Patents by Inventor Ping Wang

Ping Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11734809
    Abstract: Embodiments of the present disclosure provide a method and apparatus for processing an image, and relates to the field of computer vision technology. The method may include: acquiring a value to be processed, where the value to be processed is associated with an image to be processed; and processing the value to be processed by using a quality scoring model to generate a score of the image to be processed in a target scoring domain, where the score of the image to be processed in the target scoring domain is related to an image quality of the image to be processed.
    Type: Grant
    Filed: February 11, 2021
    Date of Patent: August 22, 2023
    Assignee: BEIJING BAIDU NETCOM SCIENCE AND TECHNOLOGY CO., LTD.
    Inventors: Xiang Long, Ping Wang, Zhichao Zhou, Fu Li, Dongliang He, Hao Sun
  • Patent number: 11737083
    Abstract: A user equipment device may determine whether to power down one or more components based at least on a scheduling parameter that includes an indication of cross-slot scheduling. The device may power down the one or more components prior to decoding control information during a slot for which the scheduling parameter indicates that cross-slot scheduling is in place.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: August 22, 2023
    Assignee: Apple Inc.
    Inventors: Jia Tang, Wei Zhang, Wei Zeng, Haitong Sun, Yuchul Kim, Ping Wang, Sreevalsan Vallath, Zhu Ji, Dawei Zhang
  • Publication number: 20230263067
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a cap layer adjacent to the MTJ and extended to overlap a top surface of the MTJ, a top electrode on the MTJ, a metal interconnection under the MTJ, a first inter-metal dielectric (IMD) layer around the MTJ, and a second IMD layer around the metal interconnection. Preferably, the cap layer is adjacent to the top electrode and the MTJ and on the second IMD layer and a top surface of the cap layer is higher than a top surface of the first IMD layer.
    Type: Application
    Filed: April 18, 2023
    Publication date: August 17, 2023
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Po-Kai Hsu, Hung-Yueh Chen, Yu-Ping Wang
  • Patent number: 11728178
    Abstract: An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.
    Type: Grant
    Filed: December 16, 2020
    Date of Patent: August 15, 2023
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Shu-Chi Chang, Wei-Ping Wang, Hsien-Lung Hsiao, Kaun-I Cheng
  • Publication number: 20230254768
    Abstract: Disclosed herein is an approach for improving energy efficiency of a wireless communication device by reducing power distributed to receiver chain circuits (RCCs) based on determining whether the incoming wireless data is to be received and processed by the RCCs within an upcoming time duration. A device can identify a plurality of RCCs for processing data to be received by the device from a network. The device can determine that a first RCC of the plurality of RCCs is to receive the data within a time duration and that a second RCC of the plurality of RCCs is to receive no data within the time duration. The device can cause, responsive to the determination, power to be reduced to the second RCC and not be reduced to the first RCC, within the time duration.
    Type: Application
    Filed: December 22, 2022
    Publication date: August 10, 2023
    Inventors: Ping Wang, Swaminathan Balakrishnan, Pritesh Vora, Jibu Joseph, Achaleshwar Sahai
  • Publication number: 20230250983
    Abstract: The present disclosure provides an air conditioner defrosting control method and device, and a storage medium and an air conditioner. The control method includes: setting a target discharge temperature of a compressor and an initial opening degree of a throttle device when an air conditioner performs defrosting according to an outdoor ambient temperature when the air conditioner meets a defrosting condition and enters a defrosting mode; controlling a defrosting operation of the air conditioner according to the target discharge temperature of the compressor and the initial opening degree of the throttle device; and controlling the air conditioner to exit the defrosting mode when a temperature of an outdoor heart exchanger of the air conditioner reaches a set temperature value.
    Type: Application
    Filed: March 17, 2021
    Publication date: August 10, 2023
    Inventors: Zhiqiang Li, Dandan Lyu, Jiancheng Li, Yulong Liang, Weishuang Liu, Qiuyu Zhang, Ping Wang
  • Patent number: 11721324
    Abstract: A computer-implemented method, system and computer program product for providing high quality speech recognition. A first speech-to-text model is selected to perform speech recognition of a customer's spoken words and a second speech-to-text model is selected to perform speech recognition of the agent's spoken words during a call. The combined results of the speech-to-text models used to process the customer's and agent's spoken words are then analyzed to generate a reference speech-to-text result. The customer speech data that was processed by the first speech-to-text model is reprocessed by multiple other speech-to-text models. A similarity analysis is performed on the results of these speech-to-text models with respect to the reference speech-to-text result resulting in similarity scores being assigned to these speech-to-text models.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: August 8, 2023
    Assignee: International Business Machines Corporation
    Inventors: Yuan Jin, Xi Xi Liu, Li ping Wang, Fan Xiao Xin, Zheng Ping Chu
  • Publication number: 20230247914
    Abstract: The present invention provides a semiconductor device, the semiconductor device includes a metal interconnection on a substrate, in which a top view of the metal interconnection comprises a quadrilateral; and a magnetic tunneling junction (MTJ) on the metal interconnection, in which a top view of the MTJ comprises a circular shape.
