Patents by Inventor Ping-Yin Hsieh

Ping-Yin Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20200135601
    Abstract: A package structure includes a plurality of first dies, a first encapsulant, and a first redistribution structure. The first encapsulant encapsulates the first dies. The first redistribution structure is disposed on the first dies and the first encapsulant. The first redistribution structure includes a dielectric layer covering a top surface and sidewalls of the first encapsulant.
    Type: Application
    Filed: October 28, 2018
    Publication date: April 30, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ping-Yin Hsieh, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu