Patents by Inventor Pingdong Yang

Pingdong Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adjustable headphone
    Patent number: 12177618
    Abstract: The present disclosure provides an adjustable headphone including a head band assembly and two earpieces attached to two ends of the head band assembly, respectively. The head band assembly includes first and second elongate pieces each extending over a portion of the length of the head band assembly. At least one of the first and second elongate pieces is movable along the length of the head band assembly and including a first length portion and a second length portion having a larger bending strength than the first length portion.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: December 24, 2024
    Assignee: Harman International Industries, Incorporated
    Inventors: Xianghong Xie, Jieyu Chen, Pingdong Yang
  • Adjustable headphone
    Patent number: 12143761
    Abstract: The present disclosure provides an adjustable headphone including a head band assembly and two earpieces attached to two ends of the head band assembly, respectively. The head band assembly includes first and second elongate pieces each extending over a portion of the length of the head band assembly. At least one of the first and second elongate pieces is movable along the length of the head band assembly and including a first length portion and a second length portion having a larger bending strength than the first length portion.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: November 12, 2024
    Assignee: Harman International Industries, Incorporated
    Inventors: Xianghong Xie, Jieyu Chen, Pingdong Yang
  • ADJUSTABLE HEADPHONE
    Publication number: 20230044893
    Abstract: The present disclosure provides an adjustable headphone including a head band assembly and two earpieces attached to two ends of the head band assembly, respectively. The head band assembly includes first and second elongate pieces each extending over a portion of the length of the head band assembly. At least one of the first and second elongate pieces is movable along the length of the head band assembly and including a first length portion and a second length portion having a larger bending strength than the first length portion.
    Type: Application
    Filed: January 13, 2020
    Publication date: February 9, 2023
    Applicant: HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
    Inventors: Xianghong XIE, Jieyu CHEN, Pingdong YANG
  • Earcups for a headset
    Patent number: D735161
    Type: Grant
    Filed: August 16, 2013
    Date of Patent: July 28, 2015
    Assignee: Microsoft Corporation
    Inventors: Bryan A. Sparks, Eric Joseph Wahl, Aditha M. Adams, Monika Wolf, Pingdong Yang