    Type: Application
    Filed: April 11, 2023
    Publication date: August 3, 2023
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Jia-Rong Wu, Rai-Min Huang, I-Fan Chang, Ya-Huei Tsai, Yu-Ping Wang
  • Publication number: 20230247915
    Abstract: The present invention provides a semiconductor device, the semiconductor device includes a metal interconnection on a substrate, in which a top view of the metal interconnection comprises a quadrilateral; and a magnetic tunneling junction (MTJ) on the metal interconnection, in which a top view of the MTJ comprises a circular shape, an area of the MTJ is smaller than an area of the metal interconnection.
    Type: Application
    Filed: April 11, 2023
    Publication date: August 3, 2023
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Jia-Rong Wu, Rai-Min Huang, I-Fan Chang, Ya-Huei Tsai, Yu-Ping Wang
  • Patent number: 11716860
    Abstract: A method for fabricating a semiconductor device includes the steps of: forming a magnetic tunneling junction (MTJ) on a substrate; forming a first inter-metal dielectric (IMD) layer around the MTJ; forming a first metal interconnection adjacent to the MTJ; forming a stop layer on the first IMD layer; removing the stop layer to form an opening; and forming a channel layer in the opening to electrically connect the MTJ and the first metal interconnection.
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: August 1, 2023
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Po-Kai Hsu, Jing-Yin Jhang, Yu-Ping Wang, Hung-Yueh Chen, Wei Chen
  • Patent number: 11715499
    Abstract: A MRAM structure, which is provided with multiple source lines between active areas, each source line has multiple branches electrically connecting with the active areas at opposite sides in alternating arrangement. Multiple word lines traverse through the active areas to form transistors. Multiple storage units are disposed between the word lines on the active areas in staggered array arrangement, and multiple bit lines electrically connect with storage units on corresponding active areas, wherein each storage cell includes one of the storage unit, two of the transistors respectively at both sides of the storage unit, and two branches of the source line.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: August 1, 2023
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Po-Kai Hsu, Hung-Yueh Chen, Kun-I Chou, Jing-Yin Jhang, Hui-Lin Wang, Yu-Ping Wang
  • Publication number: 20230240151
    Abstract: A method for fabricating a semiconductor device includes the steps of forming a magnetic tunneling junction (MTJ) on a MRAM region of a substrate, forming a first inter-metal dielectric (IMD) layer around the MTJ, forming a patterned mask on a logic region of the substrate, performing a nitridation process to transform part of the first IMD layer to a nitride layer, forming a first metal interconnection on the logic region, forming a stop layer on the first IMD layer, forming a second IMD layer on the stop layer, and forming a second metal intercom in the second IMD layer to connect to the MTJ.
    Type: Application
    Filed: March 17, 2023
    Publication date: July 27, 2023
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Si-Han Tsai, Che-Wei Chang, Po-Kai Hsu, Jing-Yin Jhang, Yu- Ping Wang, Ju-Chun Fan, Ching-Hua Hsu, Yi-Yu Lin, Hung-Yueh Chen
  • Publication number: 20230238043
    Abstract: A semiconductor structure includes a substrate having a memory device region and a logic device region, a first dielectric layer on the substrate, a plurality of memory stack structures on the first dielectric layer on the memory device region, an insulating layer conformally covering the memory stack structures and the first dielectric layer, a second dielectric layer on the insulating layer and completely filling the spaces between the memory stack structures, and a first interconnecting structure formed in the second dielectric layer on the logic device region. A top surface of the first interconnecting structure is flush with a top surface of the second dielectric layer and higher than top surfaces of the memory stack structures.
