Abstract: A method is to form a thin film light emitting device. The method includes providing a transparent substrate. A transparent anode layer, a light emitting layer, a metal cathode layer are sequentially formed on the transparent substrate. A sealant layer is formed to at least cover the light emitting layer and the metal cathode layer. A covering layer having a covering surface is provided. An evaporation process is performed to form an active absorption layer on the covering surface of the covering layer. The covering surface of the covering layer covers on a portion of the sealant layer above the metal cathode layer. The covering layer can have a recess region that is to be formed the active absorption layer thereon. Alternatively, the active absorption layer can be evaporated before the sealant is formed. Moreover, the active absorption layer can be replaced with an insulating layer.

Abstract: A packaging material used for a display device which is a desiccative-containing adhesive agent. The desiccative-containing adhesive agent is composed of a liquid-state organic material selected from a group including epoxy resin, polyurethane, bakelite, polyamide, acrylic resin and polysiloxane, and a solid-state desiccative selected from a group including alkaline metal oxide, alkaline-earth metal oxide, metallic halide, barium oxide, calcium oxide, calcium sulfate, calcium chloride, lithium chloride, calcium bromide, potassium Carbonate, aluminum oxide, magnesium oxide, copper sulfate, zinc chloride, zinc bromide, cobalt chloride, silica gel, zeolite and molecular sieve.

Abstract: A packaging structure for an OLED/PLED device. The packaging structure has a glass substrate on which a luminescent element is completed, and a sealing cap bonded to the rim of the glass substrate so as to seal the luminescent element within an airtight space. Also, a sealing agent is disposed between the rims of the sealing cap and the glass substrate, wherein the sealing agent is an alloy with a low eutectic point about 100˜300° C.

Abstract: A housing structure used for a display device. A transparent substrate is provided with a completed luminescent device. The rim of the transparent substrate is bonded to the rim of a sealing cap to form an airtight space. A sealing structure with a first sealing layer and a second sealing layer is provided on the bonding rim between the sealing cap and the transparent substrate. The materials used to form the first sealing layer and the second sealing layer are different.

Abstract: A housing structure used for a display device. A transparent substrate is provided with a completed luminescent device. The rim of the transparent substrate is bonded to the rim of a sealing cap to form an airtight space. A sealing structure with a first sealing layer and a second sealing layer is provided on the bonding rim between the sealing cap and the transparent substrate. The materials used to form the first sealing layer and the second sealing layer are different.

Abstract: A packaging structure for an OLED/PLED device. The packaging structure has a glass substrate on which a luminescent element is completed, and a sealing cap bonded to the rim of the glass substrate so as to seal the luminescent element within an airtight space. Also, a sealing agent is disposed between the rims of the sealing cap and the glass substrate, wherein the sealing agent is an alloy with a low eutectic point about 100˜300° C.

Abstract: A method is to form a thin film light emitting device. The method includes providing a transparent substrate. A transparent anode layer, a light emitting layer, a metal cathode layer are sequentially formed on the transparent substrate. A sealant layer is formed to at least cover the light emitting layer and the metal cathode layer. A covering layer having a covering surface is provided. An evaporation process is performed to form an active absorption layer on the covering surface of the covering layer. The covering surface of the covering layer covers on a portion of the sealant layer above the metal cathode layer. The covering layer can have a recess region that is to be formed the active absorption layer thereon. Alternatively, the active absorption cab be evaporated before the sealant is formed. Moreover, the active absorption layer can be replaced with an insulating layer.