Abstract: A semiconductor apparatus and a method for collecting residues of curable material are provided. The semiconductor apparatus includes a chamber containing a wafer cassette, and a collecting module disposed in the chamber for collecting residues of curable material in the chamber. The collecting module includes a flow-directing structure disposed below a ceiling of the chamber, a baffle structure disposed below the flow-directing structure, and a tray disposed on the wafer cassette. The flow-directing structure includes a first hollow region, the baffle structure includes a second hollow region, and the tray is moved together with the wafer cassette to pass through the second hollow region of the baffle structure and is positioned to cover the first hollow region of the flow-directing structure.

Abstract: An organic solar cell including a substrate, an organic solar cell device, at least one hydrophobic polymer layer and at least one metal layer is provided. The hydrophobic polymer layer and the metal layer are alternately stacked on the organic solar cell device. The hydrophobic polymer layer is used to prevent moisture from entering the organic solar cell device. The metal layer is used to prevent moisture and oxygen from entering the organic solar cell device. A method for forming an organic solar cell is also disclosed in the specification.

Abstract: A method of packaging an organic electroluminescent (OEL) device is provided. In the method, a substrate comprising an OEL component formed thereon is provided first. Thereafter, a cover plate is provided. Afterward, a hydrophilic polymer serving as a desiccant between the substrate and the cover plate is formed. Then, an adhesive between the substrate and the cover plate for sealing the OEL component and the desiccant is formed. Therefore, moisture/oxygen in the package structure is absorbed and removed by the hydrophilic polymer.

Abstract: A package structure of an organic electroluminescent (OEL) device and a method of packaging thereof are provided. The package structure includes a substrate, an OEL component, a cover plate, a desiccant and an adhesive. The OEL component is disposed over the substrate. The cover plate is disposed over the substrate. The desiccant is disposed above the substrate or the cover plate. The desiccant includes, for example but not limited to, a hydrophilic polymer. The adhesive is disposed between the substrate and the cover plate, wherein the OEL component and the desiccant are sealed by the substrate, the cover plate and the adhesive. Therefore, moisture/oxygen in the package structure is absorbed and removed by the hydrophilic polymer.

Abstract: A miscible polymer blend of superior mechanical strength, hardness and abrasion or mar resistance comprising PVDF and at least one compatible aromatic polyimide. The aromatic polyimide in the miscible polymer blend acts as a nucleating agent for PVDF crystallization. The miscible polymer blend comprising PVDF and aromatic polyimide does not exhibit the negative characteristic of reduced mechanical strength encountered in PVDF and polymer alloys known in the art. The PVDF/aromatic polyimide alloy is prepared by dissolving, separately, PVDF and the aromatic polyimide in a solvent and blending the solutions to form the required composition.