Patents by Inventor Ping Wan
Ping Wan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11817407Abstract: A molded semiconductor package includes: a semiconductor die attached to a substrate, the semiconductor die having a bond pad at a first side of the semiconductor die which faces away from the substrate and an insulating layer covering the first side; an electrical conductor attached to a part of the bond pad exposed by an opening in the insulating layer; a mold compound encasing the semiconductor die; and an electrically insulative material filling the opening in the insulating layer and sealing the part of the bond pad exposed by the opening in the insulating layer. The electrically insulative material separates the mold compound from the part of the bond pad exposed by the opening in the insulating layer. A corresponding method of producing the molded semiconductor package also is described.Type: GrantFiled: May 17, 2022Date of Patent: November 14, 2023Assignee: Infineon Technologies AGInventors: Shao Ping Wan, Eric Brion Acquitan, Dexter Reynoso, Jürgen Schredl, Woon Yik Yong
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Publication number: 20230165581Abstract: The invention provides a suture device, a treatment device with the suture device and a treatment system. The treatment system includes an endoscope and the treatment system. The treatment system is used in cooperation with the endoscope and includes an operating handle and the suture device. The suture device comprises a main shell, a suture needle, a needle feeding assembly and a needle anti-backoff assembly. One end of the suture needle is connected to a suture line, and the other end is a tip. The needle feeding assembly is arranged on the main shell and forms a separable engagement relationship with the suture needle so as to control advancing of the suture needle. The needle anti-backoff assembly is arranged on the main shell and forms a separable engagement relationship with the suture needle so as to prevent the withdrawal of the suture needle.Type: ApplicationFiled: April 27, 2020Publication date: June 1, 2023Inventors: Ping WAN, Zhaoteng ZHOU, Rou WAN
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Patent number: 11444011Abstract: An embodiment of a semiconductor package includes a leadframe having leads, a mold compound partly encasing the leadframe so that the leads protrude from the mold compound, a power transistor die attached to the leadframe at a first side of the leadframe, and a driver die attached to the leadframe at a second side of the leadframe opposite the first side so that the power transistor die and the driver die are disposed in a stacked arrangement. The driver die is configured to control the power transistor die. The driver die is in direct electrical communication with the power transistor die only through the leadframe and any interconnects which attach the power transistor die and the driver die to the leadframe. Corresponding methods of manufacturing the semiconductor package are also described.Type: GrantFiled: November 12, 2020Date of Patent: September 13, 2022Assignee: Infineon Technologies AGInventors: Woon Yik Yong, Andreas Kucher, Chia-Yen Lee, Shao Ping Wan
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Publication number: 20220278060Abstract: A molded semiconductor package includes: a semiconductor die attached to a substrate, the semiconductor die having a bond pad at a first side of the semiconductor die which faces away from the substrate and an insulating layer covering the first side; an electrical conductor attached to a part of the bond pad exposed by an opening in the insulating layer; a mold compound encasing the semiconductor die; and an electrically insulative material filling the opening in the insulating layer and sealing the part of the bond pad exposed by the opening in the insulating layer. The electrically insulative material separates the mold compound from the part of the bond pad exposed by the opening in the insulating layer. A corresponding method of producing the molded semiconductor package also is described.Type: ApplicationFiled: May 17, 2022Publication date: September 1, 2022Inventors: Shao Ping Wan, Eric Brion Acquitan, Dexter Reynoso, Jürgen Schredl, Woon Yik Yong
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Publication number: 20220181280Abstract: A molded semiconductor package includes: a semiconductor die attached to a substrate, the semiconductor die having a bond pad at a first side of the semiconductor die which faces away from the substrate and an insulating layer covering the first side; an electrical conductor attached to a part of the bond pad exposed by an opening in the insulating layer; a mold compound encasing the semiconductor die; and an electrically insulative material filling the opening in the insulating layer and sealing the part of the bond pad exposed by the opening in the insulating layer. The electrically insulative material separates the mold compound from the part of the bond pad exposed by the opening in the insulating layer. A breakdown voltage of the electrically insulative material is greater than a breakdown voltage of the mold compound.Type: ApplicationFiled: December 7, 2020Publication date: June 9, 2022Inventors: Shao Ping Wan, Eric Brion Acquitan, Dexter Reynoso, Jürgen Schredl, Woon Yik Yong
