Abstract: The present disclosure provides a wireless communication system including a first host computer, a communication dongle, a second host computer and an input device. The communication dongle is connected to the first host computer via a USB interface, connected to the second host computer via a Bluetooth interface, and connected to the input device via a RF interface. The first host computer has first application software for intercepting the operating signal(s) of the input device and transferring, via the communication dongle, to the second host computer to be executed thereby. The first application software also controls the first host computer to ignore the operating signal(s) during the operating signal(s) is being transferred to the second host computer.

Abstract: A multi-chip package includes a first IC chip; a first sealing layer at a same first horizontal level as the first IC chip; a first silicon-oxide-containing layer over the first IC chip and first sealing layer and across an edge of the first IC chip; a first bonding pad in a first opening in the first silicon-oxide-containing layer, wherein the first bonding pad has a copper layer in the first opening; a second IC chip over the first IC chip; a second sealing layer at a same second horizontal level as the second IC chip; a second silicon-oxide-containing layer under the second IC chip and having a bottom surface bonded to and in contact with a top surface of the first silicon-oxide-containing layer; a second bonding pad under the second IC chip, in a second opening in the second silicon-oxide-containing layer and coupling to the second IC chip, wherein the second bonding pad has a copper layer in the second opening and having a bottom surface bonded to and in contact with a top surface of the copper layer of

Abstract: A digital compute-in-memory (DCIM) macro includes a memory cell array and an arithmetic logic unit (ALU). The memory cell array stores weight data of a neural network. The ALU receives parallel bits of a same input channel in an activation input, and generates a convolution computation output of the parallel bits and target weight data in the memory cell array.

Abstract: A digital compute-in-memory (DCIM) system includes a first DCIM macro. The first DCIM macro includes a first memory cell array and a first arithmetic logic unit (ALU). The first memory cell array has N rows that are configured to store weight data of a neural network in a single weight data download session, wherein N is a positive integer not smaller than two. The first ALU is configured to receive a first activation input, and perform convolution operations upon the first activation input and a single row of weight data selected from the N rows of the first memory cell array to generate first convolution outputs.

Abstract: A semiconductor structure includes a circuit substrate, a semiconductor die, and a cover. The semiconductor die is disposed on the circuit substrate. The cover is disposed over the semiconductor die and over the circuit substrate. The cover comprises a lid portion and a support portion. The structure includes a first adhesive bonding the support portion to the circuit substrate and a second adhesive bonding the support portion and the lid portion.

Abstract: The present disclosure provides a wireless communication system including a first host computer, a communication dongle, a second host computer and an input device. The communication dongle is connected to the first host computer via a USB interface, connected to the second host computer via a Bluetooth interface, and connected to the input device via a RF interface. The first host computer has first application software for intercepting the operating signal(s) of the input device and transferring, via the communication dongle, to the second host computer to be executed thereby. The first application software also controls the first host computer to ignore the operating signal(s) during the operating signal(s) is being transferred to the second host computer.

Abstract: A plating apparatus for electroplating a wafer includes a housing defining a plating chamber for housing a plating solution. A voltage source of the apparatus has a first terminal having a first polarity and a second terminal having a second polarity different than the first polarity. The first terminal is electrically coupled to the wafer. An anode is within the plating chamber, and the second terminal is electrically coupled to the anode. A membrane support is within the plating chamber and over the anode. The membrane support defines apertures, wherein in a first zone of the membrane support a first aperture-area to surface-area ratio is a first ratio, and in a second zone of the membrane support a second aperture-area to surface-area ratio is a second ratio, different than the first ratio.

Abstract: SRAM designs based on GAA transistors are disclosed that provide flexibility for increasing channel widths of transistors at scaled IC technology nodes and relax limits on SRAM performance optimization imposed by FinFET-based SRAMs. GAA-based SRAM cells described have active region layouts with active regions shared by pull-down GAA transistors and pass-gate GAA transistors. A width of shared active regions that correspond with the pull-down GAA transistors are enlarged with respect to widths of the shared active regions that correspond with the pass-gate GAA transistors. A ratio of the widths is tuned to obtain ratios of pull-down transistor effective channel width to pass-gate effective channel width greater than 1, increase an on-current of pull-down GAA transistors relative to an on-current of pass-gate GAA transistors, decrease a threshold voltage of pull-down GAA transistors relative to a threshold voltage of pass-gate GAA transistors, and/or increases a ? ratio of an SRAM cell.

Abstract: A bond structure is provided. The bond structure includes a seed layer and a conductive structure. The conductive structure includes a via portion over the seed layer and a plurality of wires protruding from the via portion.

Abstract: A control system for a light emitting device is provided. The control system includes a control circuit, a common transmission line and a drive circuit string. The control circuit includes a control terminal. The drive circuit string includes N number of drive circuits, where N?2. The drive circuit string is electrically connected to the control terminal of the control circuit through the common transmission line. Each of the drive circuits has a state setting. The state setting is in a transmission state when a setting of an assigned address of the drive circuit is completed. The control terminal transmits a command signal to each of the drive circuits via the common transmission line. The drive circuits read a command data piece or command data pieces within the command signal based on the assigned address.

