Abstract: Provided is a functional edible oil (FEO), a preparation method therefor and use thereof. The FEO is prepared by ternary transesterification of medium-chain triglycerides (MCTs), oils rich in linoleic acid, and oils rich in linolenic acid. The fatty acid composition and distribution of the FEO were determined and optimized via comparative analysis of indexes such as melting point, and effect of improving glucose and lipid metabolism as determined by animal tests. The FEO has a mass ratio of 2.3 to 4.0 for medium chain fatty acids (MCFAs) in MCTs to long chain fatty acids (LCFAs) in the oils rich in linoleic acid, and oils rich in linolenic acid and a mass ratio of 0.5 to 1.0 for linoleic acid to linolenic acid in the LCFAs, by mass of fatty acids. The FEO is added to food products at ?18.00%.

Abstract: A method for assessing test adequacy of deep neural networks based on element decomposition is provided. The network testing is divided into black box testing and white box testing, of which key elements are decomposed and defined. Network parameters including a weight matrix and a bias vector are extracted. Importance values of neurons in individual layers of the deep neural network are calculated and clustered, and an importance value hot map of neurons in each layer is generated based on clustering results. Mutation testing, and index calculation and evaluation are performed.

Abstract: The present disclosure relates to a magnon spin valve device, a magnon sensor, a magnon field effect transistor, a magnon tunnel junction and a magnon memory. A magnon spin valve device may comprise a first ferromagnetic insulation layer, a non-magnetic conductive layer disposed on the first ferromagnetic insulation layer, and a second ferromagnetic insulation layer disposed on the non-magnetic conductive layer.

Abstract: Disclosed is a base oil for functional food oils and fats, a preparation method therefor and the use thereof. The base oil for functional food oils and fats is formed through ternary transesterification on medium-chain triglycerides, high-melting-point fat and oils rich in linolenic acid. The base oil for functional food oils and fats has a wide melting range, can significantly improve the glucose and lipid metabolism disorder, balance the essential and functional fatty acids in the body, and quickly replenish energy. Animal experiments were conducted and the fatty acid composition and distribution of the base oil were optimized and determined through comparative analysis based on evaluation indicators such as the improved effect in glucose and lipid metabolism and melting point.

Abstract: A device includes a memory array, bit line pairs, word lines, a modulation circuit and a control signal generator. The memory array has bit cells arranged in rows and columns. Each bit line pair is connected to a respective column of bit cells. Each word line is connected to a respective row of bit cells. The modulation circuit is coupled with at least one bit line pair. The control signal generator is coupled with the modulation circuit. The control signal generator includes a tracking wiring with a tracking length positively correlated with a depth distance of the word lines. The control signal generator is configured to produce a control signal, switching to a first voltage level for a first time duration in reference with the tracking length, for controlling the modulation circuit. A method of controlling aforesaid device is also disclosed.

Abstract: Embodiments of a three-dimensional (3D) memory device and a method of operating the 3D memory device are provided. The 3D memory device includes an array of 3D NAND memory cells, an array of static random-access memory (SRAM) cells, and a peripheral circuit. The array of SRAM cells and the peripheral circuit arranged at one side are bonded with the array of 3D NAND memory cells at another side to form a chip. Data is received from a host through the peripheral circuit, buffered in the array of SRAM cells, and transmitted from the array of SRAM cells to the array of 3D NAND memory cells. The data is programmed into the array of 3D NAND memory cells.

Abstract: A molded semiconductor package includes: a semiconductor die attached to a substrate, the semiconductor die having a bond pad at a first side of the semiconductor die which faces away from the substrate and an insulating layer covering the first side; an electrical conductor attached to a part of the bond pad exposed by an opening in the insulating layer; a mold compound encasing the semiconductor die; and an electrically insulative material filling the opening in the insulating layer and sealing the part of the bond pad exposed by the opening in the insulating layer. The electrically insulative material separates the mold compound from the part of the bond pad exposed by the opening in the insulating layer. A corresponding method of producing the molded semiconductor package also is described.