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Patent number: 11355460Abstract: A molded semiconductor package includes: a semiconductor die attached to a substrate, the semiconductor die having a bond pad at a first side of the semiconductor die which faces away from the substrate and an insulating layer covering the first side; an electrical conductor attached to a part of the bond pad exposed by an opening in the insulating layer; a mold compound encasing the semiconductor die; and an electrically insulative material filling the opening in the insulating layer and sealing the part of the bond pad exposed by the opening in the insulating layer. The electrically insulative material separates the mold compound from the part of the bond pad exposed by the opening in the insulating layer. A breakdown voltage of the electrically insulative material is greater than a breakdown voltage of the mold compound.Type: GrantFiled: December 7, 2020Date of Patent: June 7, 2022Assignee: Infineon Technologies AGInventors: Shao Ping Wan, Eric Brion Acquitan, Dexter Reynoso, Jürgen Schredl, Woon Yik Yong
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Publication number: 20210066172Abstract: An embodiment of a semiconductor package includes a leadframe having leads, a mold compound partly encasing the leadframe so that the leads protrude from the mold compound, a power transistor die attached to the leadframe at a first side of the leadframe, and a driver die attached to the leadframe at a second side of the leadframe opposite the first side so that the power transistor die and the driver die are disposed in a stacked arrangement. The driver die is configured to control the power transistor die. The driver die is in direct electrical communication with the power transistor die only through the leadframe and any interconnects which attach the power transistor die and the driver die to the leadframe. Corresponding methods of manufacturing the semiconductor package are also described.Type: ApplicationFiled: November 12, 2020Publication date: March 4, 2021Inventors: Woon Yik Yong, Andreas Kucher, Chia-Yen Lee, Shao Ping Wan
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Patent number: 10872848Abstract: An embodiment of a semiconductor package includes a leadframe and a mold compound partly encasing the leadframe so that leads protrude from the mold compound and at least two die pads have a surface at a first side of the leadframe which is not covered by the mold compound. A laser module is attached to the surface of the at least two die pads which is not covered by the mold compound. A driver die is attached to the leadframe at a second side of the leadframe opposite the first side so that the laser module and the driver die are disposed in a stacked arrangement, the driver die configured to control the laser module. The driver die is in direct electrical communication with the laser module only through the leadframe and any interconnects which attach the laser module and driver die to the leadframe.Type: GrantFiled: October 25, 2018Date of Patent: December 22, 2020Assignee: Infineon Technologies AGInventors: Woon Yik Yong, Andreas Kucher, Chia-Yen Lee, Shao Ping Wan
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Publication number: 20200135626Abstract: An embodiment of a semiconductor package includes a leadframe and a mold compound partly encasing the leadframe so that leads protrude from the mold compound and at least two die pads have a surface at a first side of the leadframe which is not covered by the mold compound. A laser module is attached to the surface of the at least two die pads which is not covered by the mold compound. A driver die is attached to the leadframe at a second side of the leadframe opposite the first side so that the laser module and the driver die are disposed in a stacked arrangement, the driver die configured to control the laser module. The driver die is in direct electrical communication with the laser module only through the leadframe and any interconnects which attach the laser module and driver die to the leadframe.Type: ApplicationFiled: October 25, 2018Publication date: April 30, 2020Inventors: Woon Yik Yong, Andreas Kucher, Chia-Yen Lee, Shao Ping Wan
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Patent number: 10251854Abstract: Disclosed are an S-(carboxymethyl)-cysteine pharmaceutical compound (I), and a preparation method and use thereof. Also disclosed are an S-(carboxymethyl)-D-cysteine ammonium salt monohydrate, and use thereof in preparation of medicines for preventing and treating respiratory system diseases such as chronic obstructive pulmonary diseases, in particular in preparation of expectorants. The compounds can reduce airway resistance and production of oxides in rat COPD models, increase the level of antioxidants, and alleviate damage caused by the oxides and inflammatory mediators to lungs.Type: GrantFiled: July 5, 2013Date of Patent: April 9, 2019Assignees: Guangzhou Baiyunshan Pharmaceutical Holdings Co., Ltd., Baiyunshan Pharmaceutical General Factroy Guangzhou Institute of Respiratory DiseaseInventors: Mao Chen, Shaoxuan Zhu, Ping Wan, Wei Wang, Wei Liao, Hairong Hu, Xianglin Fu, Jin Feng, Binge Huang, Lin Zhang, Nanshan Zhong, Jinping Zheng, Hongying Mo
