Patents by Inventor Ping-Wei Chen

Ping-Wei Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for mounting a thinned semiconductor wafer on a carrier substrate
    Patent number: 8033011
    Abstract: A method for mounting a thinned semiconductor wafer on a carrier substrate for further processing is disclosed. The method consists of a series of steps, which is based on providing a frame with a double-side tape to mount the thinned wafer on the carrier substrate. The frame is used to support the double-side tape and can be designed to fit the conventional production line for holding, picking and transferring wafers. The carrier substrate can be a sapphire substrate, a quartz substrate or other substrates that can sustain further processing, such as thermal treatments and/or chemical etchings. The method of the present invention not only prevents possible damages to the highly brittle chip after wafer thinning, but also fits the conventional production line for processing semiconductor wafers.
    Type: Grant
    Filed: August 7, 2008
    Date of Patent: October 11, 2011
    Assignee: Win Semiconductors Corp.
    Inventors: Jason Chou, Chang-Hwang Hua, Ping-Wei Chen, Sen Yang
  • Method for mounting a thinned semiconductor wafer on a carrier substrate
    Publication number: 20100035405
    Abstract: A method for mounting a thinned semiconductor wafer on a carrier substrate for further processing is disclosed. The method consists of a series of steps, which is based on providing a frame with a double-side tape to mount the thinned wafer on the carrier substrate. The frame is used to support the double-side tape and can be designed to fit the conventional production line for holding, picking and transferring wafers. The carrier substrate can be a sapphire substrate, a quartz substrate or other substrates that can sustain further processing, such as thermal treatments and/or chemical etchings. The method of the present invention not only prevents possible damages to the highly brittle chip after wafer thinning, but also fits the conventional production line for processing semiconductor wafers.
    Type: Application
    Filed: August 7, 2008
    Publication date: February 11, 2010
    Applicant: WIN Semiconductors Corp.
    Inventors: Jason Chou, Chang-Hwang Hua, Ping-Wei Chen, Sen Yang