Abstract: A laser detection and ranging (LADAR) system is provided for generating a three-dimensional image of an object. The LADAR system includes a laser source configured to project a laser beam onto the object, and a photodiode detector array configured to detect a reflection of the laser beam projected onto the object. The photodiode detector array includes a back interface, a front interface positioned opposite the back interface, and a passivation region disposed between the back interface and the front interface. The back interface includes at least one window, and the front interface includes at least one active region oriented to detect a photon associated with the reflection. The at least one active region includes an absorber and a multiplier. The filter is configured to have a bandgap between an absorber bandgap and a multiplier bandgap.

Abstract: A touch-sensing liquid crystal panel and a fabrication method thereof are provided. The touch-sensing liquid crystal panel includes a color filter substrate and a transistor substrate. In the fabrication method, at first, a first glass substrate is provided. Thereafter, a sensing matrix is formed on a first surface of the first glass substrate at a baking temperature. The sensing matrix is formed from indium tin oxide (ITO), and a sheet resistance of the sensing matrix is equal to or less than 30 ohm/square. Then, color filters and a common electrode are disposed on a second surface of the first glass substrate to form a color filter substrate, wherein the second surface is opposite to the first surface. Thereafter, the transistor substrate is provided and combined with the color filter substrate. Thereafter, a slimming process is performed to slim a second glass substrate of the transistor substrate.

Abstract: In accordance with some embodiments, systems and methods for processing a semiconductor substrate are provided. The method includes loading a semiconductor substrate from a chamber to a transfer module, detecting a center and a notch of the semiconductor substrate by the transfer module, and transferring the semiconductor substrate from the transfer module to a process chamber.

Abstract: A threaded sink flange assembly for a food waste disposer includes a threaded sink flange, a sink flange nut, an upper mounting flange and a retainer. The threaded sink flange has a tubular body portion that has an externally threaded portion and a plurality of radially outwardly projecting mounting ledges with gaps therebetween. The sink flange nut is internally threaded with threaded portions interspersed with gaps, there being at least a gap corresponding to each mounting ledge. The upper mounting flange is annular having a top ring with a plurality of radially inwardly extending mounting projections. The mounting projections are received on the mounting ledges when the upper mounting flange is assembled to the threaded sink flange. A plurality of flanges extend from a bottom of an outer wall of the upper mounting flange with each flange having a radially outwardly extending inclined mounting ramp.

Abstract: A tantalum-material multilevel distillation crucible; the distillation crucible comprises a crucible body (1), an insulation plate (2), and a receiving hood (3); the insulation plate (2) is sheathed in the upper part of the crucible body (1), and the receiving cover is disposed on top of the crucible body (1) and above the insulation plate (2); the crucible body (1) is made of tantalum in a horn-shaped circular truncated cone increasing in size from top to bottom; and the insulation plate (2) is made of a high-temperature resistant refractory material with good insulation performance, characterized by: the insulation plate (2) comprises of a plurality of insulation plates that can be stacked and used (2); and a heating unit (6) provided with a plurality of pads (5) that can be stacked and used at the bottom of the crucible.

Abstract: The present invention is directed to the use of injection molding to form polymeric interlayers directly between two rigid substrates that are positioned so that after injection of the melted polymeric material and after cooling, the resulting multiple layer panel functions as a safety panel that can be used in any appropriate conventional safety glazing application. Methods of the present invention utilize a relatively low molecular weight polymer, multiple injection points, mold compression, and/or a heated substrate in order to facilitate the injection of polymer into the relatively narrow space between glazing substrates that is typically found in safety glazings.

Abstract: A light sensor and a manufacturing method thereof are disclosed. The light sensor is capable of being coupled to a carry object and includes a sensing chip and a plurality of conductive connecting elements. The sensing chip includes a first surface and a second surface opposite to each other. The sensing chip also includes a sensing unit disposed between the first surface and the second surface and at least partially exposed by a window formed on the second surface. The first surface faces the carry object when the light sensor is coupled to a carry object. The conductive connecting elements are disposed on the first surface and coupled to the sensing unit in order to couple the light sensor to the carry object.

Abstract: In accordance with some embodiments, systems and methods for processing a semiconductor substrate are provided. The method includes loading a semiconductor substrate from a chamber to a transfer module, detecting a center and a notch of the semiconductor substrate by the transfer module, and transferring the semiconductor substrate from the transfer module to a process chamber.

Abstract: An avalanche photodiode detector is provided. The avalanche photodiode detector comprises an absorber region having an absorption layer for receiving incident photons and generating charged carriers; and a multiplier region having a multiplication layer; wherein the multiplier region is on a mesa structure separate from the absorber region and is coupled to the absorber region by a bridge for transferring charged carriers between the absorber region and multiplier region.

Abstract: A touch-sensing liquid crystal panel and a fabrication method thereof are provided. The touch-sensing liquid crystal panel includes a color filter substrate, a transistor substrate, and a sensing matrix. In the fabrication method, at first, a first glass substrate is provided. Then, color filters and a common electrode are disposed on a first surface of the first glass substrate to form a color filter substrate. Thereafter, a transistor substrate is combined with the color filter substrate. Then, the glass substrates of the color filter substrate and the transistor substrate are slimed. Thereafter, a sensing layer is formed on a second surface of the first glass substrate, wherein the second surface is opposite to the first surface. Then, the sensing layer is baked to enable a sheet resistance of the sensing matrix to be equal to or less than 30 ohm/square. Thereafter, the sensing layer is patterned.

