publication number: 20120021083
    Abstract: A non-planar large-scale film extending apparatus is disclosed, which comprises: a transportation mechanism; and a pressing mechanism; wherein the transportation is used for clamping to two sides of a film and thus expanding the film while enabling the same to be transported and passing through the pressing mechanism following a specific path; and the pressing mechanism is configured with a non-planar pressing surface to be used for pressing upon the film and thus enabling the film being transported by the transportation mechanism to extend uniformly in a manner that the width of the film is increased while allowing the pores on the film to be distributed evenly, and thereby, creating a microporous film with large filtering area.
    Type: Application
    Filed: July 21, 2011
    Publication date: January 26, 2012
    Applicant: CHUNG YUAN CHRISTIAN UNIVERSITY
    Inventors: Shia-Chung Chen, Ping-Shun Hsu, Chia-Yen Tseng
  • Publication number: 20090194908
    Abstract: A mold for injection molding and an injection molding device/method with surface quality improvement ability are disclosed, in which the injection molding device comprises: a mold including a first mold piece and a second mold piece; and a film feeder. In an exemplary embodiment, the second mold piece is configured with a suction unit in a manner that the film feeder is enabled to provide a film to the suction unit.
    Type: Application
    Filed: June 2, 2008
    Publication date: August 6, 2009
    Applicant: CHUNG YUAN CHRISTIAN UNIVERSITY
    Inventors: SHIA-CHUNG CHEN, Jen-An Chang, Ho-Hsiang Wang, Ping-Shun Hsu
  • Publication number: 20090166909
    Abstract: A temperature control system includes a mold device having a mold cavity formed between two or more mold pieces for receiving a filling material, a number of detecting devices attached to the mold pieces for detecting the temperature of the mold pieces, a heating device for heating the mold pieces to a desired temperature, and a control module coupled to the mold pieces for closing and opening the mold cavity of the mold device, and for receiving the detected temperature signals from the detecting devices, and for controlling the heating device, such as for moving the heating device relative to the mold pieces of the mold device and for suitably pre-heating the mold pieces of the mold device.
    Type: Application
    Filed: October 29, 2008
    Publication date: July 2, 2009
    Inventors: Shia Chung Chen, Yeon Pun Chang, Jen An Chang, Ping Shun Hsu
  • Publication number: 20080264862
    Abstract: A membrane treating or forming method includes a membrane having two opposite surfaces and a number of perforations formed in the membrane, an area closer to one of the surfaces of the membrane is cooled with such as a cool device, and an area closer to the other surface of the membrane is heated in order to distort and deform the perforations of the membrane and for forming uneven or distorted or deformed perforations in the membrane and thus for preventing the perforations of the membrane from being blocked by dirt or particles. A cold device is disposed in and spaced away from the heat device for forming an inner peripheral space between the heat device and the cold device and for receiving the membrane.
    Type: Application
    Filed: April 24, 2007
    Publication date: October 30, 2008
    Inventors: Shia Chung Chen, Lei Ti Huang, Ping Shun Hsu