    Type: Application
    Filed: March 28, 2023
    Publication date: July 27, 2023
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Yu-Ping Wang, Chen-Yi Weng, Chin-Yang Hsieh, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Jing-Yin Jhang, Chien-Ting Lin
  • Publication number: 20230240028
    Abstract: An electronic device includes a first case, a second case, and a locking assembly. The first case includes a first fixing surface, and the first fixing surface has a locking part. The second case includes a second fixing surface and two receiving grooves, and the two receiving grooves are respectively arranged on two sides of the second fixing surface. The locking assembly includes a buckle and two elastic elements. The buckle has a hook part and fixing rods. The fixing rods are arranged on two sides of the hook part. One end of each of the fixing rods abuts against the second fixing surface and slides relative to the second fixing surface, and another end of each of the fixing rods extends into the corresponding receiving groove. The hook part is configured to buckle to the locking part.
    Type: Application
    Filed: November 15, 2022
    Publication date: July 27, 2023
    Inventors: Kun-Cheng Lee, Juei-Chi Chang, Tsung-Liang Hung, Chen-Ping Wang
  • Patent number: 11711829
    Abstract: Described embodiments provide systems and methods for adjusting an operating mode for a wireless device's communications with a network. The wireless device may determine a communication profile of an application of the wireless device with the network. The wireless device may determine a type of motion of the wireless device. The wireless device may determine an operating mode for the wireless device's communications with the network, according to the communication profile and the type of motion. The wireless device may transmit a message to the network to cause the operating mode to be configured for the wireless device's communications with the network.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: July 25, 2023
    Assignee: Meta Platforms Technologies, LLC
    Inventors: Swaminathan Balakrishnan, Achaleshwar Sahai, Ping Wang, Qi Qu, Yee Sin Chan
  • Patent number: 11706996
    Abstract: A semiconductor device includes: a substrate comprising a magnetic tunneling junction (MTJ) region and a logic region; a first MTJ on the MTJ region; a first metal interconnection on the logic region; and a cap layer extending from a sidewall of the first MTJ to a sidewall of the first metal interconnection. Preferably, the cap layer on the MTJ region and the cap layer on the logic region comprise different thicknesses.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: July 18, 2023
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Yu-Ping Wang, Chen-Yi Weng, Chin-Yang Hsieh, Si-Han Tsai, Che-Wei Chang, Jing-Yin Jhang
  • Patent number: 11701738
    Abstract: A laser welded assembly and method of making. The laser welded assembly includes a first work piece having a thickness (T1) defined between an external surface and a faying surface; a second work piece having a thickness (T2) defined between an external surface and a faying surface of the second work piece; a weld seam having a core fusion zone extending from the external surface of the first work piece through the faying interface and at least partially into the thickness (T2) of the second work piece; and a protruding fusion zone extending laterally from the core fusion zone adjacent to the external surface of the first work piece. The protruding fusion zone may be formed by post-heating or concurrently with the core fusion zone.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: July 18, 2023
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Nannan Chen, Joshua L. Solomon, Hui-Ping Wang, Zixuan Wan, Blair E. Carlson, Paulina G. Torres Guzman
  • Patent number: 11706687
    Abstract: The present invention relates to an IPv6 wireless sensor network node mobility management method based on RPL routing protocol. The present invention achieves the following: first, placing an RSSI in an ACK frame so as to detect the mobile state of a node and improve the accuracy of mobile detection; second, on the premise of compatibility with an original RPL routing protocol, improving the options for DIS and DAO in selecting the optimal parent node and updating a routing table; and finally, designing a cache method to prevent messages sent to the mobile node from being lost in the process of moving, and designing a new 6LoWPAN header so as to complete message caching.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: July 18, 2023
    Assignee: CHONGQING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS
    Inventors: Ping Wang, Chenggen Pu, Yandan Yin, Zhao Yang
  • Publication number: 20230219126
    Abstract: Systems and methods for bending a material to a target resultant bending parameter using a bend forming tool are disclosed. The systems and methods receive values for parameters of properties of the material and of a bending process to be performed by the bend forming tool, creating or retrieving a calibration curve relating input bending parameter and resultant bending parameter based on the values from a database of calibration curves, determining a first springback compensated input bending parameter based on the target resultant bending parameter using the calibration curve, inputting the first springback compensated input bending parameter to the bend forming tool, and in a first step of bending the material, bending the material to the first springback compensated input bending parameter by applying the bending process using the bend forming tool.
    Type: Application
    Filed: January 10, 2022
    Publication date: July 13, 2023
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Lu Huang, Hui-ping Wang, Bradley J. Blaski, Joshua Lee Solomon, Blair E Carlson
  • Patent number: D994258
    Type: Grant
    Filed: March 28, 2021
    Date of Patent: August 1, 2023
    Inventors: Shi Ping Wang, Wenbin Ye, Shaoming Chen