Abstract: Semiconductor structures and methods are provided. An exemplary semiconductor structure according to the present disclosure includes a two-port static random access memory (SRAM) cell having a write port portion and a read port portion electrically coupled to the write port portion. The read port portion includes a transistor having a first source/drain feature and a second source/drain feature. The semiconductor structure also includes a first plurality of metal lines comprising a write bit line and a complementary write bit line, wherein the first plurality of metal lines are positioned at a first metal interconnect layer, wherein the first metal interconnect layer is disposed over the first source/drain feature. The semiconductor structure also includes a read bit line positioned at a second metal interconnect layer, where the second metal interconnect layer is disposed under the first source/drain feature.

Abstract: Semiconductor structures and methods are provided. An exemplary semiconductor structure according to the present disclosure includes a two-port static random access memory (SRAM) cell having a write port portion and a read port portion electrically coupled to the write port portion. The read port portion includes a transistor having a gate structure. The semiconductor structure also includes a first plurality of metal lines comprising a write bit line and a complementary write bit line are positioned at a first interconnect layer disposed over the gate structure and a read word line positioned at a second interconnect layer and electrically coupled to the gate structure, the second interconnect layer is disposed under the gate structure.

Abstract: A method for forming a semiconductor device structure includes forming nanostructures over a substrate. The method also includes forming a gate structure wrapped around the nanostructures. The method also includes forming source/drain epitaxial structures over opposite sides of the nanostructures. The method also includes forming a first interlayer dielectric structure over the source/drain epitaxial structures. The method also includes removing the first interlayer dielectric structure. The method also includes forming a recess in the source/drain epitaxial structures. The method also includes forming a silicide structure in the recess. The method also includes forming a second interlayer dielectric structure over the silicide structure.

Abstract: The present disclosure provides an IC structure that includes a semiconductor substrate having a SRAM region, an input/output and peripheral (IOP) region, and an edge region spanning tween the SRAM region and the IOP region; a STI structure formed on the semiconductor substrate and defining active regions; a SRAM cell formed within the SRAM region; and a backside dielectric layer disposed on a backside of the semiconductor substrate and landing on a bottom surface of the STI structure. The active regions are longitudinally oriented along a first direction; gates are formed on the semiconductor substrate and are evenly distributed with a pitch P along the first direction; the SRAM cell spans a first dimension Ds along the first direction; the edge region spans a second dimension De along the first direction; and a ratio De/Ds equals to 2 or is less than 2.

Abstract: An integrated circuit (IC) device has a memory region in which a plurality of memory cells is implemented. Each of the memory cells has a first dimension in a first horizontal direction. The IC device includes an edge region bordering the memory cell region in the first horizontal direction. The edge region has a second dimension in the first horizontal direction. The second dimension is less than or equal to about 4 times the first dimension. The IC device is formed by revising a first IC layout to generate a second IC layout. The second IC layout is generated by shrinking a dimension of the edge region in the first horizontal direction.

Abstract: A power management module is configured to set up a power mode of a computer system. A peripheral device having a Universal Serial Bus (USB) is connected to the computer system. The power management module includes an Operating System (OS) and a filter driver. The OS is configured to set up the power mode of the computer system, and the filter driver is configured to change the power mode of the computer system according to a packet transmitting/receiving status of the peripheral device.