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Publication number: 20190029858Abstract: Provided is a covering membrane provided within a duodenum. This invention relates to a medical device placed in the digestive tract. At least a part of the duodenal internal covering membrane is prepared from a hydrophobic and oleophobic material and is biodegradable. The duodenal internal covering membrane further includes a biomimetic microarray adhesive sheet, an elastic piece, an anchor hook, and an anti-twist rib. The duodenal internal covering membrane is prepared by electrospinning and can be used to prevent and treat obesity and diabetes.Type: ApplicationFiled: December 9, 2016Publication date: January 31, 2019Inventor: Ping WAN
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Patent number: 9918862Abstract: A duodenum internal covering membrane is disclosed. The covering membrane is made of a biocompatible material and mainly comprises an elastic ampulla and a tubular part, wherein the ampulla is positioned in the duodenal bulb, the tubular part can extend to the jejunum, the ampulla contains a wavy or V-shaped or trapezoidal or city wall-shaped elastic ring which is continuously encircled, the elastic ring is made of a memory or non-memory biocompatible material, peaks, valleys and bent angles of the elastic ring are single-circle coil springs with outward anchor hooks, the single-circle coil springs on the lower edge are penetrated and wound with recovery threads, the upper edge of the ampulla is a wavy or V-shaped or trapezoidal or city wall-shaped elastic membrane, the elastic ring and the ampulla comply with the motion of the duodenum and the bulb as a whole, and the ampulla and the tubular part can be closed up or folded into the shape of a ball or cylinder or capsule or spindle.Type: GrantFiled: March 28, 2014Date of Patent: March 20, 2018Inventor: Ping Wan
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Publication number: 20170333374Abstract: Disclosed are an S-(carboxymethyl)-cysteine pharmaceutical compound (I), and a preparation method and use thereof. Also disclosed are an S-(carboxymethyl)-D-cysteine ammonium salt monohydrate, and use thereof in preparation of medicines for preventing and treating respiratory system diseases such as chronic obstructive pulmonary diseases, in particular in preparation of expectorants. The compounds can reduce airway resistance and production of oxides in rat COPD models, increase the level of antioxidants, and alleviate damage caused by the oxides and inflammatory mediators to lungs.Type: ApplicationFiled: July 5, 2013Publication date: November 23, 2017Applicants: Guangzhou Baiyunshan Pharmaceutical Holdings Co., Ltd., Baiyunshan Pharmaceutical General Factory, Guangzhou Institute of Respiratory DiseaseInventors: Mao Chen, Shaoxuan Zhu, Ping Wan, Wei Wang, Wei Liao, Hairong Hu, Xianglin Fu, Jin Feng, Binge Huang, Lin Zhang, Nanshan Zhong, Jinping Zheng, Hongying Mo
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Publication number: 20160158052Abstract: A duodenal internal covering membrane is disclosed herein. The covering membrane is made of a biocompatible biodegradable or non-biodegradable material and/or hydrophobic material and mainly comprises an elastic ampulla and a tubular portion. The ampulla contains biocompatible bionic microarray adhesive piece capable of realizing strong adhesion through a force exerting direction without pricking into an intestinal tissue and capable of being easily detached and recovered. The adhesive piece has good stability, strong adaptability to material and appearance, good self-cleaning property, no injuries and pollution to the intestinal tissue and can be adhered and detached repeatedly. The adhesive piece can realize mutual support with other parts in the functions. When contents in the intestinal duct move, because there is no traction force which is nearly perpendicular, the internal covering membrane cannot be detached.Type: ApplicationFiled: June 12, 2014Publication date: June 9, 2016Inventor: Ping WAN
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Publication number: 20160030221Abstract: A duodenum internal covering membrane is disclosed. The covering membrane is made of a biocompatible material and mainly comprises an elastic ampulla and a tubular part, wherein the ampulla is positioned in the duodenal bulb, the tubular part can extend to the jejunum, the ampulla contains a wavy or V-shaped or trapezoidal or city wall-shaped elastic ring which is continuously encircled, the elastic ring is made of a memory or non-memory biocompatible material, peaks, valleys and bent angles of the elastic ring are single-circle coil springs with outward anchor hooks, the single-circle coil springs on the lower edge are penetrated and wound with recovery threads, the upper edge of the ampulla is a wavy or V-shaped or trapezoidal or city wall-shaped elastic membrane, the elastic ring and the ampulla comply with the motion of the duodenum and the bulb as a whole, and the ampulla and the tubular part can be closed up or folded into the shape of a ball or cylinder or capsule or spindle.Type: ApplicationFiled: March 28, 2014Publication date: February 4, 2016Inventor: Ping WAN
