Abstract: A technique for signal deskew at the non-volatile memory side. The non-volatile memory includes a plurality of dies and a signal timing adjustment circuit. The dies are grouped into storage zones. A controller is coupled to the non-volatile memory through a plurality of data lines. Through the data lines, the controller issues a plurality of commands to provide zone delay parameters to the non-volatile memory to drive the signal timing adjustment circuit at the non-volatile memory side to separately adjust data-line timing of the different storage zones.

Abstract: A microbial strain of Lachnospiraceae is a species of a genus of the family Lachnospiraceae (Lachnospiraceae sp.). The nucleotide sequence of 16S rRNA of the microbial strain of Lachnospiraceae is as shown in SEQ ID No. 1. The intestinal anaerobic microbial strain Lachnospiraceae sp. can inhibit the growth rate of tumors and can be used for preventing and/or treating tumors. The tumors include at least one of liver cancer, colon cancer, rectal cancer, colorectal cancer, lung cancer, breast cancer, cervical cancer, ovarian cancer, pancreatic cancer, cholangiocarcinoma, kidney cancer, and fibrosarcoma.

Abstract: The invention relates to a method of treatment comprising administering a long-acting mutant human fibroblast growth factor to a subject in need thereof. The said long-acting mutant human fibroblast growth factor is mPBG-CH2-N?H-mFGF21, wherein mFGF21 consists of SEQ ID NO:1, and the said new use consists of a method of treating non-alcoholic steatohepatitis.

Abstract: The invention relates to a method of treatment comprising administering a long-acting mutant human fibroblast growth factor to a subject in need thereof. The said long-acting mutant human fibroblast growth factor is mPEG-CH2—N?H-mFGF21, wherein mFGF21 consists of SEQ ID NO: 1, and the said new use consists of a method of treating non-alcoholic steatohepatitis.

Abstract: Methods of conducting electrical tests on semiconductor packages are provided. A method according to the present disclosure includes forming a build-up structure that includes a plurality of metal layers embedded a plurality of dielectric layers, forming a core structure that embeds a passive device, performing a first electrical test on the build-up structure, performing a second electrical test on the core structure, and after performing the first electrical test and the second electrical test, bonding the build-up structure to the core structure.

Abstract: A chip package structure is provided. The chip package structure includes a substrate. The chip package structure includes a buffer structure penetrating into the substrate. A first Young's modulus of the buffer structure is less than a second Young's modulus of the substrate. The chip package structure includes a first wiring structure over the buffer structure and the substrate. The first wiring structure includes a first dielectric structure and a first wiring layer in the first dielectric structure. The chip package structure includes a chip package bonded to the first wiring structure. The chip package has an interposer substrate and a chip structure over the interposer substrate, and a first corner of the interposer substrate and a second corner of the chip structure overlap the buffer structure in a top view of the chip package and the buffer structure.

Abstract: A chip package structure includes: a composite interposer including at least one in-interposer semiconductor chip including a respective semiconductor circuitry therein, a dielectric matrix laterally surrounding the at least one in-interposer semiconductor chip, a die-side redistribution structure located on a first side of the dielectric matrix, and a substrate-side redistribution structure located on a second side of the dielectric matrix; and at least one semiconductor die attached to the die-side redistribution structure through a respective array of solder material portions.

Abstract: A method for forming a chip package structure is provided. The method includes removing a first portion of a substrate to form a first recess in the substrate. The method includes forming a buffer structure in the first recess. A first Young's modulus of the buffer structure is less than a second Young's modulus of the substrate. The method includes forming a first wiring structure over the buffer structure and the substrate. The method includes bonding a chip package to the first wiring structure. The chip package has an interposer substrate and a chip structure over the interposer substrate, and a first corner of the interposer substrate and a second corner of the chip structure overlap the buffer structure in a top view of the chip package and the buffer structure.

Abstract: A lifting device of a display, is provided. The lifting device includes a stationary member, a lifting member, and an elastic module. The stationary member is suitable for being fixed to a vertical plane. The lifting member is slidably connected to the stationary member. The lifting member is suitable for being fixed to a back portion of the display. The lifting member is suitable for sliding relative to the stationary member between a first position and a second position lower than the first position. The elastic module is coupled between the stationary member and the lifting member. The elastic module is suitable for exerting a pulling force opposite to a gravity direction on the lifting member.

