Abstract: The present invention provides an insertion-type semiconductor device and a fabrication method thereof, including the steps of: mounting a chip on a BGA substrate and performing a packaging molding process; providing an electrical connecting board formed with a plurality of electrical terminals thereon for allowing the packaged substrate to electrically connect with the electrical terminals on the electrical connecting board via a conductive element thereof; covering a lid to form an insertion-type semiconductor device. As size of the solder pads is much smaller than the electrical terminals of the insertion-type semiconductor device, the area under the semiconductor chip can be reduced to minimize the deformable area of the semiconductor chip when being pressed in the molding process, thereby preventing damage to the semiconductor chip and also meeting the specification requirement of an insertion-type semiconductor device.