Abstract: The invention provides a suture device, a treatment device with the suture device and a treatment system. The treatment system includes an endoscope and the treatment system. The treatment system is used in cooperation with the endoscope and includes an operating handle and the suture device. The suture device comprises a main shell, a suture needle, a needle feeding assembly and a needle anti-backoff assembly. One end of the suture needle is connected to a suture line, and the other end is a tip. The needle feeding assembly is arranged on the main shell and forms a separable engagement relationship with the suture needle so as to control advancing of the suture needle. The needle anti-backoff assembly is arranged on the main shell and forms a separable engagement relationship with the suture needle so as to prevent the withdrawal of the suture needle.

Abstract: An embodiment of a semiconductor package includes a leadframe having leads, a mold compound partly encasing the leadframe so that the leads protrude from the mold compound, a power transistor die attached to the leadframe at a first side of the leadframe, and a driver die attached to the leadframe at a second side of the leadframe opposite the first side so that the power transistor die and the driver die are disposed in a stacked arrangement. The driver die is configured to control the power transistor die. The driver die is in direct electrical communication with the power transistor die only through the leadframe and any interconnects which attach the power transistor die and the driver die to the leadframe. Corresponding methods of manufacturing the semiconductor package are also described.

Abstract: A molded semiconductor package includes: a semiconductor die attached to a substrate, the semiconductor die having a bond pad at a first side of the semiconductor die which faces away from the substrate and an insulating layer covering the first side; an electrical conductor attached to a part of the bond pad exposed by an opening in the insulating layer; a mold compound encasing the semiconductor die; and an electrically insulative material filling the opening in the insulating layer and sealing the part of the bond pad exposed by the opening in the insulating layer. The electrically insulative material separates the mold compound from the part of the bond pad exposed by the opening in the insulating layer. A corresponding method of producing the molded semiconductor package also is described.

Abstract: A molded semiconductor package includes: a semiconductor die attached to a substrate, the semiconductor die having a bond pad at a first side of the semiconductor die which faces away from the substrate and an insulating layer covering the first side; an electrical conductor attached to a part of the bond pad exposed by an opening in the insulating layer; a mold compound encasing the semiconductor die; and an electrically insulative material filling the opening in the insulating layer and sealing the part of the bond pad exposed by the opening in the insulating layer. The electrically insulative material separates the mold compound from the part of the bond pad exposed by the opening in the insulating layer. A breakdown voltage of the electrically insulative material is greater than a breakdown voltage of the mold compound.

Abstract: A molded semiconductor package includes: a semiconductor die attached to a substrate, the semiconductor die having a bond pad at a first side of the semiconductor die which faces away from the substrate and an insulating layer covering the first side; an electrical conductor attached to a part of the bond pad exposed by an opening in the insulating layer; a mold compound encasing the semiconductor die; and an electrically insulative material filling the opening in the insulating layer and sealing the part of the bond pad exposed by the opening in the insulating layer. The electrically insulative material separates the mold compound from the part of the bond pad exposed by the opening in the insulating layer. A breakdown voltage of the electrically insulative material is greater than a breakdown voltage of the mold compound.

Abstract: An embodiment of a semiconductor package includes a leadframe having leads, a mold compound partly encasing the leadframe so that the leads protrude from the mold compound, a power transistor die attached to the leadframe at a first side of the leadframe, and a driver die attached to the leadframe at a second side of the leadframe opposite the first side so that the power transistor die and the driver die are disposed in a stacked arrangement. The driver die is configured to control the power transistor die. The driver die is in direct electrical communication with the power transistor die only through the leadframe and any interconnects which attach the power transistor die and the driver die to the leadframe. Corresponding methods of manufacturing the semiconductor package are also described.

Abstract: An embodiment of a semiconductor package includes a leadframe and a mold compound partly encasing the leadframe so that leads protrude from the mold compound and at least two die pads have a surface at a first side of the leadframe which is not covered by the mold compound. A laser module is attached to the surface of the at least two die pads which is not covered by the mold compound. A driver die is attached to the leadframe at a second side of the leadframe opposite the first side so that the laser module and the driver die are disposed in a stacked arrangement, the driver die configured to control the laser module. The driver die is in direct electrical communication with the laser module only through the leadframe and any interconnects which attach the laser module and driver die to the leadframe.