Abstract: Catalyst compositions comprising a zeolite and a mesoporous support or binder are disclosed. The mesoporous support or binder comprises a mesoporous metal oxide having a particle diameter of greater than or equal to 20 ?m at 50% of the cumulative pore size distribution (d50). Also disclosed are processes for producing a mono-alkylated aromatic compound (e.g., ethylbenzene or cumene) which exhibit improved yield of the mono-alkylated aromatic compound using alkylation catalysts comprising one or more of these catalyst compositions.

Abstract: A method for forming a chip package structure is provided. The method includes removing a first portion of a substrate to form a first recess in the substrate. The method includes forming a buffer structure in the first recess. A first Young's modulus of the buffer structure is less than a second Young's modulus of the substrate. The method includes forming a first wiring structure over the buffer structure and the substrate. The method includes bonding a chip package to the first wiring structure. The chip package has an interposer substrate and a chip structure over the interposer substrate, and a first corner of the interposer substrate and a second corner of the chip structure overlap the buffer structure in a top view of the chip package and the buffer structure.

Abstract: Catalyst compositions comprising a zeolite and a mesoporous support or binder are disclosed. The mesoporous support or binder comprises a mesoporous metal oxide having a particle diameter of greater than or equal to 20 ?m at 50% of the cumulative pore size distribution (d50). Also disclosed are processes for producing a mono-alkylated aromatic compound (e.g., ethylbenzene or cumene) which exhibit improved yield of the mono-alkylated aromatic compound using alkylation catalysts comprising one or more of these catalyst compositions.

Abstract: Systems and methods are disclosed for the functional decomposition of the catalog domain and its sub-domains inside a global scale e-commerce system into respective software application services with dedicated data storage, so in order for the complex raw data of different nature or sub-domain that belongs to large catalogs to be easily accessed and read by online stores, it needs to be deciphered and derived by its domain specific computational process then materialized into appropriate real time content that can be directly obtained via software services and APIs by B2C and B2B websites instead having to utilize lots of computational power for every on line store page request to generate necessary real time content from the same raw catalog data that is administered by catalog managers. In the case of data that does not frequently change (i.e.

Abstract: The invention relates to a method of treatment comprising administering a long-acting mutant human fibroblast growth factor to a subject in need thereof. The said long-acting mutant human fibroblast growth factor is mPEG-CH2—N?H-mFGF21, wherein mFGF21 consists of SEQ ID NO:1, and the said new use consists of a method of treating non-alcoholic steatohepatitis.

Abstract: A level shifter receiving an input with a relatively narrow voltage range and provides an output with a relatively wide voltage range. The level shifter including a transistor with a turn-on voltage. Control circuitry applies a bias to the level shifter such that the transistor does not receive the turn-on voltage.

Abstract: A level shifter receiving an input with a relatively narrow voltage range and provides an output with a relatively wide voltage range. The level shifter including a transistor with a turn-on voltage. Control circuitry applies a bias to the level shifter such that the transistor does not receive the turn-on voltage.

Abstract: An automated external defibrillator (AED) with a panoramic video camera device comprises a case, an AED accommodated by the case, a microprocessor built in the AED, an image capture device electrically connected with the microprocessor, a memory electrically connected with the microprocessor and storing the images captured by the image capture device, and a panoramic lens arranged above the image capture device. During usage, the present invention takes motion pictures panoramically to provide more detailed information for the medical personnel after the patient has been transported to the hospital and ascertain the truth for a medical dispute.

Abstract: This disclosure relates to a method for rejuvenating a catalyst, comprising contacting the catalyst with a gaseous feedstock at rejuvenation conditions for at least one hour to form a rejuvenated catalyst and a gaseous product, wherein the catalyst comprises at least 10 wt. % of a molecular sieve, wherein the catalyst prior to the contacting step comprises from 0.001 wt. % to 45 wt. % of hydrocarbons and 0.001 to 10 wt.

Abstract: A mount structure includes a base and a bearer. The base has a slot, and at least one combining block is disposed protruding from the slot. The bearer has a bearing portion and a combining portion. The bearing portion is connected to a display, and the combining portion is installed in the slot through hooks, buckles, latches, screws, or other combining methods, such that the bearer is fixed on the base. Moreover, the combining portion is provided with reinforcing ribs for enhancing the structural strength of the bearer.