Patents by Inventor Pingping Lei

Pingping Lei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12293884
    Abstract: A key assembly, which includes a support plate, a flexible circuit board, a buffer block, and a pressing assembly. The support plate has a first surface and a second surface that are opposite to each other. The support plate has an accommodating portion that is recessed from the first surface to a side of the second surface, and the accommodating portion limits an accommodating groove. The flexible circuit board is superposed on the first surface, and the flexible circuit board has a through hole that is correspondingly connected to the accommodating groove. The buffer block is disposed in the accommodating groove, and passes through the through hole. The buffer block has a buffer support surface that protrudes from the flexible circuit board away from one side surface of the support plate. The pressing assembly includes a keycap, a support mechanism, and a connecting rod.
    Type: Grant
    Filed: August 19, 2022
    Date of Patent: May 6, 2025
    Assignee: HONOR DEVICE CO., LTD.
    Inventors: Huijie Xu, Haitao Li, Pingping Lei
  • Publication number: 20240371583
    Abstract: A key assembly, which includes a support plate, a flexible circuit board, a buffer block, and a pressing assembly. The support plate has a first surface and a second surface that are opposite to each other. The support plate has an accommodating portion that is recessed from the first surface to a side of the second surface, and the accommodating portion limits an accommodating groove. The flexible circuit board is superposed on the first surface, and the flexible circuit board has a through hole that is correspondingly connected to the accommodating groove. The buffer block is disposed in the accommodating groove, and passes through the through hole. The buffer block has a buffer support surface that protrudes from the flexible circuit board away from one side surface of the support plate. The pressing assembly includes a keycap, a support mechanism, and a connecting rod.
    Type: Application
    Filed: August 19, 2022
    Publication date: November 7, 2024
    Inventors: Huijie Xu, Haitao Li, Pingping Lei
  • Publication number: 20240339273
    Abstract: Embodiments of this application provide a keyboard and an electronic device, implementing press buffering and noise reduction. The keyboard includes a support plate and a plurality of keys located on one side of the support plate. Each key includes a key cap and a lifting/lowering assembly, and the lifting/lowering assembly is located between the support plate and the key cap. The lifting/lowering assembly includes a first support and a second support. The first support and the second support each include a first end and a second end. A first buffer structure is further provided on the inner surface of the key cap. When the key cap is pressed, the second end of the first support is in contact with the first buffer structure, and the second end of the second support is in contact with the first buffer structure.
    Type: Application
    Filed: April 27, 2023
    Publication date: October 10, 2024
    Inventors: Pingping Lei, Haitao LI, Kuang Li, Huijie Xu