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Publication number: 20150359750Abstract: Provided is a positioning immediate-release bioadhesive and relates to a medical device for preventing or/and treating diabetes, obesity, alcoholism, gastric and intestinal mucosal inflammation or/and ulcers and the like. The positioning immediate-release bioadhesive is prepared by preparing a biocompatible bioadhesive material into micro-particles, externally adding an immediate-release disintegrant, tabletting and then performing enteric or gastric coating; or performing enteric or gastric coating on the micro-particles; or filling into enteric-coated or gastric-coated hollow capsules; or directly tabletting the bioadhesive material, the immediate-release disintegrant and other additional agents and then performing enteric or gastric coating.Type: ApplicationFiled: January 23, 2014Publication date: December 17, 2015Inventor: Ping WAN
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Publication number: 20150230958Abstract: An internal covering membrane of duodenum can be made from biocompatible materials via electrospinning technology is described herein. After the internal covering membrane of duodenum is implanted into the duodenum, it can not only prevent food from contacting with the intestinal mucosa in anatomy, but also make no affect on the functions of intestinal mucosa cells in physiology. The internal covering membrane can be made by blending electrospinning or/and multilayer electrospinning or/and core-shell electrospinning or/and dry electrospinning, and can be used to manufacture medical devices for treating diabetes and obesity, with functions of reducing damage, preventing falling-off, avoiding removal and inhibiting bounce.Type: ApplicationFiled: August 18, 2013Publication date: August 20, 2015Inventor: Ping Wan
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Publication number: 20150018967Abstract: This invention provides a duodenum endothelium membrane made of degradable shape-memory biocompatible materials. The endothelium membrane planted in the duodenum can divide chyme and bile-pancreatic juice, avoiding direct digestion, absorption, and metabolism of gastric effluent in the duodenum. After being implanted, the endothelium membrane is stable and difficult to slip and incarcerate, and is gradually degraded through two months to five years, avoiding complicated operation and organ tissue injury when removing later, and slowing down the “rebound” effect after complete demolition of the original barrier in an instant. The endothelium membrane is prepared into the medical device free of removing and treating obesity and diabetes. The endothelium membrane can avoid the deflation of the tubular portion induced by gastrointestinal peristalsis and gap increase between the endothelium membrane of the tubular portion and inner wall of the duodenum further to avoid regurgitation of jejunum contents.Type: ApplicationFiled: April 27, 2013Publication date: January 15, 2015Inventor: Ping WAN
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Publication number: 20070122162Abstract: A method and apparatus for encoding optical power and non-payload data in an optical signal is described. The method involves producing a dither modulating signal having an amplitude of indicative of the optical power in the optical signal and having a phase representing the non-payload data, and modulating the optical signal with the dither modulating signal. The apparatus involves a waveform generator for producing an amplitude adjusted waveform having an amplitude responsive to the optical power of the optical signal and a binary phase shift keying modulator for binary phase shift keying the amplitude adjusted waveform in response to the non-payload data to produce a dither modulating signal having an amplitude indicative of the optical power in the optical signal and having a phase representing the non-payload data.Type: ApplicationFiled: December 19, 2006Publication date: May 31, 2007Applicant: NORTEL NETWORKS LIMITEDInventor: Ping WAN
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Publication number: 20060291870Abstract: Signals in an optical communications network, such as optical channels in an optical WDM network for example, are each identified by at least two low frequency dither tones with which the signal is modulated. The dither tones alternate with a predetermined periodicity to produce a cyclically repeated sequence of dither tones. A network parameter, such as a channel identifier for example, is obtained by the detection of the particular combination of dither tones in the sequence. To detect a number of network parameters a signal is modulated with a number of cyclically repeated sequences of dither tones each uniquely identifying a respective network parameter. In some implementations each dither tone in a cyclically repeated sequence of dither tones is repeated with substantially the same phase and coherent averaging is performed over a number of periods to detect dither tones on low power signals.Type: ApplicationFiled: August 29, 2006Publication date: December 28, 2006Inventors: Ping Wan, Derrick Remedios, Patrick Chimfwembe