Abstract: An embodiment of a semiconductor package includes a leadframe and a mold compound partly encasing the leadframe so that leads protrude from the mold compound and at least two die pads have a surface at a first side of the leadframe which is not covered by the mold compound. A laser module is attached to the surface of the at least two die pads which is not covered by the mold compound. A driver die is attached to the leadframe at a second side of the leadframe opposite the first side so that the laser module and the driver die are disposed in a stacked arrangement, the driver die configured to control the laser module. The driver die is in direct electrical communication with the laser module only through the leadframe and any interconnects which attach the laser module and driver die to the leadframe.

Abstract: Disclosed are an S-(carboxymethyl)-cysteine pharmaceutical compound (I), and a preparation method and use thereof. Also disclosed are an S-(carboxymethyl)-D-cysteine ammonium salt monohydrate, and use thereof in preparation of medicines for preventing and treating respiratory system diseases such as chronic obstructive pulmonary diseases, in particular in preparation of expectorants. The compounds can reduce airway resistance and production of oxides in rat COPD models, increase the level of antioxidants, and alleviate damage caused by the oxides and inflammatory mediators to lungs.

Abstract: Provided is a covering membrane provided within a duodenum. This invention relates to a medical device placed in the digestive tract. At least a part of the duodenal internal covering membrane is prepared from a hydrophobic and oleophobic material and is biodegradable. The duodenal internal covering membrane further includes a biomimetic microarray adhesive sheet, an elastic piece, an anchor hook, and an anti-twist rib. The duodenal internal covering membrane is prepared by electrospinning and can be used to prevent and treat obesity and diabetes.

Abstract: A duodenum internal covering membrane is disclosed. The covering membrane is made of a biocompatible material and mainly comprises an elastic ampulla and a tubular part, wherein the ampulla is positioned in the duodenal bulb, the tubular part can extend to the jejunum, the ampulla contains a wavy or V-shaped or trapezoidal or city wall-shaped elastic ring which is continuously encircled, the elastic ring is made of a memory or non-memory biocompatible material, peaks, valleys and bent angles of the elastic ring are single-circle coil springs with outward anchor hooks, the single-circle coil springs on the lower edge are penetrated and wound with recovery threads, the upper edge of the ampulla is a wavy or V-shaped or trapezoidal or city wall-shaped elastic membrane, the elastic ring and the ampulla comply with the motion of the duodenum and the bulb as a whole, and the ampulla and the tubular part can be closed up or folded into the shape of a ball or cylinder or capsule or spindle.

Abstract: Disclosed are an S-(carboxymethyl)-cysteine pharmaceutical compound (I), and a preparation method and use thereof. Also disclosed are an S-(carboxymethyl)-D-cysteine ammonium salt monohydrate, and use thereof in preparation of medicines for preventing and treating respiratory system diseases such as chronic obstructive pulmonary diseases, in particular in preparation of expectorants. The compounds can reduce airway resistance and production of oxides in rat COPD models, increase the level of antioxidants, and alleviate damage caused by the oxides and inflammatory mediators to lungs.

Abstract: A duodenal internal covering membrane is disclosed herein. The covering membrane is made of a biocompatible biodegradable or non-biodegradable material and/or hydrophobic material and mainly comprises an elastic ampulla and a tubular portion. The ampulla contains biocompatible bionic microarray adhesive piece capable of realizing strong adhesion through a force exerting direction without pricking into an intestinal tissue and capable of being easily detached and recovered. The adhesive piece has good stability, strong adaptability to material and appearance, good self-cleaning property, no injuries and pollution to the intestinal tissue and can be adhered and detached repeatedly. The adhesive piece can realize mutual support with other parts in the functions. When contents in the intestinal duct move, because there is no traction force which is nearly perpendicular, the internal covering membrane cannot be detached.