Patents by Inventor Ping-Yu Liang

Ping-Yu Liang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible printed circuit and liquid crystal module using the same
    Patent number: 8009260
    Abstract: A flexible printed circuit used for being disposed between a frame and a conductive casing of a liquid crystal module is provided. The frame includes a main plate and a side plate which is connected to a side of the main plate. The flexible printed circuit includes a body and a grounding portion. The body is used for being disposed on the main plate of the frame. The grounding portion extends from the body. The grounding portion is bent to a predetermined angle with respect to the body, so that the grounding portion is disposed on the side plate of the frame. The grounding portion has a metal layer contacting an inner wall of a side plate of the conductive casing. The flexible printed circuit has a hole located at the position where the grounding portion is connected the body.
    Type: Grant
    Filed: July 17, 2009
    Date of Patent: August 30, 2011
    Assignee: Wintek Coropration
    Inventors: Ming-Da Chen, Ping-Yu Liang, Chin-Liang Chen
  • FLEXIBLE PRINTED CIRCUIT AND LIQUID CRYSTAL MODULE USING THE SAME
    Publication number: 20100014016
    Abstract: A flexible printed circuit used for being disposed between a frame and a conductive casing of a liquid crystal module is provided. The frame includes a main plate and a side plate which is connected to a side of the main plate. The flexible printed circuit includes a body and a grounding portion. The body is used for being disposed on the main plate of the frame. The grounding portion extends from the body. The grounding portion is bent to a predetermined angle with respect to the body, so that the grounding portion is disposed on the side plate of the frame. The grounding portion has a metal layer contacting an inner wall of a side plate of the conductive casing. The flexible printed circuit has a hole located at the position where the grounding portion is connected the body.
    Type: Application
    Filed: July 17, 2009
    Publication date: January 21, 2010
    Applicant: WINTEK CORPORATION
    Inventors: Ming-Da Chen, Ping-Yu Liang, Chin-Liang Chen