Abstract: A control system for a light emitting device includes N number of drive circuits that are connected in series, N number of transmission lines, a common transmission line, a control line electrically connected to the N number of transmission lines and the common transmission line, and a control circuit electrically connected to the control line for outputting a command signal, where N?2. The command signal is configured for address setting, brightness control or data fetch. The N number of transmission lines are electrically connected to the N number of drive circuits, respectively. Each of the N number of drive circuits has a state setting operable to switch between a transmission state and a non-transmission state. When the state setting of every single one of the N number of drive circuits is in the transmission state, the N number of drive circuits form a pass-through signal transmission path.

Abstract: A power line communication driver circuit drives a power communication line with a power line communication signal that supplies both power and control data to a plurality of electronic devices. The power line communication driver circuit includes a ramp generator that receives an input signal encoding digital data and generates a ramp signal that switches between a low non-zero ramp voltage and a high ramp voltage to encode the digital data. The power line communication driver circuit furthermore includes a buffer circuit that receives and buffers the ramp signal to generate the power line communication signal. In one application, the power line communication driver circuit may drive a group of zone integrated circuits that include driver circuits for driving respective LED zones of a display device.

Abstract: Embodiments relate to a display device that includes a control circuit, an array of light emitting diode (LED) zones, and an array of zone integrated circuits that are distributed in the display area. The zone integrated circuits may comprise integrated LED and driver circuits with embedded sensors or the zone integrated circuits may comprise dedicated sensor devices. The zone integrated circuits are arranged in groups that are coupled to a shared single wire communication line. The control circuit provides control signals that control the driver circuits to drive the LED zones and may provide commands to request feedback data from the zone integrated circuits. Responsive to the commands, the zone integrated circuits output feedback data that is provided to the control circuit via the shared single wire communication line.

Abstract: Embodiments relate to a display device that includes a control circuit, an array of light emitting diode (LED) zones, and an array of zone integrated circuits that are distributed in the display area. The zone integrated circuits may comprise integrated LED and driver circuits with embedded sensors or the zone integrated circuits may comprise dedicated sensor devices. The zone integrated circuits are arranged in groups that are coupled to a shared single wire communication line. The control circuit provides control signals that control the driver circuits to drive the LED zones and may provide commands to request feedback data from the zone integrated circuits. Responsive to the commands, the zone integrated circuits output feedback data that is provided to the control circuit via the shared single wire communication line.

Abstract: A display device includes an array of driver circuits distributed in a display area for driving corresponding LED zones and an array of sensor circuits distributed in the display area for sensing conditions associated with the driver circuits or LED zones. Various communication protocols and connectivity configurations may be employed to communicate driver control signals to the driver circuits and to obtain readback data from the sensors. A control circuit adjusts operation of the display device based on sensor data obtained from the sensor.

Abstract: Embodiments relate to a display device that includes a control circuit, an array of light emitting diode (LED) zones, and an array of zone integrated circuits that are distributed in the display area. The zone integrated circuits may comprise integrated LED and driver circuits with embedded sensors or the zone integrated circuits may comprise dedicated sensor devices. The zone integrated circuits are arranged in groups that are coupled to a shared single wire communication line. The control circuit provides control signals that control the driver circuits to drive the LED zones and may provide commands to request feedback data from the zone integrated circuits. Responsive to the commands, the zone integrated circuits output feedback data that is provided to the control circuit via the shared single wire communication line.

Abstract: A display device includes an array of driver circuits distributed in a display area for driving corresponding LED zones and an array of sensor circuits distributed in the display area for sensing conditions associated with the driver circuits or LED zones. Various communication protocols and connectivity configurations may be employed to communicate driver control signals to the driver circuits and to obtain readback data from the sensors. A control circuit adjusts operation of the display device based on sensor data obtained from the sensor.

Abstract: A display device includes an array of driver circuits distributed in a display area for driving corresponding LED zones and an array of sensor circuits distributed in the display area for sensing conditions associated with the driver circuits or LED zones. Various communication protocols and connectivity configurations may be employed to communicate driver control signals to the driver circuits and to obtain readback data from the sensors. A control circuit adjusts operation of the display device based on sensor data obtained from the sensor.

Abstract: A power line communication driver circuit drives a power communication line with a power line communication signal that supplies both power and control data to a plurality of electronic devices. The power line communication driver circuit includes a ramp generator that receives an input signal encoding digital data and generates a ramp signal that switches between a low non-zero ramp voltage and a high ramp voltage to encode the digital data. The power line communication driver circuit furthermore includes a buffer circuit that receives and buffers the ramp signal to generate the power line communication signal. In one application, the power line communication driver circuit may drive a group of zone integrated circuits that include driver circuits for driving respective LED zones of a display device.

Abstract: A light sensor and a manufacturing method thereof are disclosed. The light sensor is capable of being coupled to a carry object and includes a sensing chip and a plurality of conductive connecting elements. The sensing chip includes a first surface and a second surface opposite to each other. The sensing chip also includes a sensing unit disposed between the first surface and the second surface and at least partially exposed by a window formed on the second surface. The first surface faces the carry object when the light sensor is coupled to a carry object. The conductive connecting elements are disposed on the first surface and coupled to the sensing unit in order to couple the light sensor to the carry object.