Abstract: An avalanche photodiode detector is provided. The avalanche photodiode detector comprises an absorber region having an absorption layer for receiving incident photons and generating charged carriers; and a multiplier region having a multiplication layer; wherein the multiplier region is on a mesa structure separate from the absorber region and is coupled to the absorber region by a bridge for transferring charged carriers between the absorber region and multiplier region.

Abstract: The present invention is in the field of polymer interlayers used in multiple layer glass panels, and specifically the present invention is in the field of antiblocking agents for polymer interlayers and methods of effectively incorporating such agents into interlayers.

Abstract: An electronic device and an image displaying method are disclosed. The electronic device mainly comprises a sensing module, a signal processor and a display. The sensing module catches a plurality of first images with a first frequency or a first period or catches a plurality of second images with a second frequency or a second period. The signal processor receives the second images and outputs a plurality of third images correspondingly. The display presents the first images or the third images.

Abstract: A touch panel that includes a first substrate, a touch sensing layer, a compensation pattern layer, a second substrate, and a first optical adhesive layer is provided. The touch sensing layer includes a plurality of electrode sets arranged in parallel, and each of the electrode sets includes a scan electrode and a plurality of sensing electrodes. An orthogonal projection of the touch sensing layer on the first substrate is not overlapped with an orthogonal projection of the compensation pattern layer on the first substrate. The compensation pattern layer and the touch sensing layer are located between the first substrate and the second substrate. The first optical adhesive layer is located between the first substrate and the second substrate. A touch display is also provided.

Abstract: A light sensor and a manufacturing method thereof are disclosed. The light sensor is capable of being coupled to a carry object and includes a sensing chip and a plurality of conductive connecting elements. The sensing chip includes a first surface and a second surface opposite to each other. The sensing chip also includes a sensing unit disposed between the first surface and the second surface and at least partially exposed by a window formed on the second surface. The first surface faces the carry object when the light sensor is coupled to a carry object. The conductive connecting elements are disposed on the first surface and coupled to the sensing unit in order to couple the light sensor to the carry object.

Abstract: A curved surface forming device for an adjustable segmented mold board with square rams, consisting of an upper group and a lower group of adjustable molds (4) whose height can be adjusted, and a loading mechanism. The adjustable molds (4) are arranged in the loading mechanism and at least one group of adjustable molds (4) can move up and down under the drive of the loading mechanism. The upper group and the lower group of the adjustable molds (4) are respectively provided with M×N and (M?1)×(N?1) square rams (1) capable of swinging. The upper and the lower square rams (1) are arranged in an interlaced manner in both transverse and longitudinal directions. The square rams (1) are composed of a square plate (a) and the sphere (b) with the pressure imposition surface being a plane or a curved surface. The curved surface forming device can eliminate the crumpling and deformation generated in the board punching, reduce dents and improve processing quality.

Abstract: An image-catching device is provided. The image-catching device includes a sensor exporting a first image data or a second image data, and a control module. The control module asks the image-catching device to send the first image data to an external device when the image-catching device and the external device are connected. The control module asks the sensor to output the second image data when the image-catching device and the external device are disconnected. The first and the second image data respectively include a plurality of frames. Each frame of the first image data has A pixels, while each frame of the second image data has B pixels, and A is greater than B.

Abstract: A touch-sensing liquid crystal panel and a fabrication method thereof are provided. The touch-sensing liquid crystal panel includes a color filter substrate and a transistor substrate. In the fabrication method, at first, a first glass substrate is provided. Thereafter, a sensing matrix is formed on a first surface of the first glass substrate at a baking temperature. The sensing matrix is formed from indium tin oxide (ITO), and a sheet resistance of the sensing matrix is equal to or less than 30 ohm/square. Then, color filters and a common electrode are disposed on a second surface of the first glass substrate to form a color filter substrate, wherein the second surface is opposite to the first surface. Thereafter, the transistor substrate is provided and combined with the color filter substrate. Thereafter, a slimming process is performed to slim a second glass substrate of the transistor substrate.

Abstract: A photo sensing chip and a manufacturing method thereof are disclosed. The photo sensing chip includes a silicon substrate and a plurality of photo sensors formed on the silicon substrate. The photo sensors include a first photo sensor and a second photo sensor. The first photo sensor has a first P-N junction and a first depletion region is formed at first P-N junction for receiving a first light band of an incident light to generate a first photo current. The second photo sensor has a second P-N junction and a second depletion region is formed at second P-N junction for receiving a second light band of the incident light to generate a second photo current. A first process parameter corresponds to the first depletion region and a second process parameter corresponds to the second depletion region, wherein the first process parameter and the second process parameter are different.

Abstract: A touch-sensing liquid crystal panel is provided and includes a color filter substrate and a transistor substrate. The color filter substrate includes a first substrate, a sensing array, touch-sensing circuit contact pads, and color filters. The transistor substrate includes a second substrate and pixel units. In one embodiment, the first substrate has a first edge region and a second edge region having the same width. In another embodiment, the touch-sensing circuit contact pads are disposed at the first edge region and the second edge region of the first substrate, and each conductive pattern in the sensing array is connected to the touch-sensing circuit contact pads of the first edge region and the second edge region. In another embodiment, each conductive pattern of the sensing array includes two first conductive patterns and conductive pattern rows disposed between the first conductive patterns.